# US 2014/0153208 A1 · Adhesive material for electric connection, display device using the adhesive material and method of fabricating the display device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0153208 A1 - Document ID: US20140153208A1 - Status: Published application - Kind: A1 - Application number: 14/091,552 - Filed: 2013-11-27 - Published: 2014-06-05 - Earliest claimed: 2012-11-30 - Assignees: LG Display Co., Ltd. - Applicants: LG Display Co., Ltd. - Inventors: Yeo-O YOUN; Dong-Sik PARK; Jeong-Beom PARK; Hye-Sun SONG; A-Ram SOHN - Web page: https://patentgrep.com/patent/US20140153208A1 ## CPC - C09J 9/02: Electrically-conducting adhesives - C09J 11/00: Features of adhesives not provided for in group C09J9/00, e.g. additives - C09J 133/04: Homopolymers or copolymers of esters {(C09J143/04 takes precedence)} - G02F 1/13452: {Conductors connecting driver circuitry and terminals of panels} - H05K 7/06: on insulating boards {, e.g. wiring harnesses (for printed circuits H05K1/18, H05K3/30)} - H05K 13/00: Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components - C08K 3/011: Crosslinking or vulcanising agents, e.g. accelerators - C08K 3/16: Halogen-containing compounds - C08K 7/18: inorganic - C08K 2003/0806: {Silver} - C08K 2003/387: {Borates} - C08K 2201/001: Conductive additives - H10W 72/073: {of die-attach connectors} - C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H) - G02F: OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract The present invention provides an adhesive layer for an electrical connection. The adhesive layer includes a base resin; an ionic optical-curing agent; an optical curing accelerant; and a conductive particle having a size of several to several tens nanometers, wherein the adhesive layer is cured by a UV light, and the UV light is diffused by the optical curing accelerant. ## Claims ### Claim 1 An adhesive material for an electrical connection, comprising: a base resin; an ionic optical-curing agent; an optical curing accelerant; and a conductive particle having a size of several to several tens nanometers, wherein the adhesive film is cured by a UV light, and the UV light is diffused by the optical curing accelerant. ### Claim 2 (depends on 1) The adhesive material according to claim 1, wherein the ionic optical-curing agent has a weight % of more than 0.01 and less than 10 with respect to a total amount of the adhesive material, and the optical curing accelerant has a weight % of more than 0.01 and less than 10 with respect to a total amount of the adhesive material, and wherein the conductive particle has a weight % of about 0.1 to 1 with respect to the total amount of the adhesive material, and the base resin has a weigh % of a residual amount. ### Claim 3 (depends on 2) The adhesive material according to claim 2, wherein the adhesive material is cured by a heat of about 110 to 130° C. ### Claim 4 (depends on 2) The material according to claim 2, wherein the base resin includes at least one of epoxy resin and acrylate resin, and the ionic optical-curing agent includes at least one of borate salt and iodine salt, and wherein the optical curing accelerant includes at least one of polystyrene (PS), polycarbonate (PC) and polyethyleneterephthalate (PET), and the conductive particle includes silver (Ag). ### Claim 5 (depends on 4) The material according to claim 4, wherein the epoxy resin includes naphthalene-based epoxy monomer, epoxyacrylate monomer, bisphenol-A-based epoxy monomer, bisphenol-F-based epoxy monomer, cresol-based epoxy monomer and novolak-based epoxy monomer, and the acrylate resin includes 2-ethylhexylacrylate, tridecylmethacrylate, nonylphenolethoxylate monoacrylate, beta-carboxyethyl acrylate, isobornyl acrylate, tetrahydrofurfuryl acrylate, tetrahydrofurfuryl methacrylate, 4-butylcylcohexyl acrylate, dicyclopentenyl acrylate, dicycloentenyl oxyethyl acrylate, ethoxyethyl acrylate, and ethoxylated monoacrylate. ### Claim 6 A display device, comprising: a display panel including an array substrate and a color filter substrate; a pad electrode in a non-display region of the array substrate; an adhesive layer on the pad electrode and including: a base resin; an ionic optical-curing agent; an optical curing accelerant; and a conductive particle having a size of several to several tens nanometers, and a drive IC on the adhesive layer and electrically connected to the pad electrode through the adhesive layer, wherein the adhesive layer is cured by a UV light, and the UV light is diffused by the optical curing accelerant. ### Claim 7 (depends on 6) The device according to claim 6, wherein ionic optical-curing agent has a weight % of more than 0.01 and less than 10 with respect to a total amount of the adhesive layer, the optical curing accelerant has a weight % of more than 0.01 and less than 10 with respect to a total amount of the adhesive layer, and wherein the conductive particle has a weight % of about 0.1 to 1 with respect to the total amount of the adhesive layer, and the base resin has a weigh % of a residual amount. ### Claim 8 (depends on 7) The device according to claim 7, wherein the adhesive layers is cured by a heat of about 110 to 130° C. ### Claim 9 (depends on 7) The device according to claim 7, wherein the base resin includes at least one of epoxy resin and acrylate resin, and the ionic optical-curing agent includes at least one of borate salt and iodine salt, and wherein the optical curing accelerant includes at least one of polystyrene (PS), polycarbonate (PC) and polyethyleneterephthalate (PET), and the conductive particle includes silver (Ag). ### Claim 10 (depends on 9) The device according to claim 9, wherein the epoxy resin includes naphthalene-based epoxy monomer, epoxyacrylate monomer, bisphenol-A-based epoxy monomer, bisphenol-F-based epoxy monomer, cresol-based epoxy monomer and novolak-based epoxy monomer, and the acrylate resin includes 2-ethylhexylacrylate, tridecylmethacrylate, nonylphenolethoxylate monoacrylate, beta-carboxyethyl acrylate, isobornyl acrylate, tetrahydrofurfuryl acrylate, tetrahydrofurfuryl methacrylate, 4-butylcylcohexyl acrylate, dicyclopentenyl acrylate, dicycloentenyl oxyethyl acrylate, ethoxyethyl acrylate, and ethoxylated monoacrylate. ### Claim 11 A method of fabricating a display device, comprising: forming a display panel including an array substrate and a color filter substrate, wherein a pad electrode is formed in a non-display region of the array substrate; forming an adhesive layer on the pad electrode by coating an adhesive material, the adhesive material including: a base resin; an ionic optical-curing agent; an optical curing accelerant; and a conductive particle having a size of several to several tens nanometers, disposing a drive IC on the adhesive layer; irradiating a UV light onto the adhesive layer through a rear surface of the array substrate; and pressing the drive IC toward the adhesive layer, wherein the adhesive layer is cured by a UV light, and the UV light is diffused by the optical curing accelerant, and wherein the UV light is diffused by the optical curing accelerant into a portion of the adhesive layer shielded by the pad electrode. ### Claim 12 (depends on 11) The method according to claim 11, wherein the step of pressing the drive IC toward the adhesive layer is performed at room temperature. ### Claim 13 (depends on 11) The method according to claim 11, wherein the step of pressing the drive IC toward the adhesive layer is performed with a heat of 110 to 130° C. ### Claim 14 (depends on 11) The method according to claim 11, wherein the step of pressing the drive IC toward the adhesive layer is performed at the same time as the step of irradiating the UV light or before or after the step of irradiating the UV light. ### Claim 15 (depends on 11) The method according to claim 11, wherein ionic optical-curing agent has a weight % of more than 0.01 and less than 10 with respect to a total amount of the adhesive material, the optical curing accelerant has a weight % of more than 0.01 and less than 10 with respect to a total amount of the adhesive material, and wherein the conductive particle has a weight % of about 0.1 to 1 with respect to the total amount of the adhesive material, and the base resin has a weigh % of a residual amount. ### Claim 16 (depends on 15) The method according to claim 15, wherein the adhesive layer is cured by a heat of about 110 to 130° C. ### Claim 17 (depends on 15) The method according to claim 15, wherein the base resin includes at least one of epoxy resin and acrylate resin, and the ionic optical-curing agent includes at least one of borate salt and iodine salt, and wherein the optical curing accelerant includes at least one of polystyrene (PS), polycarbonate (PC) and polyethyleneterephthalate (PET), and the conductive particle includes silver (Ag). ### Claim 18 (depends on 17) The method according to claim 17, wherein the epoxy resin includes naphthalene-based epoxy monomer, epoxyacrylate monomer, bisphenol-A-based epoxy monomer, bisphenol-F-based epoxy monomer, cresol-based epoxy monomer and novolak-based epoxy monomer, and the acrylate resin includes 2-ethylhexylacrylate, tridecylmethacrylate, nonylphenolethoxylate monoacrylate, beta-carboxyethyl acrylate, isobornyl acrylate, tetrahydrofurfuryl acrylate, tetrahydrofurfuryl methacrylate, 4-butylcylcohexyl acrylate, dicyclopentenyl acrylate, dicycloentenyl oxyethyl acrylate, ethoxyethyl acrylate, and ethoxylated monoacrylate.