# US 2014/0153205 A1 · Wiring board and method for manufacturing the same

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- Number: US 2014/0153205 A1
- Document ID: US20140153205A1
- Status: Published application
- Kind: A1
- Application number: 14/175,128
- Filed: 2014-02-07
- Published: 2014-06-05
- Earliest claimed: 2011-05-13
- Assignees: Ibiden Co., Ltd.
- Applicants: Ibiden Co., Ltd.
- Inventors: Yukinobu MIKADO; Mitsuhiro Tomikawa; Yusuke Tanaka; Toshiki Furutani
- Web page: https://patentgrep.com/patent/US20140153205A1

## CPC

- H05K 1/185: associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
- H05K 3/306: with lead-in-hole components (H05K3/32 takes precedence)
- H10W 70/09: extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs
- H10W 70/685: comprising multiple insulating layers
- H10W 72/00: Interconnections or connectors in packages
- H05K 3/4602: {characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated}
- H05K 2201/10015: Non-printed capacitor
- H05K 2201/1003: Non-printed inductor
- H05K 2201/10636: Leadless chip, e.g. chip capacitor or resistor
- H05K 2203/1469: Circuit made after mounting or encapsulation of the components
- H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40)
- H10W 70/682: {comprising holes having chips therein}
- H10W 72/874: {On different surfaces}
- H10W 72/9413: {on encapsulations}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product
- Y10T 29/49124: On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T 29/49139: by inserting component lead or terminal into base aperture
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

A wiring board includes a substrate having an opening portion, multiple electronic devices positioned in the opening portion such that the electronic devices are arrayed in the lateral direction of each of the electronic devices, and an insulation layer formed on the substrate such that the insulation layer covers the electronic devices in the opening portion of the substrate. The substrate has a wall surface defining the opening portion and formed such that the opening portion is partially partitioned and the electronic devices are kept from making contact with each other.

## Claims

### Claim 1

A wiring board, comprising:
a substrate having an opening portion;
a plurality of electronic devices positioned in the opening portion such that the electronic devices are arrayed in a lateral direction of each of the electronic devices; and
an insulation layer formed on the substrate such that the insulation layer covers the electronic devices in the opening portion of the substrate,
wherein the substrate has a wall surface defining the opening portion and configured such that the opening portion is partially partitioned and the electronic devices are kept from making contact with each other.

### Claim 2 (depends on 1)

The wiring board according to claim 1, further comprising a conductive layer formed on the insulation layer.

### Claim 3 (depends on 1)

The wiring board according to claim 1, wherein the wall surface of the substrate has a protrusion having a tip positioned between the electronic devices.

### Claim 4 (depends on 1)

The wiring board according to claim 1, wherein the wall surface of the substrate has a protrusion having an end surface which is a cut surface of the substrate.

### Claim 5 (depends on 1)

The wiring board according to claim 1, wherein the wall surface of the substrate has a protrusion having a tapered surface.

### Claim 6 (depends on 1)

The wiring board according to claim 1, wherein the wall surface of the substrate has a pair of protrusions positioned such that tips of the protrusions face each other.

### Claim 7 (depends on 1)

The wiring board according to claim 1, wherein the wall surface of the substrate has a pair of protrusions positioned such that tips of the protrusions face each other and the opening portion is partitioned into two portions having a substantially equal size.

### Claim 8 (depends on 1)

The wiring board according to claim 1, wherein the wall surface of the substrate is a cut surface of the substrate surrounding the plurality of electronic devices.

### Claim 9 (depends on 1)

The wiring board according to claim 1, wherein the wall surface of the substrate is a tapered surface of the substrate surrounding the plurality of electronic devices.

### Claim 10 (depends on 1)

The wiring board according to claim 1, wherein at least one of the electronic devices is a chip capacitor having an electrode extending from one surface of the chip capacitor to an opposite surface of the chip capacitor through a side surface of the chip capacitor connecting the one surface and opposite surface of the chip capacitor.

### Claim 11 (depends on 1)

The wiring board according to claim 1, wherein at least one of the electronic devices is an inductor.

### Claim 12 (depends on 1)

The wiring board according to claim 1, wherein the electronic devices form a gap between the wall surface of the substrate and the electronic devices in the opening portion, and the gap is filled with a resin derived from the insulation layer.

### Claim 13 (depends on 1)

The wiring board according to claim 1, further comprising a plurality of external connection terminals formed directly over the electronic devices.

### Claim 14 (depends on 1)

The wiring board according to claim 1, further comprising:
a conductive layer formed on the insulation layer; and
a plurality of via conductors formed in a plurality of via holes formed in the insulation layer,
wherein the conductive layer are connected to electrodes of the electronic devices through the via conductors.

### Claim 15 (depends on 1)

The wiring board according to claim 1, wherein the substrate is an insulative substrate having a built-in metal sheet.

### Claim 16

A method for manufacturing a wiring board, comprising:
forming in a substrate an opening portion which accommodates a plurality of electronic device and which is defined by a wall surface configured such that the opening portion is partially partitioned and the electronic devices are kept from making contact with each other;
positioning a plurality of electronic devices in the opening portion such that the electronic devices are kept from making contact with each other by the wall surface and that the electronic devices are arrayed in a lateral direction of each of the electronic devices; and
forming an insulation layer on the substrate such that the insulation layer covers the electronic devices in the opening portion of the substrate.

### Claim 17 (depends on 16)

The method for manufacturing a wiring board according to claim 16, further comprising forming a conductive layer on the insulation layer.

### Claim 18 (depends on 16)

The method for manufacturing a wiring board according to claim 16, wherein the forming of the opening portion comprises cutting the substrate such that the wall surface having a protrusion partially partitioning the opening portion is formed.

### Claim 19 (depends on 16)

The method for manufacturing a wiring board according to claim 16, wherein the forming of the opening portion comprises cutting the substrate such that the wall surface having a pair of protrusions having tips facing each other and partially partitioning the opening portion is formed.

### Claim 20 (depends on 16)

The method for manufacturing a wiring board according to claim 16, further comprising filling a resin derived from the insulation layer into a space formed between the wall surface of the substrate and the electronic devices in the opening portion of the substrate.

### Claim 21 (depends on 16)

The method for manufacturing a wiring board according to claim 16, further comprising:
forming a plurality of via holes in the insulation layer;
forming a conductive layer on the insulation layer; and
forming a plurality of via conductors in the plurality of via holes, respectively, such that the conductive layer is connected to electrodes of the electronic devices in the opening portion through the via conductors.