# US 2014/0153204 A1 · Electronic component embedded printing circuit board and method for manufacturing the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0153204 A1 - Document ID: US20140153204A1 - Status: Published application - Kind: A1 - Application number: 13/776,612 - Filed: 2013-02-25 - Published: 2014-06-05 - Earliest claimed: 2012-11-30 - Assignees: Samsung Electro-Mechanics Co., Ltd. - Applicants: Samsung Electro-Mechanics Co., Ltd. - Inventors: Moon Il Kim; Yong Soon Jang; Byoung Hwa Lee; Hyun Kyung Park; Soon Jin Cho - Web page: https://patentgrep.com/patent/US20140153204A1 ## CPC - H05K 3/321: by conductive adhesives - H05K 1/185: associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards - H05K 3/4602: {characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated} - H05K 2201/10015: Non-printed capacitor - H05K 2201/10636: Leadless chip, e.g. chip capacitor or resistor - H05K 2203/0191: Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste - H05K 2203/1469: Circuit made after mounting or encapsulation of the components - H10W 72/9413: {on encapsulations} - H10W 74/019: {using temporary auxiliary substrates (H10W74/017 takes precedence)} - Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product - Y10T 29/49139: by inserting component lead or terminal into base aperture - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract The present invention relates to an electronic component embedded printed circuit board and a method for manufacturing the same. An electronic component embedded printed circuit board of the present invention includes a core having a cavity; an electronic component inserted in the cavity and having a bonding coating layer on an outer peripheral surface; insulating layers laminated on and under the core and in contact with the bonding coating layer; and circuit patterns provided on the insulating layers. ## Claims ### Claim 1 An electronic component embedded printed circuit board comprising: a core having a cavity; an electronic component inserted in the cavity and having a bonding coating layer on an outer peripheral surface; insulating layers laminated on and under the core and in contact with the bonding coating layer; and circuit patterns provided on the insulating layers. ### Claim 2 (depends on 1) The electronic component embedded printed circuit board according to claim 1, wherein the electronic component is an MLCC comprising external electrodes provided on both sides and a main body provided between the external electrodes. ### Claim 3 (depends on 2) The electronic component embedded printed circuit board according to claim 2, wherein the bonding coating layer is formed over the entire surface along the external electrodes and the main body. ### Claim 4 (depends on 2) The electronic component embedded printed circuit board according to claim 2, wherein the bonding coating layer is formed on a surface of the main body except the external electrodes. ### Claim 5 (depends on 1) The electronic component embedded printed circuit board according to claim 1, wherein the bonding coating layer comprises a coupling agent interposed between different kinds of materials to reinforce a bonding force. ### Claim 6 (depends on 5) The electronic component embedded printed circuit board according to claim 5, wherein the coupling agent comprises silane containing silicon (Si) atoms and organic functional groups. ### Claim 7 (depends on 6) The electronic component embedded printed circuit board according to claim 6, wherein the silane comprises at least one selected from the group consisting of amino silane, epoxy silane, and vinyl silane. ### Claim 8 (depends on 5) The electronic component embedded printed circuit board according to claim 5, wherein the silane is used by being mixed with ethanol. ### Claim 9 (depends on 1) The electronic component embedded printed circuit board according to claim 1, further comprising: a via formed inside the insulating layer to electrically connect the circuit pattern and the external electrode. ### Claim 10 (depends on 1) The electronic component embedded printed circuit board according to claim 1, wherein the insulating layer fills a space between the cavity and the electronic component. ### Claim 11 (depends on 2) The electronic component embedded printed circuit board according to claim 2, wherein circuit layers of a predetermined pattern are formed on upper and lower surfaces of the core to be electrically connected through a through hole. ### Claim 12 A method for manufacturing an electronic component embedded printed circuit board, comprising: forming a through hole-shaped cavity in a core and attaching a carrier to a lower surface of the core; inserting an electronic component having a bonding coating layer on an outer peripheral surface in the cavity; forming an upper insulating layer on the core in which the electronic component is embedded; removing the carrier attached to the lower surface of the core; forming a lower insulating layer on an opposite surface of the core on which the upper insulating layer is formed; and forming circuit patterns on the upper and lower insulating layers to be electrically connected to the electronic component through a via. ### Claim 13 (depends on 12) The method for manufacturing an electronic component embedded printed circuit board according to claim 12, further comprising, before inserting the electronic component in the cavity, applying an adhesive member on an upper surface of the carrier. ### Claim 14 (depends on 12) The method for manufacturing an electronic component embedded printed circuit board according to claim 12, further comprising, before inserting the electronic component in the cavity, forming the bonding coating layer on the outer peripheral surface of the electronic component. ### Claim 15 (depends on 14) The method for manufacturing an electronic component embedded printed circuit board according to claim 14, wherein the bonding coating layer is formed only on a surface of a main body between external electrodes provided on both sides of the electronic component. ### Claim 16 (depends on 14) The method for manufacturing an electronic component embedded printed circuit board according to claim 14, wherein the bonding coating layer is formed to surround the outer peripheral surface including the external electrodes provided on the both sides of the electronic component and the surface of the main body. ### Claim 17 (depends on 12) The method for manufacturing an electronic component embedded printed circuit board according to claim 12, wherein the bonding coating layer comprises silane containing silicon atoms and organic functional groups. ### Claim 18 (depends on 15) The method for manufacturing an electronic component embedded printed circuit board according to claim 15, wherein the bonding coating layer is formed only on the surface of the main body by dipping the electronic component in a silane solution before the formation of the external electrodes. ### Claim 19 (depends on 16) The method for manufacturing an electronic component embedded printed circuit board according to claim 16, wherein the bonding coating layer is formed on the entire outer peripheral surface including the main body and the external electrodes by forming the external electrodes and dipping the electronic component in a silane solution. ### Claim 20 A method for manufacturing an electronic component embedded printed circuit board, comprising: forming a through hole-shaped cavity in a core and attaching a carrier to a lower surface of the core; inserting an electronic component in the cavity; forming a bonding coating layer on the electronic component inserted in the cavity; forming an upper insulating layer on the core in which the electronic component is embedded in the cavity; removing the carrier attached to the lower surface of the core; forming the bonding coating layer on a surface of the electronic component exposed on the cavity of the core, where the bonding coating layer is not formed; forming a lower insulating layer on an opposite surface of the core on which the upper insulating layer is formed; and forming circuit patterns on the upper and lower insulating layers to be electrically connected to the electronic component through a via. ### Claim 21 (depends on 20) The method for manufacturing an electronic component embedded printed circuit board according to claim 20, wherein in forming the bonding coating layer on the electronic component, the bonding coating layer is formed by liquid application using one of spraying, printing, and dispensing. ### Claim 22 (depends on 20) The method for manufacturing an electronic component embedded printed circuit board according to claim 20, wherein the bonding coating layer comprises silane containing silicon atoms and organic functional groups. ### Claim 23 (depends on 21) The method for manufacturing an electronic component embedded printed circuit board according to claim 21, wherein in forming the bonding coating layer on the electronic component, the bonding coating layer is applied on an upper surface of a main body of the electronic component or applied on an upper surface and a side surface of an external electrode including the upper surface of the main body of the electronic component by adjustment of the amount of spraying of a silane solution. ### Claim 24 (depends on 20) The method for manufacturing an electronic component embedded printed circuit board according to claim 20, wherein in forming the bonding coating layer on the surface of the electronic component where the bonding coating layer is not formed, the bonding coating layer is formed by liquid application using one of spraying, printing, and dispensing.