# US 2014/0153201 A1 · Low profile memory module

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 2014/0153201 A1
- Document ID: US20140153201A1
- Status: Published application
- Kind: A1
- Application number: 14/094,605
- Filed: 2013-12-02
- Published: 2014-06-05
- Earliest claimed: 2012-12-01
- Assignees: Kingston Technology Corporation
- Inventors: MARK KUANYU CHENG; MARK BURLINGTON; HENRY HAI DANG NGUYEN
- Web page: https://patentgrep.com/patent/US20140153201A1

## CPC

- H05K 1/141: {One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters (H05K1/142 and H05K1/147 take precedence)}
- H01R 12/716: {Coupling device provided on the PCB}
- H05K 2201/10159: Memory
- H05K 2201/10189: Non-printed connector
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H01R: ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS

## Abstract

An electronic component module according to an embodiment of the present invention includes a printed circuit board including a low-profile plug and at least one memory component thereon, and a connector for connecting the printed circuit board to a motherboard, the connector being mateable with the plug on the printed circuit board and having a z-height of no more than about 1.5 mm. The low-profile plug includes one hundred seventy pins and the number of pins allocated for VSS is no more than twenty-two and the number of pins allocated for VDD is no more than sixteen. Further, the low-profile plug includes an insulative portion protruding from a surface of the printed circuit board and having a “”-like or inverted “”-like profile in its center. The connector includes two sub-connectors, and an insulative portion having a “”-like or inverted “m”-like profile in the center.

## Claims

### Claim 1

A module comprising:
a printed circuit board including a plug and at least one memory component thereon; and
a connector for connecting the printed circuit board to a motherboard, the connector being mateable with the plug on the printed circuit board and having a z-height of no more than about 1.5 mm.

### Claim 2 (depends on 1)

The module of claim 1, wherein the plug includes pins and the number of pins allocated for VSS is no more than twenty-two and the number of pins allocated for VDD is no more than sixteen.

### Claim 3 (depends on 1)

The module of claim 1, wherein the plug includes an insulative portion protruding from a surface of the printed circuit board and having a “”-like or inverted “”-like profile in its center.

### Claim 4 (depends on 1)

The module of claim 1, wherein each of the connector and the plug has one hundred seventy pins, respectively.

### Claim 5 (depends on 4)

The module of claim 4, wherein each of the pins of the plug includes a hook portion.

### Claim 6 (depends on 4)

The module of claim 4, wherein the pitch of the pins of the plug is about 0.5 mm.

### Claim 7 (depends on 1)

The module of claim 1, wherein the connector includes two sub-connectors, each of the two sub-connectors has 85 pins.

### Claim 8 (depends on 7)

The module of claim 7, wherein each of the 85 pins is a cantilever pin.

### Claim 9 (depends on 7)

The module of claim 7, wherein each of the 85 pins includes a hook portion.

### Claim 10 (depends on 1)

The module of claim 1, wherein the thickness of the printed circuit board is no more than about 3.7 mm maximum.

### Claim 11

A MicroDIMM comprising:
a printed circuit board;
a plug on the printed circuit board; and
at least one memory component on the printed circuit board,
wherein the plug has a z-height less than 1.5 mm.

### Claim 12 (depends on 11)

The MicroDIMM of claim 11, wherein the plug includes pins and the number of pins allocated for VSS is no more than twenty-two and the number of pins allocated for VDD is no more than sixteen.

### Claim 13 (depends on 11)

The MicroDIMM of claim 11, wherein the plug includes an insulative portion protruding from a surface of the printed circuit board and having a “”-like or inverted “”-like profile in its center.

### Claim 14 (depends on 11)

The MicroDIMM of claim 11, wherein the plug has one hundred seventy pins.

### Claim 15 (depends on 14)

The MicroDIMM of claim 14, wherein each of the pins of the plug includes a hook portion.

### Claim 16 (depends on 14)

The MicroDIMM of claim 14, wherein the pitch of the pins of the plug is about 0.5 mm.

### Claim 17

A connector for providing connection between a printed circuit board and a motherboard, comprising:
a z-height of no more than about 1.5 mm; and
one hundred seventy pins,
wherein each of the pins includes a hook portion.

### Claim 18 (depends on 17)

The connector of claim 17, wherein the connector includes two sub-connectors, each of the two sub-connectors has 85 pins.

### Claim 19 (depends on 17)

The connector of claim 17, wherein the number of pins allocated for VSS is no more than twenty-two and the number of pins allocated for VDD is no more than sixteen.

### Claim 20 (depends on 17)

The connector of claim 17, wherein the connector includes an insulative portion having a “”-like or inverted “m”-like profile in the center.