# US 2014/0153196 A1 · Mounting structure of chip component and electronic module using the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0153196 A1 - Document ID: US20140153196A1 - Status: Published application - Kind: A1 - Application number: 14/091,056 - Filed: 2013-11-26 - Published: 2014-06-05 - Earliest claimed: 2012-11-30 - Assignees: TDK Corporation - Applicants: TDK Corporation - Inventors: Shuichi Takizawa; Kenichi Kawabata - Web page: https://patentgrep.com/patent/US20140153196A1 ## CPC - H05K 1/181: associated with surface mounted components - H05K 3/284: {for encapsulating mounted components (H05K1/185 takes precedence)} - H05K 3/3442: {having edge contacts, e.g. leadless chip capacitors, chip carriers} - H05K 3/3452: Solder masks - H05K 2201/09118: Moulded substrate - H05K 2201/099: Coating over pads, e.g. solder resist partly over pads - Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS ## Abstract An electronic module is provided with a circuit board 2, a chip component 3 surface-mounted on the circuit board 2 and a mold member 4 that seals the chip component 3. The circuit board 2 includes a land 7 and a resist pattern 8A that partially covers the land 7. The chip component 3 has a bottom electrode 6b and a side electrode 6c. The resist pattern 8A has an overlapped portion overlapped with the bottom electrode 6b of the chip component 3 in a planar view. A portion of the mold member 4 is filled at least in a first gap D1 between the resist pattern 8A and the first solder portion 10a. ## Claims ### Claim 1 An electronic module comprising: a circuit board including a main surface, a land electrode formed on the main surface and a resist pattern having an overlapped portion that covers the land electrode; a chip component mounted on the main surface of the circuit board, the chip component including a bottom electrode substantially parallel to the main surface of the circuit board and a side electrode substantially perpendicular to the main surface of the circuit board; a solder electrically connecting the bottom and side electrodes of the chip component to the land electrode of the circuit board, the solder including a first solder portion adhered to the side electrode and a second solder portion provided between the bottom electrode and the land electrode; and a mold member formed on the main surface of the circuit board so as to seal the chip component, the mold member having a first portion filling a first gap between the overlapped portion and the first solder portion. ### Claim 2 (depends on 1) The electronic module as claimed in claim 1, wherein the mold member further having a second portion filling a second gap between the overlapped portion and the bottom electrode. ### Claim 3 (depends on 2) The electronic module as claimed in claim 2, wherein the chip component further includes a bottom surface having a first exposed portion being free from the bottom electrode, the main surface of the circuit board includes a second exposed portion being free from the land electrode, and the mold member further having a third portion filling a third gap between the first and second exposed portions. ### Claim 4 (depends on 1) The electronic module as claimed in claim 1, further comprising a conductive film that covers an outer surface of the mold member. ### Claim 5 (depends on 1) The electronic module as claimed in claim 1, wherein the chip component further includes a first side surface substantially perpendicular to a longitudinal direction of the chip component, the side electrode includes a first side electrode formed on the first side surface, and the first portion of the mold member is provided at least between the overlapped portion and the first solder portion adhered to the first side electrode. ### Claim 6 (depends on 5) The electronic module as claimed in claim 5, wherein the chip component further includes second and third side surfaces substantially parallel to the longitudinal direction of the chip component, the side electrode further includes a second side electrode and a third side electrode respectively formed on a second side surface and a third side surface, and the first portion of the mold member is further provided between the overlapped portion and the first solder portion adhered to the second and third side electrodes. ### Claim 7 A mounting structure of a chip component, comprising: a circuit board; a plurality of chip components surface-mounted on the circuit board; solders that electrically connect the chip components and the circuit board; and a mold member that seals the chip components, wherein the circuit board includes a wiring layer including a plurality of lands and a solder resist layer that selectively covers the wiring layer, the solder resist layer includes resist patterns that partially covers the lands, each of the chip components includes a bottom electrode parallel to a surface of the circuit board and a side electrode perpendicular to the surface of the circuit board, each of the solders electrically connects the bottom electrode and the side electrode and an exposed portion of the land, each of the resist patterns has an overlapped portion overlapped with the bottom electrode in a planar view, each of the solders has a first solder portion adhered to the side electrode and a second solder portion between the bottom electrode and the exposed portion of the land, and at least a first gap between the resist pattern and the first solder portion is the filled with the mold member. ### Claim 8 (depends on 7) The mounting structure of a chip component as claimed in claim 7, wherein a second gap between the overlapped portion of the resist pattern and the bottom electrode is further filled with the mold member. ### Claim 9 (depends on 8) The mounting structure of a chip component as claimed in claim 8, wherein a third gap between each of the chip components and the circuit board is filled with the mold member. ### Claim 10 (depends on 7) The mounting structure of a chip component as claimed in claim 7 further comprising a conductive film that covers a surface of the mold member. ### Claim 11 (depends on 7) The mounting structure of a chip component as claimed in claim 7, wherein the side electrode includes a first side electrode formed on a first side surface of the chip component, and the overlapped portion includes a first strip pattern provided along the first side electrode. ### Claim 12 (depends on 11) The mounting structure of a chip component as claimed in claim 11, wherein the side electrode further includes second and third side electrodes respectively formed on second and third side surfaces of the chip component perpendicular to the first side surface, and the overlapped portion further includes a second strip pattern provided along the second side electrode and a third strip pattern provided along the third side electrode.