# US 2014/0153193 A1 · Phase change heat sink for transient thermal management > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0153193 A1 - Document ID: US20140153193A1 - Status: Published application - Kind: A1 - Application number: 13/690,029 - Filed: 2012-11-30 - Published: 2014-06-05 - Earliest claimed: 2012-11-30 - Assignees: GE Aviation Systems LLC - Applicants: Ge Aviation Systems LLC - Inventors: Michel Engelhardt; Paul Otto Stehlik; Lawrence Joseph Hannaford, JR. - Web page: https://patentgrep.com/patent/US20140153193A1 ## CPC - F28D 15/02: in which the medium condenses and evaporates, e.g. heat pipes {(heat pipes used in solar heat collectors F24S10/95; in radiators F28D1/0226; in nuclear reactors G21C15/257)} - F28D 15/00: Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls {; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies (F28D17/00, F28D19/00, F28D20/00 take precedence)} - H05K 1/021: {Components thermally connected to metal substrates or heat-sinks by insert mounting} - H10W 40/73: for cooling by change of state - F28D: HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT (fluid heaters having heat generating means and heat transferring means F24H; furnaces F27; details of heat-exchange apparatus of general) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A heat dissipating assembly, for dissipating heat, having at least one heat producing component and a heat sink having phase change material conductively coupled to the at least one heat producing component. ## Claims ### Claim 1 A heat dissipating assembly, comprising: at least one heat producing component; and a heat sink having phase change material conductively coupled to the at least one heat producing component; wherein in the phase change material changes between at least two phases in response to a conductive transfer of heat from the heat producing component to the phase change material. ### Claim 2 (depends on 1) The heat dissipating assembly of claim 1 wherein the heat sink is in direct conductive contact with the at least one heat producing component. ### Claim 3 (depends on 2) The heat dissipating assembly of claim 2 wherein the heat sink and the at least one heat producing component have a common platform. ### Claim 4 (depends on 1) The heat dissipating assembly of claim 1 wherein the heat sink is in indirect conductive contact with the at least one heat producing component. ### Claim 5 (depends on 4) The heat dissipating assembly of claim 4 further comprising a thermal pad forming at least a portion of a conductive path from the heat producing component and the heat sink. ### Claim 6 (depends on 5) The heat dissipating assembly of claim 5 further comprising a thermal plane overlying at least a portion of the heat producing component, and the thermal pad abutting the thermal plane, with the thermal pad forming a portion of the conductive path. ### Claim 7 (depends on 6) The heat dissipating assembly of claim 6 wherein the heat sink is mounted to the thermal plane. ### Claim 8 (depends on 1) The heat dissipating assembly of claim 1 wherein the at least two phases comprise solid and liquid. ### Claim 9 (depends on 8) The heat dissipating assembly of claim 8 wherein the phase change material is one of paraffin wax and ammonia. ### Claim 10 (depends on 1) The heat dissipating assembly of claim 1 wherein the phase change material includes an additive material for high radiation heat transfer emissivity. ### Claim 11 (depends on 10) The heat dissipating assembly of claim 10 wherein the additive material is carbon black. ### Claim 12 (depends on 1) The heat dissipating assembly of claim 1 wherein the heat sink further comprises a heat conducting frame holding the phase change material. ### Claim 13 (depends on 1) The heat dissipating assembly of claim 1 wherein the at least one heat producing component is configured on a printed circuit board. ### Claim 14 A clamshell assembly for a printed circuit board (PCB) having at least one heat producing component, comprising: an upper thermal plane; a lower thermal plane spaced from the upper thermal plane to partially define a PCB chamber for holding the PCB; and a heat sink with a phase change material mounted to one of the upper thermal plane and the lower thermal plane. ### Claim 15 (depends on 14) The clamshell circuit board assembly of claim 14 wherein at least a portion of the phase change material is aligned with the at least one heat producing component. ### Claim 16 (depends on 14) The clamshell circuit board assembly of claim 14 further comprising a thermal pad in direct thermal contact with the at least one heat producing component and at least one of the heat sink and the one of the upper and lower thermal planes to which the heat sink is mounted. ### Claim 17 (depends on 14) The clamshell circuit board assembly of claim 14 wherein the thermal pad is in direct thermal contact with the one of the upper and lower thermal planes to which the heat sink is mounted. ### Claim 18 (depends on 17) The clamshell circuit board assembly of claim 17 wherein the thermal pad and the heat sink are on opposite sides of the one of the upper and lower thermal planes to which the heat sink is mounted. ### Claim 19 (depends on 14) The clamshell circuit board assembly of claim 14 wherein the heat sink comprises a first heat sink mounted to the upper thermal plane and a second heat sink mounted to the lower thermal plane. ### Claim 20 (depends on 14) The clamshell circuit board assembly of claim 14 wherein the phase change material is one of paraffin wax and ammonia. ### Claim 21 (depends on 14) The clamshell circuit board assembly of claim 14 wherein the phase change material includes an additive material for high radiation heat transfer emissivity. ### Claim 22 (depends on 14) The clamshell circuit board assembly of claim 14 wherein the heat sink further comprises a heat conducting frame holding the phase change material. ### Claim 23 (depends on 22) The clamshell circuit board assembly of claim 22 wherein the heat conducting frame is configured as a honeycomb.