# US 2014/0153172 A1 · Symmetrical hexagonal-based ball grid array pattern

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 2014/0153172 A1
- Document ID: US20140153172A1
- Status: Published application
- Kind: A1
- Application number: 13/705,747
- Filed: 2012-12-05
- Published: 2014-06-05
- Earliest claimed: 2012-12-05
- Assignees: Intel Corporation
- Inventors: Gary Brist
- Web page: https://patentgrep.com/patent/US20140153172A1

## CPC

- H05K 3/3436: {having an array of bottom contacts, e.g. pad grid array or ball grid array components}
- H10W 70/65: Shapes or dispositions of interconnections
- H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts}
- H05K 1/111: {Pads for surface mounting, e.g. lay-out}
- H05K 2201/09227: Layout details of a plurality of traces, e.g. escape layout for Ball Grid Array [BGA] mounting
- H05K 2201/10734: Ball grid array [BGA]; Bump grid array
- Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product
- Y10T 29/49155: Manufacturing circuit on or in base
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

The present disclosure provides techniques for creating a symmetrical ball grid array pattern for an integrated circuit package. The ball grid array includes a symmetrical pattern of circuit connection points, wherein the symmetrical pattern is derived from a base hexagonal pattern that is repeated in at least one or more sections of the ball grid array.

## Claims

### Claim 1

A ball grid array for an integrated circuit package, comprising:
a symmetrical pattern of circuit connection points, wherein the symmetrical pattern is derived from a base hexagonal pattern that is repeated in at least one or more sections of the ball grid array.

### Claim 2 (depends on 1)

The ball grid array of claim 1, wherein the circuit connection points are balls of solder in a ball grid array.

### Claim 3 (depends on 1)

The ball grid array of claim 1, wherein a shape of the integrated circuit package is square and the hexagonal pattern in opposite sections of the square integrated circuit package are mirror images of each other.

### Claim 4 (depends on 1)

The ball grid array of claim 1, wherein the integrated circuit package shape is square and the hexagonal patterns are oriented such that each hexagonal pattern is rotated ninety degrees when compared to a hexagonal pattern located in an adjacent section located clockwise to a first section.

### Claim 5 (depends on 1)

The ball grid array of claim 1, wherein each hexagonal pattern comprises a perimeter edge having the same spacing as a perimeter edge of each remaining hexagonal pattern.

### Claim 6 (depends on 1)

The ball grid array pattern of claim 1, wherein spaces between the hexagonal patterns are filled in with circuit connection points and wherein the circuit connection points maintain a minimum spacing from circuit connection point within the hexagonal patterns.

### Claim 7

The ball grid array of claim wherein circuit connection points located in corners of the integrated circuit packaging shape continue the hexagonal patterns in each section.

### Claim 8 (depends on 1)

The ball grid array of claim 1, wherein each corner of the section of the ball grid array comprises a solder joint reliability (SJR) pattern.

### Claim 9 (depends on 8)

The ball grid array of claim 8, wherein the SJR pattern is a pattern other than a hexagonal pattern repeated in sections of a package shape.

### Claim 10 (depends on 1)

The ball grid array of claim 1, wherein the hexagonal pattern is generated at a desired pitch (P).

### Claim 11 (depends on 1)

The ball grid array of claim 1, wherein the hexagonal pattern of circuit connection points is altered such that the circuit connection points are not within a predetermined distance to an edge of the one or more sections.

### Claim 12

A ball grid array package, comprising:
a substrate having a top surface and a bottom surface;
an array of contact pads arranged on the bottom surface of he substrate; and
a plurality of solder balls attached to the contact pads, wherein the contact pads and solder balls are arranged in a symmetrical BGA pattern derived from a standard hexagonal pattern.

### Claim 13 (depends on 12)

The ball grid array package of claim 12, wherein the ball grid array pattern comprises a package shape divided into sections, and wherein a hexagonal pattern is repeated in each section such that hexagonal patterns in directly opposing sections are mirror images of each other.

### Claim 14

A system, comprising:
a host computing system;
a printed circuit board coupled to the host computing system; and
an integrated circuit package coupled to the printed circuit board,
wherein the integrated circuit package is coupled to the printed circuit board via solder balls arranged in a ball grid array pattern and wherein the ball grid array pattern comprises a symmetrical pattern derived from a standard hexagonal pattern,

### Claim 15

A method, comprising:
placing a hexagonal pattern of circuit connection points into a selected portion of an integrated circuit package;
altering the hexagonal pattern of circuit connection points such that the circuit connection points are not within a predetermined distance to an edge of the portions; and
adding final connection points to a region of the integrated circuit package.

### Claim 16 (depends on 15)

The method of claim 15, wherein the circuit connection points are balls of solder in a ball grid array.

### Claim 17 (depends on 15)

The method of claim 15, wherein altering the hexagonal pattern of circuit connection points comprises removing circuit connection points at the corners of the integrated circuit package.

### Claim 18 (depends on 15)

The method of claim 15, wherein altering the hexagonal pattern of circuit connection points comprises removing circuit connection points from corners of the integrated circuit packaging if the circuit connection points fall within a solder joint reliability (SJR) area.

### Claim 19 (depends on 15)

The method of claim 15, wherein circuit connection points within corners of the integrated circuit packaging are arranged in a continuation of the portion of the hexagonal pattern.

### Claim 20 (depends on 15)

The method of claim 15, wherein the circuit connection points are placed in the corners of the package shape in a solder joint reliability (SJR) pattern.

### Claim 21 (depends on 15)

The method of claim 15, wherein the portion of the hexagonal pattern is positioned in each section such that hexagonal patterns placed in sections directly opposite each other are mirror images.

### Claim 22 (depends on 16)

The method of claim 16, wherein adding final connection points to a region of the integrated circuit package comprises placing circuit connection points between the portions of the hexagonal pattern.

### Claim 23 (depends on 15)

The method of claim 15, wherein adding final connection points to a region of the integrated circuit package comprises placing the circuit connection points so that a minimum spacing is maintained.