# US 2014/0153165 A1 · Glass system for hermetically joining cu components, and housing for electronic components

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- Number: US 2014/0153165 A1
- Document ID: US20140153165A1
- Status: Published application
- Kind: A1
- Application number: 14/004,063
- Filed: 2012-03-05
- Published: 2014-06-05
- Earliest claimed: 2011-03-07
- Assignees: Schott AG
- Inventors: Robert Hettler; Matthias Rindt
- Web page: https://patentgrep.com/patent/US20140153165A1

## CPC

- H05K 5/06: Hermetically-sealed casings {(specially adapted for small components H05K5/0095)}
- C03C 3/064: containing boron
- C03C 3/066: containing zinc
- C03C 8/08: containing phosphorus
- C03C 8/24: Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
- C03C 27/02: by fusing glass directly to metal
- C03C 29/00: Joining metals with the aid of glass
- H10H 20/8506: {Containers}
- H10H 20/8585: {being an interconnection}
- B32B 2457/202: LCD, i.e. liquid crystal displays
- H10W 70/682: {comprising holes having chips therein}
- H10W 72/884: {Die-attach connectors and bond wires}
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- C03C: CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

An housing for electronic components, such as LEDs and/or FETs, is provided. The housing has a base body having an upper surface that at least partially defines a mounting area for an electronic functional element, such that the base body provides a heat sink for the electronic functional element. The base body has a lower surface and a lateral surface and includes a connecting body for the electronic functional element, which is joined to the base body a glass layer formed by an alkali titanium silicate glass.

## Claims

### Claim at position 1

1-28. (canceled)

### Claim 29

An housing for accommodating an electronic functional element, comprising:
a base body made of metal and having an upper surface that at least partially defines a mounting area for the electronic functional element so that said base body forms a heat sink for the electronic functional element, the base body having a lower surface and a lateral surface; and
at least one connecting body made of metal that is joined to the base body at least by one glass layer, wherein the at least one glass layer is formed by an alkali titanium silicate glass.

### Claim 30 (depends on 29)

The housing as claimed in claim 29, wherein the base body and the at least one connecting body comprise, at least at an interface to the glass layer, a material selected from the group consisting of copper, aluminum, austenitic steel, austenitic stainless steel, and combinations thereof, and wherein the alkali titanium silicate glass has a composition in weight percent of:
SiO2
20-50,
TiO2
10-35,
R2O
10-40,
Al2O3
0-5,
CaO + SrO
0-5,
P2O5
0-5,
V2O5
0-5,
B2O3
0-5,
Sb2O3
0-1,
SnO2
0-5,
Fe2O3
<1,
CoO
<1,
NiO
<1,
ZnO
0-4,
ZrO2
0-4,
F
0-2,
MoO3
0-1,
N2O5
0-6,
and
SO3
0-1.

### Claim 31 (depends on 29)

The housing as claimed in claim 29, wherein the base body and the at least one connecting body comprise, at least at an interface to the glass layer, a material selected from the group consisting of copper, aluminum, austenitic steel, austenitic stainless steel, and combinations thereof, and wherein the alkali titanium silicate glass has a composition in weight percent of:
SiO2
26-30,
TiO2
21-25,
Na2O
14-18,
K2O
11-15,
Li2O
>0-3,
Al2O3
>1-5,
CaO
>0-1,
SrO
0-1,
P2O5
>0-3,
B2O3
>0-4,
Fe2O3
>0-2,
CoO
0-1,
NiO
0-1,
ZnO
>0-2, and
ZrO2
>0.5-2.

### Claim 32 (depends on 31)

The housing as claimed in claim 31, wherein the composition in weight percent is:
SiO2
28,
TiO2
23,
Na2O
16,
K2O
13,
Li2O
1.12,
Al2O3
3.4,
CaO
0.2,
SrO
0.02,
P2O5
1.6,
B2O3
2,
Fe2O3
0.2,
CoO
0.03,
NiO
<0.02,
ZnO
0.2, and
ZrO2
0.9.

### Claim 33 (depends on 29)

The housing as claimed in claim 29, wherein the base body and the at least one connecting body comprise, at least at an interface to the glass layer, a material selected from the group consisting of copper, aluminum, austenitic steel, austenitic stainless steel, and combinations thereof, and wherein the alkali titanium silicate glass has a composition in weight percent of:
SiO2
36-40,
TiO2
24-28,
Na2O
15-19,
K2O
10-14,
Li2O
>0-3,
Al2O3
1-6,
CaO
>0-1,
SrO
<1,
P2O5
>0-4,
B2O3
>0-2,
Fe2O3
0-2,
CoO
<1,
NiO
<1,
ZnO
<1, and
ZrO2
<1.

### Claim 34 (depends on 33)

The housing as claimed in claim 33, wherein the composition in weight percent is:
SiO2
38,
TiO2
26,
Na2O
17,
K2O
11.6,
Li2O
1.22,
Al2O3
3.7,
CaO
0.3,
P2O5
1.6,
B2O3
0.29,
Fe2O3
0.08,
NiO
<0.02, and
ZrO2
0.1.

### Claim 35 (depends on 29)

The housing as claimed in claim 29, wherein the at least one glass layer has a thickness of more than 30 μm.

### Claim 36 (depends on 29)

The housing as claimed in claim 29, wherein the at least one glass layer has a thickness a range from 30 μm to 2000 μm.

### Claim 37 (depends on 29)

The housing as claimed in claim 29, wherein the at least one glass layer is disposed in a location selected from the group consisting of between the lateral surface of the base body and the at least one connecting body, between the upper surface of the base body and the at least one connecting body, between the lower surface of the base body and the at least one connecting body, and combinations thereof.

### Claim 38 (depends on 29)

The housing as claimed in claim 29, wherein at least portions of the at least one connecting body are arranged at a location selected from the group consisting of the upper surface of the base body, at the lower surface of the base body, and combinations thereof.

### Claim 39 (depends on 38)

The housing as claimed in claim 38, wherein the at least one connecting body at least partially extends beyond the base body and forms at least one connection tab.

### Claim 40 (depends on 29)

The housing as claimed in claim 29, wherein at least portions of the at least one connecting body is arranged at the lateral side of the base body and at least partially extends along the lateral surface of the base body.

### Claim 41 (depends on 29)

The housing as claimed in claim 29, further comprising a component selected from the group consisting of an insulation applied at least to the lower surface of the base body, a sleeve disposed at the lateral side of the base body that at least partially extends around a circumferential surface of the base body, and combinations thereof.

### Claim 42 (depends on 29)

An electronic component comprising the housing as claimed in claim 29, further comprising a component arranged in the housing, the component being selected from the group consisting of: at least one radiation emitting optoelectronic functional element, at least one radiation receiving optoelectronic functional element, an LED, at least one power electronics device, a FET, and combinations thereof.

### Claim 43

An housing for accommodating an electronic functional element, comprising:
a base body made of metal and having an upper surface that at least partially defines a mounting area for the electronic functional element so that said base body forms a heat sink for the electronic functional element, the base body having a lower surface, a lateral surface, and at least one channel;
at least one connecting body made of metal arranged in the at least one channel; and
glass at least partially filling the at least one channel to join the base body to the at least one connecting body.

### Claim 44 (depends on 43)

The housing as claimed in claim 43, wherein the at least one channel is provided at a location on the base body selected from the group consisting of the lateral side, in an interior of the base body, and combinations thereof.

### Claim 45 (depends on 43)

The housing as claimed in claim 43, wherein the at least one channel is formed as a recess selected from the group consisting of a lateral recess in the base body, a non-lateral recess in the base body, and combinations thereof.

### Claim 46 (depends on 43)

The housing as claimed in claim 43, wherein the at least one channel opens to a location selected from the group consisting of the upper surface, the lower surface, the lateral surface, and combinations thereof.

### Claim 47 (depends on 43)

The housing as claimed in claim 43, wherein the at least one channel comprises a rectilinear first portion that extends along a central axis of the base body.

### Claim 48 (depends on 47)

The housing as claimed in claim 47, wherein the rectilinear first portion of the channel is provided as an opening in the base body.

### Claim 49 (depends on 47)

The housing as claimed in claim 47, wherein the at least one channel further comprises a rectilinear second portion that extends substantially transversely to the first portion, and wherein the first portion merges into the second portion.

### Claim 50 (depends on 49)

The housing as claimed in claim 49, wherein the second portion is provided as a recess in a surface of the base body selected from the group consisting of the upper surface, the lower surface, and combinations thereof.

### Claim 51 (depends on 49)

The housing as claimed in claim 49, wherein the second portion extends from the central axis towards the lateral surface.

### Claim 52 (depends on 43)

The housing as claimed in claim 43, wherein the connecting body is a contact pin.

### Claim 53 (depends on 43)

The housing as claimed in claim 43, wherein the glass is an alkali titanium silicate glass.

### Claim 54 (depends on 43)

The housing as claimed in claim 43, wherein at least the upper surface of the base body has a depression with a bottom, and the mounting area for the optoelectronic functional element is provided by the bottom of the depression.

### Claim 55 (depends on 54)

The housing as claimed in claim 54, wherein the at least one channel opens into a lateral surface of the depression.

### Claim 56 (depends on 43)

The housing as claimed in claim 43, further comprising a component selected from the group consisting of an insulation at least partially covering the lower surface of the base body, a sleeve disposed at the lateral side of the base body that at least partially extends around a circumferential surface of the base body, and combinations thereof.

### Claim 57

A method for producing an optoelectronic functional element housing, comprising:
providing at least one base body including at least one channel and having an upper surface that at least partially defines a mounting area for the optoelectronic functional element so that the base body forms a heat sink for the optoelectronic functional element;
providing at least one connecting body for the optoelectronic functional element and glass for joining the at least one connecting body to the base body within the at least one channel;
heating the glass in the at least one channel to a viscosity at which it adheres such that a composite is formed from the base body and the at least one connecting body; and
cooling the glass so that the base body and the at least one connecting body form a material bond, wherein at least portions of the at least one connecting body are embedded in the glass.