# US 2014/0153154 A1 · Multi-layered ceramic electronic component > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0153154 A1 - Document ID: US20140153154A1 - Status: Published application - Kind: A1 - Application number: 13/724,253 - Filed: 2012-12-21 - Published: 2014-06-05 - Earliest claimed: 2012-12-04 - Assignees: Samsung Electro-Mechanics Co., Ltd. - Applicants: Samsung Electro-Mechanics Co., Ltd. - Inventors: Sung Hyuk CHOI; Byung Kwon YOON; Sang Hyuk KIM - Web page: https://patentgrep.com/patent/US20140153154A1 ## CPC - H01G 4/30: Stacked capacitors (H01G4/33 takes precedence) - H01G 4/232: electrically connecting two or more layers of a stacked or rolled capacitor - H01G 4/12: Ceramic dielectrics {(H01G4/085 takes precedence)} - H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10) ## Abstract There is provided a multi-layered ceramic electronic component including: a ceramic body including a dielectric layer and having first and second main surfaces, first and second side surfaces, and first and second end surfaces; a first internal electrode having an overlapping region to form a capacitance formation part and exposed to the first and second side surfaces, and including a first lead-out part; a second internal electrode alternately multi-layered with the first internal electrode to be exposed to the first and second side surfaces, and insulated from the first internal electrode, and including the second lead-out part; first and second external electrodes; and insulation layers formed on the first and second side surfaces, the first and second lead-out parts being regions in which the first and second internal electrodes are not overlapped with each other. ## Claims ### Claim 1 A multi-layered ceramic electronic component comprising: a ceramic body including a dielectric layer and having first and second main surfaces opposing each other, first and second side surfaces opposing each other, and first and second end surfaces opposing each other; a first internal electrode having an overlapping region provided in the ceramic body so as to form a capacitance formation part and exposed to the first and second side surfaces, and including a first lead-out part extended from the capacitance part so as to be exposed to the second side surface; a second internal electrode alternately multi-layered with the first internal electrode so as to be exposed to the first and second side surfaces, having the dielectric layer therebetween, and insulated from the first internal electrode, and including the second lead-out part extended from the capacitance part so as to be exposed to the first side surface; first and second external electrodes connected to the first and second lead-out parts, respectively; and insulation layers formed on the first and second side surfaces of the ceramic body, the first and second lead-out parts being regions in which the first and second internal electrodes are not overlapped with each other. ### Claim 2 (depends on 1) The multi-layered ceramic electronic component of claim 1, wherein when a length of the ceramic body in a length direction is defined as L, and a width of a margin part corresponding to a region in which the internal electrode is not formed, in the length direction of the ceramic body is defined as Lm, 0.03≦Lm/L≦0.2 is satisfied. ### Claim 3 (depends on 1) The multi-layered ceramic electronic component of claim 1, wherein when a length of the ceramic body in the length direction is defined as L, and a length of a non-overlapping region in the length direction of the ceramic body is defined as Lc, 0.05≦Lc/L≦0.4 is satisfied. ### Claim 4 (depends on 1) The multi-layered ceramic electronic component of claim 1, wherein when a width of the ceramic body in a width direction is defined as W, and a width of a non-overlapping region in the width direction of the ceramic body is defined as Wc, 0.05≦Wc/W≦0.5 is satisfied. ### Claim 5 (depends on 1) The multi-layered ceramic electronic component of claim 1, wherein the first external electrode is extended to at least one of the first main surface, the second main surface, and the first side surface of the ceramic body. ### Claim 6 (depends on 1) The multi-layered ceramic electronic component of claim 1, wherein the second external electrode is extended to at least one of the first main surface, the second main surface, and the second side surface of the ceramic body. ### Claim 7 (depends on 1) The multi-layered ceramic electronic component of claim 1, wherein the insulation layer includes at least one selected from a group consisting of an epoxy, a heat resistant polymer, glass, and a ceramic. ### Claim 8 (depends on 1) The multi-layered ceramic electronic component of claim 1, wherein the insulation layer covers the entire exposed portions of the first and second internal electrodes. ### Claim 9 (depends on 1) The multi-layered ceramic electronic component of claim 1, wherein the insulation layer has a thickness lower than that of the second external electrode measured from the first side surface of the ceramic body and that of the first external electrode measured from the second side surface. ### Claim 10 A multi-layered ceramic electronic component comprising: a ceramic body including a dielectric layer and having first and second main surfaces opposing each other, first and second side surfaces opposing each other, and first and second end surfaces opposing each other; a first internal electrode having an overlapping region provided in the ceramic body so as to form a capacitance formation part, exposed to the first and second side surfaces, and spaced apart from the first and second end surfaces by a predetermined interval, and including a first lead-out part extended from the capacitance part so as to be exposed to the second side surface; a second internal electrode alternately multi-layered with the first internal electrode, having the dielectric layer therebetween, exposed to the first and second side surfaces, spaced apart from the first and second end surfaces by a predetermined interval, and insulated from the first internal electrode, and including a second lead-out part extended from the capacitance part so as to be exposed to the first side surface; a first external electrode connected to the first lead-out part and formed on the first main surface and the second side surface and a second external electrode connected to the second lead-out part and formed on the first main surface and the first side surface; and insulation layers formed on the first and second side surfaces of the ceramic body, the first and second lead-out parts being regions in which the first and second internal electrodes are not overlapped with each other. ### Claim 11 (depends on 10) The multi-layered ceramic electronic component of claim 10, wherein when a length of the ceramic body in a length direction is defined as L, and a width of a margin part corresponding to a region in which the internal electrode is not formed, in the length direction of the ceramic body is defined as Lm, 0.03≦Lm/L≦0.2 is satisfied. ### Claim 12 (depends on 10) The multi-layered ceramic electronic component of claim 10, wherein when a length of the ceramic body in the length direction is defined as L, and a length of a non-overlapping region in the length direction of the ceramic body is defined as Lc, 0.05≦Lc/L≦0.4 is satisfied. ### Claim 13 (depends on 10) The multi-layered ceramic electronic component of claim 10, wherein when a width of the ceramic body in a width direction is defined as W, and a width of a non-overlapping region in the width direction of the ceramic body is defined as Wc, 0.05≦Wc/W≦0.5 is satisfied. ### Claim 14 (depends on 10) The multi-layered ceramic electronic component of claim 10, wherein the insulation layer includes at least one selected from a group consisting of an epoxy, a heat resistant polymer, glass, and a ceramic. ### Claim 15 (depends on 10) The multi-layered ceramic electronic component of claim 10, wherein the insulation layer covers the entire exposed portions of the first and second internal electrodes. ### Claim 16 (depends on 10) The multi-layered ceramic electronic component of claim 10, wherein the insulation layer has a thickness lower than that of the second external electrode measured from the first side surface of the ceramic body and that of the first external electrode measured from the second side surface of the ceramic body.