# US 2014/0152965 A1 · Pico Projector System and Additional Thermal Dissipating Method Thereof > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0152965 A1 - Document ID: US20140152965A1 - Status: Published application - Kind: A1 - Application number: 13/917,763 - Filed: 2013-06-14 - Published: 2014-06-05 - Earliest claimed: 2012-11-30 - Assignees: Asia Optical International Ltd.; Sintai Optical (Shenzhen) Co., Ltd. - Applicants: Asia Optical International Ltd.; Sintai Optical (Shenzhen) Co., Ltd. - Inventors: Sen-Yung Liu - Web page: https://patentgrep.com/patent/US20140152965A1 ## CPC - G03B 21/16: Cooling; Preventing overheating - G03B 21/145: {Housing details, e.g. position adjustments thereof} - G03B: APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR (optical parts of such apparatus G02B; photosensitive materials or processes for photographic purposes G03C; apparatus for processing exposed photographic materials G03D) ## Abstract A pico projector system and an additional thermal dissipating method for the pico projector system are provided. The pico projector system includes a pico projector main body and a thermal dissipating module. The additional thermal dissipating method includes the steps of thermally dissipating the pico projector main body; externally connecting the thermal dissipating module to the pico projector main body; and thermally dissipating the pico projector main body by the thermal dissipating module. ## Claims ### Claim 1 A pico projector system, comprising: a pico projector main body; and a thermal dissipating module, detachably and externally connected to the pico projector main body and configured to thermally dissipate the pico projector main body. ### Claim 2 (depends on 1) The pico projector system as claimed in claim 1, wherein the pico projector main body comprises a metal substrate, a heat pipe and a thermal dissipating fin unit, in which the heat pipe is configured to transfer waste heat generated from the metal substrate to the thermal dissipating fin unit, and the thermal dissipating module is configured to thermally dissipate the thermal dissipating fin unit. ### Claim 3 (depends on 2) The pico projector system as claimed in claim 2, wherein the heat pipe is a straight heat pipe. ### Claim 4 (depends on 1) The pico projector system as claimed in claim 1 further comprising a support frame extended along a profile of the metal substrate, in which the support frame is contacted with the metal substrate, and the heat pipe is welded on the support frame. ### Claim 5 (depends on 4) The pico projector system as claimed in claim 4, wherein the support frame is an L-type support frame contacting the metal substrate. ### Claim 6 (depends on 1) The pico projector system as claimed in claim 1, wherein the thermal dissipating module comprises a magnet, and the pico projector main body comprises a metal part, so that the thermal dissipating module is secured on the pico projector main body when the magnet of the thermal dissipating module attracts the metal part of the pico projector main body. ### Claim 7 (depends on 1) The pico projector system as claimed in claim 1, wherein the thermal dissipating module comprises a metal part, and the pico projector main body comprises a magnet, so that the thermal dissipating module is secured on the pico projector main body when the magnet of the pico projector main body attracts the metal part of the thermal dissipating module. ### Claim 8 (depends on 1) The pico projector system as claimed in claim 1, wherein the thermal dissipating module comprises a first magnet, and the pico projector main body comprises a second magnet, so that the thermal dissipating module is secured on the pico projector main body when the first magnet of the ### Claim 9 (depends on 1) The pico projector system as claimed in claim 1, wherein the thermal dissipating module comprises a connecting port connected to the pico projector main body, so that the pico projector main body can provide the thermal dissipating module with power. ### Claim 10 (depends on 1) The pico projector system as claimed in claim 1, wherein the thermal dissipating module comprises an accommodation space allowing the pico projector main body to be tightly fitted therein. ### Claim 11 (depends on 1) The pico projector system as claimed in claim 1, wherein the thermal dissipating module comprises a groove, and the pico projector main body comprises a sliding block corresponding to the groove of the thermal dissipating module, so that the thermal dissipating module is secured on the pico projector main body when the sliding block of the pico projector main body is installed in the groove of the thermal dissipating module. ### Claim 12 (depends on 1) The pico projector system as claimed in claim 1, wherein the thermal dissipating module comprises a sliding block, and the pico projector main body comprises a groove corresponding to the sliding block of the thermal dissipating module, so that the thermal dissipating module is secured on the pico projector main body when the sliding block of the thermal dissipating module is installed in the groove of the pico projector main body. ### Claim 13 An additional thermal dissipating method for a pico projector system, comprising: thermally dissipating a pico projector main body; externally connecting a thermal dissipating module to the pico projector main body; and thermally dissipating the pico projector main body by the thermal dissipating module. ### Claim 14 (depends on 13) The additional thermal dissipating method for the pico projector system as claimed in claim 13, wherein the thermal dissipating module is connected to the pico projector main body when a consumed power of the pico projector main body is greater than a predetermined value. ### Claim 15 The additional thermal dissipating method for the pico projector system as claimed in