# US 2014/0152509 A1 · Embedding Low-K Materials in Antennas > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0152509 A1 - Document ID: US20140152509A1 - Status: Published application - Kind: A1 - Application number: 13/691,250 - Filed: 2012-11-30 - Published: 2014-06-05 - Earliest claimed: 2012-11-30 - Assignees: Taiwan Semiconductor Manufacturing Company, Ltd. - Applicants: Taiwan Semiconductor Manufacturing Company, L - Inventors: Monsen Liu; Lai Wei Chih; Chung-Hao Tsai; Jeng-Shien Hsieh; En-Hsiang Yeh; Chuei-Tang Wang - Web page: https://patentgrep.com/patent/US20140152509A1 ## CPC - H01Q 9/0407: {Substantially flat resonant element parallel to ground plane, e.g. patch antenna (dipole H01Q9/285; monopole H01Q9/40)} - H01Q 1/38: formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142)} - H10W 70/09: extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs - H10W 72/0198: {batch processes} - H10W 44/248: {for antennas} - H10W 70/099: {Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers} - H10W 72/241: {Dispositions, e.g. layouts} - H10W 72/9413: {on encapsulations} - H10W 74/019: {using temporary auxiliary substrates (H10W74/017 takes precedence)} - H10W 74/142: {the encapsulations exposing the passive side of the semiconductor body} - H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A device includes a patch antenna, which includes a feeding line, and a ground panel over the feeding line. The ground panel has an aperture therein. A low-k dielectric module is over and aligned to the aperture. A patch is over the low-k dielectric module. ## Claims ### Claim 1 A device comprising: a patch antenna comprising: a feeding line; a ground panel over the feeding line, wherein the ground panel comprises an aperture therein; a low-k dielectric module over and aligned to the aperture; and a patch over the low-k dielectric module. ### Claim 2 (depends on 1) The device of claim 1 further comprising: a molding material encircling the low-k dielectric module. ### Claim 3 (depends on 2) The device of claim 2 further comprising: a device die molded in the molding material, wherein the device die is electrically coupled to the patch antenna. ### Claim 4 (depends on 2) The device of claim 2, wherein a top surface of the molding material is substantially level with a top surface of the low-k dielectric module, and a bottom surface of the molding material is substantially level with a bottom surface of the low-k dielectric module. ### Claim 5 (depends on 2) The device of claim 2, wherein the ground panel comprises a top surface, wherein the top surface comprises: a first portion contacting a bottom surface of the low-k dielectric module; and a second portion contacting a bottom surface of the molding material. ### Claim 6 (depends on 1) The device of claim 1, wherein the low-k dielectric module has a top-view area different from a top-view area of the ground panel. ### Claim 7 (depends on 1) The device of claim 1 further comprising: an additional patch antenna comprising: an additional feeding line; an additional ground panel over the additional feeding line and comprising an additional aperture therein; an additional low-k dielectric module over and aligned to the additional aperture; and an additional patch over the additional low-k dielectric module; and a dielectric region between and separating the low-k dielectric module from the additional low-k dielectric module, wherein the dielectric region and the low-k dielectric module are formed of different materials. ### Claim 8 (depends on 1) The device of claim 1, wherein the low-k dielectric module comprises a material selected from the group consisting essentially of expended polystyrene foam, Polytetrafluoroethylene, polymethyl methacrylate, ebonite, and a porous material. ### Claim 9 A device comprising: a device die; a molding material, with the device die molded therein; and a patch antenna comprising: a patch; a ground panel, wherein the patch and the ground panel are on opposite sides of the molding material; and a feeding line electrically coupled to the device die. ### Claim 10 (depends on 9) The device of claim 9 further comprising a low-k dielectric module between the patch and the ground panel, wherein the low-k dielectric module is encircled by the molding material. ### Claim 11 (depends on 10) The device of claim 10, wherein the low-k dielectric module comprises a material selected from the group consisting essentially of Styrofoam, Teflon, Lucite, Ebonite, and a porous material. ### Claim 12 (depends on 10) The device of claim 10, wherein the patch and the ground panel are in contact with opposite surfaces of the low-k dielectric module, and wherein a surface of the device die is level with a surface of the molding material. ### Claim 13 (depends on 10) The device of claim 10, wherein the patch and feeding line are in contact with opposite surfaces of the low-k dielectric module, and wherein the feeding line and the ground panel are at a same level. ### Claim 14 (depends on 10) The device of claim 10, wherein the patch and feeding line are in contact with opposite surfaces of the low-k dielectric module, and wherein the low-k dielectric module and the ground panel are on opposite sides of the feeding line. ### Claim 15 A method comprising: placing a device die and a low-k dielectric module over a first carrier; molding the device die and the low-k dielectric module in a molding material; forming a ground panel of a patch antenna overlying the molding material; forming a feeding line of the patch antenna overlying the ground panel, wherein the feeding line is electrically coupled to the device die; and forming a patch of the patch antenna underlying the low-k dielectric module. ### Claim 16 (depends on 15) The method of claim 15, wherein the step of molding and the step of forming the ground panel comprise: applying the molding material over the device die and the low-k dielectric module, wherein the molding material is filled into a gap between the device die and the low-k dielectric module; grinding the molding material; exposing metal connectors of the device die; and forming the ground panel over the molding material and electrically coupled to the metal connectors. ### Claim 17 (depends on 15) The method of claim 15 further comprising: after forming the ground panel and forming the feeding line, detaching the first carrier from the molding material; before the step of forming the patch, attaching a second carrier, wherein the first carrier and the second carrier are attached to opposite sides of the molding material and the device die; and after forming the patch, detaching the second carrier from a package comprising the molding material. ### Claim 18 (depends on 15) The method of claim 15, wherein the steps of forming the ground panel, the feeding line, and the patch comprise plating. ### Claim 19 (depends on 15) The method of claim 15, wherein the step of placing the low-k dielectric module comprises placing a pre-formed dielectric module comprising a material selected from the group consisting essentially of Styrofoam, Teflon, Lucite, Ebonite, and a porous material. ### Claim 20 (depends on 15) The method of claim 15 further comprises, at a time the patch antenna is formed, simultaneously forming a plurality of patch antennas, wherein each of the plurality of patch antennas comprises portions on opposite sides of the molding material.