# US 2014/0152384 A1 · Transmission line for an integrated circuit package > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0152384 A1 - Document ID: US20140152384A1 - Status: Published application - Kind: A1 - Application number: 13/725,051 - Filed: 2012-12-21 - Published: 2014-06-05 - Earliest claimed: 2012-12-03 - Assignees: Broadcom Corporation - Applicants: Broadcom Corporation - Inventors: Ahmadreza Rofougaran - Web page: https://patentgrep.com/patent/US20140152384A1 ## CPC - H10W 90/00: Package configurations - H10W 44/20: at high-frequency [HF] or radio frequency [RF] - H01P 1/18: Phase-shifters (H01P1/165 takes precedence) - H01P 5/04: with variable factor of coupling - H01Q 13/06: Waveguide mouths (horns H01Q13/02) - H01Q 13/206: {Microstrip transmission line antennas} - H10W 44/206: {Wires} - H10W 44/255: {for operation at multiple different frequencies} - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H01P: WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE (operating at optical frequencies G02B) - H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72) ## Abstract Communication between chips is provided using a transmission line. Any one of the chips may tap into the transmission line, and communicate with another chip tapped into the transmission line by transmitting a radio frequency (RF) signal to the other chip via the transmission line or receiving an RF signal from the other chip via the transmission line. The transmission line may include a microstrip transmission line, a waveguide, a stripline transmission line, or another type of transmission line. The chips may use the transmission line to communicate data, control and/or clock signals with one another. ## Claims ### Claim 1 An integrated chip (IC) package, comprising: a transmission line; a first chip including a first radio frequency (RF) transceiver coupled to the transmission line; and a second chip including a second RF transceiver coupled to the transmission line; wherein the first and second RF transceivers are configured to communicate with one another by transmitting and receiving RF signals on the transmission line. ### Claim 2 (depends on 1) The IC package of claim 1, wherein the first RF transceiver is configured to transmit a first RF signal having a first frequency to the second RF transceiver, the first RF transceiver is coupled to the transmission line at a first position, the second RF transceiver is coupled to the transmission line at a second position, and the first and second positions are spaced apart on the transmission line such that a standing wave is generated between the first and second positions when the first RF transceiver transmits the first RF signal, the standing wave forming an approximate short at the first position and an approximate open at the second position. ### Claim 3 (depends on 1) The IC package of claim 1, wherein the transmission line comprises: a conductor; a ground plane; and a dielectric layer between the conductor and the ground plane. ### Claim 4 (depends on 3) The IC package of claim 3, wherein the conductor is substantially flat and runs substantially parallel to the ground plane. ### Claim 5 (depends on 3) The IC package of claim 3, wherein the transmission line is integrated on a substrate, and the first chip and the second chip are mounted on the substrate. ### Claim 6 (depends on 1) The IC package of claim 1, wherein the first chip comprises a controller, the first RF transceiver comprises a power amplifier having an adjustable output power, and the controller is configured to adjust the output power of the power amplifier based on at least one of a data rate of an RF signal to be transmitted to the second RF transceiver via the transmission line and an error rate at the second RF transceiver. ### Claim 7 (depends on 1) The IC package of claim 1, wherein the first chip comprises a controller, the first RF transceiver comprises a modulator having an adjustable modulation scheme, and the controller is configured to adjust the modulation scheme of the modulator based on at least one of a data rate of an RF signal to be transmitted to the second RF transceiver via the transmission line, and an error rate at the second RF transceiver. ### Claim 8 An integrated chip (IC) package, comprising: a transmission line; a first chip including a first radio frequency (RF) transceiver coupled to the transmission line; a second chip including a second RF transceiver coupled to the transmission line; and a third chip including a third RF transceiver coupled to the transmission line; wherein the first, second and third RF transceivers are configured to communicate with one another by transmitting and receiving RF signals on the transmission line. ### Claim 9 (depends on 8) The IC package of claim 8, wherein the first RF transceiver is configured to transmit a first RF signal having a first frequency to the second RF transceiver via the transmission line, and to transmit a second RF signal having a second frequency to the third RF transceiver via the transmission line. ### Claim 10 (depends on 8) The IC package of claim 8, wherein the first RF transceiver is configured to transmit, during a first time slot, a first RF signal to the second RF transceiver via the transmission line, and to transmit, during a second time slot, a second RF signal to the third RF transceiver via the transmission line. ### Claim 11 (depends on 8) The IC package of claim 8, wherein the first RF transceiver is configured to spread a first RF signal with a first code assigned to the second chip, to spread a second RF signal with a second code assigned to the third chip, and to transmit the first and second RF signals on the transmission line. ### Claim 12 (depends on 8) The IC package of claim 8, wherein the first RF transceiver is configured to transmit a first RF signal and a second RF signal on the transmission line, the first RF signal including a first address assigned to the second chip and the second RF signal including a second address assigned to the third chip. ### Claim 13 (depends on 8) The IC package of claim 8, wherein the transmission line comprises: a conductor; a ground plane; and a dielectric layer between the conductor and the ground plane. ### Claim 14 (depends on 13) The IC package of claim 13, wherein the conductor is substantially flat and runs substantially parallel to the ground plane. ### Claim 15 (depends on 13) The IC package of claim 13, wherein the transmission line is integrated on a substrate, and the first, second and third chips are mounted on the substrate. ### Claim 16 An integrated chip (IC) package, comprising: a transmission line; a first tap coupled to the transmission line at a first position on the transmission line; a second tap coupled to the transmission line at a second position on the transmission line, the second position being spaced apart from the first position; and a chip, wherein the chip comprises: a radio frequency (RF) transceiver; a coupling switch configured to selectively couple the RF transceiver to the first tap and the second tap; and a controller configured to control the coupling switch. ### Claim 17 (depends on 16) The IC package of claim 16, wherein the controller is configured to instruct the coupling switch to couple the RF transceiver to the first tap when the RF transceiver is to transmit a first RF signal having a first frequency on the transmission line, and to instruct the coupling switch to couple the RF transceiver to the second tap when the RF transceiver is to transmit a second RF signal having a second frequency on the transmission line. ### Claim 18 (depends on 16) The IC package of claim 16, wherein the transmission line comprises: a conductor; a ground plane; and a dielectric layer between the conductor and the ground plane. ### Claim 19 (depends on 18) The IC package of claim 18, wherein the conductor is substantially flat and runs substantially parallel to the ground plane. ### Claim 20 (depends on 18) The IC package of claim 18, wherein the first tap comprises a first interconnect bump between the chip and the conductor of the transmission line, and the second tap comprises a second interconnect bump between the chip and the conductor of the transmission line.