# US 2014/0152350 A1 · Integrated Circuits Including Magnetic Devices, And Associated Methods > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0152350 A1 - Document ID: US20140152350A1 - Status: Published application - Kind: A1 - Application number: 13/706,171 - Filed: 2012-12-05 - Published: 2014-06-05 - Earliest claimed: 2012-12-05 - Assignees: Volterra Semiconductor Corporation - Applicants: Volterra Semiconductor Corporation - Inventors: Alexandr Ikriannikov; Andrew J. Burstein; Anthony J. Stratakos - Web page: https://patentgrep.com/patent/US20140152350A1 ## CPC - H03K 17/0412: by measures taken in the control circuit - H01F 27/2804: {Printed windings} - H02M 3/158: including plural semiconductor devices as final control devices for a single load - H02M 3/1582: {Buck-boost converters (H02M3/1584 takes precedence)} - H10W 44/501: {Inductive arrangements (H10W44/20 takes precedence)} - H10W 90/00: Package configurations - H01F 2017/0086: {on semiconductor substrate} - H10W 74/142: {the encapsulations exposing the passive side of the semiconductor body} - H10W 90/726: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - H03K: PULSE TECHNIQUE (measuring pulse characteristics G01R; modulating sinusoidal oscillations with pulses H03C; transmission of digital information H04L; discriminator circuits detecting phase difference between two signals by counting or integrating cycles of oscillation H03D3/04; automatic control, starting, synchronisation or stabilisation of generators of electronic oscillations or pulses where the type of generator is irrelevant or unspecified H03L; coding, decoding or code conversion, in general H03M) - H01F: MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES - H02M: APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF (transformers H01F; dynamo-electric converters H02K47/00; controlling transformers, reactors or choke coils, control or regulation of electric motors, generators or dynamo-electric converters H02P) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract An integrated circuit includes a semiconductor die including one or more switching circuits, a magnetic core having length and width, first and second metallic leads, and integrated circuit packaging material. The first metallic lead forms a first winding turn around a portion of the magnetic core, and the first metallic lead is electrically coupled to the semiconductor die. The second metallic lead forms a second winding turn around a portion of the magnetic core. The first and second winding turns are offset from each other along both of the width and length of the magnetic core. The integrated circuit is, for example, included in an integrated electronic assembly. ## Claims ### Claim 1 An integrated circuit, comprising: a semiconductor die including one or more switching circuits; a magnetic core; a metallic lead wrapped around at least a portion of the magnetic core, the metallic lead having a first end connected to the semiconductor die; and integrated circuit packaging material encapsulating the semiconductor die, the magnetic core, and a portion of the metallic lead, to form an integrated circuit package; the metallic lead having a second end, opposite of the first end, terminating on an outer surface of the integrated circuit package. ### Claim 2 (depends on 1) The integrated circuit of claim 1, wherein the second end of the metallic lead forms a terminal on the outer surface of the integrated circuit package. ### Claim 3 (depends on 2) The integrated circuit of claim 2, wherein the terminal comprises a solder tab adapted for surface mount soldering to a substrate. ### Claim 4 (depends on 3) The integrated circuit of claim 3, the semiconductor die comprising a flip chip semiconductor die connected to the first end of the metallic lead via a solder connection. ### Claim 5 (depends on 1) The integrated circuit of claim 1, the one or more switching circuits, the metallic lead, and the magnetic core collectively forming at least part of a switching power converter. ### Claim 6 (depends on 5) The integrated circuit of claim 5, the switching power converter having a topology selected from the group consisting of a buck DC-to-DC converter, a boost DC-to-DC converter, and a buck-boost DC-to-DC converter. ### Claim 7 (depends on 5) The integrated circuit of claim 5, wherein: the one or more switching circuits comprise a control transistor and a freewheeling transistor electrically coupled in series between an input power rail and a reference power rail of the integrated circuit; and the integrated circuit further comprises: an input capacitor electrically coupled between the input and reference power rails, first driver circuitry adapted to cause the control transistor to switch between its conductive and non-conductive states, a first driver capacitor electrically coupled to the first driver circuitry, second driver circuitry adapted to cause the freewheeling transistor to switch between its conductive and non-conductive states, and a second driver capacitor electrically coupled to the second driver circuitry. ### Claim 8 (depends on 1) The integrated circuit of claim 1, the metallic lead being formed of a single piece of metal. ### Claim 9 An integrated circuit, comprising: a semiconductor die including one or more switching circuits; a magnetic core; a plurality of metallic leads wound through the magnetic core, at least one of the leads being electrically coupled to the semiconductor die; and integrated circuit packaging material encapsulating the semiconductor die, the magnetic core, and a portion of the plurality of metallic leads, to form an integrated circuit package; the plurality of metallic leads being electrically isolated from each other within the integrated circuit package. ### Claim 10 (depends on 9) The integrated circuit of claim 9, at least one end of each of the plurality of metallic leads terminating on an outer surface of the integrated circuit package. ### Claim 11 (depends on 10) The integrated circuit of claim 10, at least one end of each of the plurality of metallic leads forming a solder tab, suitable for surface mount soldering to a substrate, on the outer surface of the integrated circuit package. ### Claim 12 (depends on 9) The integrated circuit of claim 9, the one or more switching circuits, the plurality of metallic leads, and the magnetic core collectively forming at least part of a switching power converter. ### Claim 13 (depends on 12) The integrated circuit of claim 12, the switching power converter having a topology selected from the group consisting of a buck DC-to-DC converter, a boost DC-to-DC converter, and a buck-boost DC-to-DC converter. ### Claim 14 (depends on 12) The integrated circuit of claim 12, wherein: the one or more switching circuits comprise a control transistor and a freewheeling transistor electrically coupled in series between an input power rail and a reference power rail of the integrated circuit; and the integrated circuit further comprises: an input capacitor electrically coupled between the input and reference power rails, first driver circuitry adapted to cause the control transistor to switch between its conductive and non-conductive states, a first driver capacitor electrically coupled to the first driver circuitry, second driver circuitry adapted to cause the freewheeling transistor to switch between its conductive and non-conductive states, and a second driver capacitor electrically coupled to the second driver circuitry. ### Claim 15 An integrated circuit, comprising: a semiconductor die including one or more switching circuits; a magnetic core having length and width; a first metallic lead forming a first winding turn around a portion of the magnetic core, the first metallic lead being electrically coupled to the semiconductor die; a second metallic lead forming a second winding turn around a portion of the magnetic core; and integrated circuit packaging material encapsulating the semiconductor die, the magnetic core, and portions of the first and second metallic leads, to form an integrated circuit package; the first and second winding turns being offset from each other along both of the width and length of the magnetic core. ### Claim 16 (depends on 15) The integrated circuit of claim 15, wherein: the first winding turn is wound around a first center axis; the second winding turn is wound around a second center axis; and the second center axis is offset from the first center axis along the lengthwise direction of the magnetic core. ### Claim 17 (depends on 16) The integrated circuit of claim 16, further comprising: a third metallic lead forming a third winding turn around a portion of the magnetic core, the third winding turn being wound around the first center axis; a fourth metallic lead forming a fourth winding turn around a portion of the magnetic core, the fourth winding turn being wound around the second center axis; and the first, second, third, and fourth winding turns being separated from each other along the widthwise direction of the magnetic core. ### Claim 18 (depends on 16) The integrated circuit of claim 16, each of the first and second winding turns having a staple shape. ### Claim 19 (depends on 15) The integrated circuit of claim 15, at least one end of each of the first and second metallic leads terminating on an outer surface of the integrated circuit package. ### Claim 20 (depends on 15) The integrated circuit of claim 15, the one or more switching circuits, the first and second metallic leads, and the magnetic core collectively forming at least part of a multi-phase switching power converter. ### Claim 21 (depends on 20) The integrated circuit of claim 20, the switching power converter having a topology selected from the group consisting of a multi-phase buck DC-to-DC converter, a multi-phase boost DC-to-DC converter, and a multi-phase buck-boost DC-to-DC converter. ### Claim 22 (depends on 20) The integrated circuit of claim 20, wherein: the one or more switching circuits comprise at least two power stages, each power stage including a control transistor and a freewheeling transistor electrically coupled in series between an input power rail and a reference power rail of the integrated circuit; and the integrated circuit further comprises: an input capacitor electrically coupled between the input and reference power rails of the integrated circuit, respective first and second driver circuitry for each power stage, the first driver circuitry adapted to cause the control transistor of the power stage to switch between its conductive and non-conductive states, the second driver circuitry adapted to cause the freewheeling transistor of the power stage to switch between its conductive and non-conductive states, a respective first driver capacitor electrically coupled to each first driver circuitry instance, and a respective second driver capacitor electrically coupled to each second driver circuitry instance. ### Claim 23 An integrated circuit, comprising: a semiconductor die including one or more switching circuits; a magnetic core having length and width; first and second lead sets, each lead set including a plurality of metallic leads, each metallic lead wound around a portion of the magnetic core in the lengthwise direction of the magnetic core, at least one of the plurality of metallic leads being electrically coupled to the semiconductor die; and integrated circuit packaging material encapsulating the semiconductor die, the magnetic core, and a portion of the first and second lead sets, to form an integrated circuit package; the first and second lead sets non-overlapping and separated by a first separation distance, along the width of the magnetic core; the first separation distance being greater than each separation distance between adjacent metallic leads of the first and second lead sets, along the width of the magnetic core. ### Claim 24 (depends on 23) The integrated circuit of claim 23, the one or more switching circuits, the first and second lead sets, and the magnetic core collectively forming at least part of a multi-phase switching power converter. ### Claim 25 (depends on 24) The integrated circuit of claim 24, the multi-phase switching power converter having a topology selected from the group consisting of a multi-phase buck DC-to-DC converter, a multi-phase boost DC-to-DC converter, and a multi-phase buck-boost DC-to-DC converter. ### Claim 26 (depends on 24) The integrated circuit of claim 24, wherein: the one or more switching circuits comprise at least two power stages, each power stage including a control transistor and a freewheeling transistor electrically coupled in series between an input power rail and a reference power rail of the integrated circuit; and the integrated circuit further comprises: an input capacitor electrically coupled between the input and reference power rails of the integrated circuit, respective first and second driver circuitry for each power stage, the first driver circuitry adapted to cause the control transistor of the power stage to switch between its conductive and non-conductive states, the second driver circuitry adapted to cause the freewheeling transistor of the power stage to switch between its conductive and non-conductive states, a respective first driver capacitor electrically coupled to each first driver circuitry instance, and a respective second driver capacitor electrically coupled to each second driver circuitry instance. ### Claim 27 An integrated electronic assembly, comprising: a substrate including a cut-out portion; first and second semiconductor dies disposed on the substrate, the first semiconductor die including one or more switching circuits; an inductor including a magnetic core extending at least partially into the cut-out portion of the substrate; metallic connection circuitry electrically coupling the first and second semiconductor dies and the inductor; and packaging material encapsulating at least a portion of the substrate, the first and second semiconductor dies, the inductor, and the metallic connection circuitry, to form an assembly package. ### Claim 28 (depends on 27) The integrated electronic assembly of claim 27, the one or more switching circuits, the inductor, and the metallic connection circuitry collectively forming at least part of a switching power converter adapted to at least partially power the second semiconductor die. ### Claim 29 (depends on 28) The integrated electronic assembly of claim 28, the second semiconductor die comprising at least one of a processor device and an application specific integrated circuit. ### Claim 30 (depends on 29) The integrated electronic assembly of claim 29, wherein: the substrate has opposing first and second outer surfaces separated by a thickness of the substrate; the first and second semiconductor dies are disposed on the first outer surface of the substrate; and the magnetic core extends into the cut-out portion of the substrate such that an outer surface of the magnetic core is between the first and second outer surfaces of the substrate, in a direction of the thickness of the substrate. ### Claim 31 (depends on 30) The integrated electronic assembly of claim 30, the metallic connection circuitry comprising one or more conductive traces of the substrate. ### Claim 32 (depends on 28) The integrated electronic assembly of claim 28, the switching power converter being a multi-phase switching power converter, and the inductor being a coupled inductor. ### Claim 33 An integrated electronic assembly, comprising: a substrate; first and second semiconductor dies disposed on the substrate, the first semiconductor die including one or more switching circuits; a heat sink plate disposed on the first and second semiconductor dies, the heat sink plate including a cut-out portion; an inductor including a magnetic core disposed on the substrate and extending at least partially into the cut-out portion of the heat sink plate; metallic connection circuitry electrically coupling the first and second semiconductor dies and the inductor; and packaging material encapsulating at least part of the substrate, the first and second semiconductor dies, the inductor, and the first metallic connection circuitry, to form an assembly package. ### Claim 34 (depends on 33) The integrated electronic assembly of claim 33, the one or more switching circuits, the inductor, and the metallic connection circuitry collectively forming at least part of a switching power converter adapted to at least partially power the second semiconductor die. ### Claim 35 (depends on 34) The integrated electronic assembly of claim 34, the second semiconductor die comprising at least one of a processor device and an application specific integrated circuit. ### Claim 36 (depends on 35) The integrated electronic assembly of claim 35, wherein: the heat sink plate has opposing first and second outer surfaces separated by a thickness of the heat sink plate; the heat sink plate is disposed on the first and second semiconductor dies such that the first outer surface faces the first and second semiconductor dies; and the magnetic core extends into the cut-out portion of the heat sink plate such that a top outer surface of the magnetic core is between the first and second outer surfaces of the heat sink plate, in a direction of the thickness of the heat sink plate. ### Claim 37 (depends on 36) The integrated electronic assembly of claim 36, the metallic connection circuitry comprising one or more conductive traces of the substrate. ### Claim 38 (depends on 34) The integrated electronic assembly of claim 34, the switching power converter being a multi-phase switching power converter, and the inductor being a coupled inductor. ### Claim 39 (depends on 33) The integrated electronic assembly of claim 33, the substrate including a cut-out portion, and the magnetic core extending at least partially into the cut-out portion of the substrate. ### Claim 40 An integrated electronic assembly, comprising: a substrate; and an integrated circuit disposed on the substrate, the integrated circuit including: a first semiconductor die including one or more switching circuits, a magnetic core, and a metallic lead wrapped around at least a portion of the magnetic core, the metallic lead having a first end connected to the semiconductor die and a second end, opposite of the first end, connected to the substrate. ### Claim 41 (depends on 40) The integrated electronic assembly of claim 40, further comprising a second semiconductor die disposed on the substrate, wherein: the substrate includes one or more conductive traces electrically coupling the second end of the metallic lead to the second semiconductor die, and the one or more switching circuits, the magnetic core, and the metallic lead collectively form at least part of a switching power converter adapted to at least partially power the second semiconductor die. ### Claim 42 (depends on 41) The integrated electronic assembly of claim 41, further comprising packaging material encapsulating at least part of the substrate, the integrated circuit, and the second semiconductor die, to form an assembly package. ### Claim 43 (depends on 42) The integrated electronic assembly of claim 42, the first semiconductor die comprising a flip chip semiconductor die connected to the first end of the metallic lead via a solder connection. ### Claim 44 (depends on 43) The integrated electronic assembly of claim 43, portions of the one or more conductive traces of the substrate being wound on the magnetic core, such that the metallic lead, portions of the one or more conductive traces, and the magnetic core collectively form an inductor of the switching power converter. ### Claim 45 (depends on 41) The integrated electronic assembly of claim 41, the second semiconductor die comprising at least one of a processor device and an application specific integrated circuit. ### Claim 46 An integrated electronic assembly, comprising: a substrate; and an integrated circuit disposed on the substrate, the integrated circuit including: a first semiconductor die including one or more switching circuits, a magnetic core having length and width, a first metallic lead forming a first winding turn around a portion of the magnetic core, the first metallic lead being electrically coupled to the semiconductor die, and a second metallic lead forming a second winding turn around a portion of the magnetic core, the first and second winding turns being offset from each other along both of the width and length of the magnetic core. ### Claim 47 (depends on 46) The integrated electronic assembly of claim 46, further comprising: a second semiconductor die disposed on the substrate and electrically coupled to the integrated circuit; wherein the one or more switching circuits, the magnetic core, and the first and second metallic leads collectively form at least part of a switching power converter adapted to at least partially power the second semiconductor die. ### Claim 48 (depends on 47) The integrated electronic assembly of claim 47, further comprising packaging material encapsulating at least part of the substrate, the integrated circuit, and the second semiconductor die, to form an assembly package. ### Claim 49 (depends on 48) The integrated electronic assembly of claim 48, wherein: the first winding turn is wound around a first center axis; the second winding turn is wound around a second center axis; and the second center axis is offset from the first center axis along the lengthwise direction of the magnetic core. ### Claim 50 (depends on 47) The integrated electronic assembly of claim 47, each of the first and second winding turns having a staple shape. ### Claim 51 (depends on 47) The integrated electronic assembly of claim 47, the second semiconductor die comprising at least one of a processor device and an application specific integrated circuit. ### Claim 52 (depends on 47) The integrated electronic assembly of claim 47, the magnetic core and the first and second metallic leads collectively forming at least part of a coupled inductor. ### Claim 53 An integrated electronic assembly, comprising: a substrate including conductive traces; and an integrated circuit disposed on the substrate, the integrated circuit including: a first semiconductor die including one or more switching circuits, a magnetic core having length and width, and first and second windings electrically coupled to the first semiconductor die, each winding including a plurality of metallic leads electrically coupled in series by the conductive traces of the substrate, each metallic lead wound around a portion of the magnetic core in a lengthwise direction of the magnetic core, wherein the first and second windings are non-overlapping and separated by a first separation distance, along the width of the magnetic core, and wherein the first separation distance is greater than each separation distance between adjacent metallic leads of the first and second windings, along the width of the magnetic core. ### Claim 54 (depends on 53) The integrated electronic assembly of claim 53, further comprising: a second semiconductor die disposed on the substrate and electrically coupled to the integrated circuit; wherein the one or more switching circuits, the magnetic core, and the first and second windings collectively forming at least part of a switching power converter adapted to at least partially power the second semiconductor die. ### Claim 55 (depends on 54) The integrated electronic assembly of claim 54, further comprising packaging material encapsulating at least part of the substrate, the integrated circuit, and the second semiconductor die, to form an assembly package. ### Claim 56 (depends on 55) The integrated electronic assembly of claim 55, the second semiconductor die comprising at least one of a processor device and an application specific integrated circuit. ### Claim 57 (depends on 54) The integrated electronic assembly of claim 54, the magnetic core and the first and second windings collectively forming at least part of a coupled inductor. ### Claim 58 A method for manufacturing an integrated circuit including a magnetic device, comprising: separately manufacturing a main portion of the integrated circuit and a magnetic portion of the integrated circuit, the main portion including a semiconductor die attached to a lead frame, and the magnetic portion including a magnetic core and at least one metallic lead wound on or through the magnetic core; joining the main and magnetic portions of the integrated circuit to form one or more windings, the one or more windings including at least a portion of the lead frame and the at least one lead wound on or through the magnetic core; and after the step of joining, packaging the main and magnetic portions of the integrated circuit. ### Claim 59 (depends on 58) The method of claim 58, the step of packaging comprising molding a polymer material around the main and magnetic portions to form an integrated circuit package.