# US 2014/0152168 A1 · Electron multiplier > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0152168 A1 - Document ID: US20140152168A1 - Status: Published application - Kind: A1 - Application number: 14/123,250 - Filed: 2012-05-31 - Published: 2014-06-05 - Earliest claimed: 2011-06-02 - Assignees: Hamamatsu Photonics K.K. - Inventors: Akio Suzuki; Yuto Yanagihara; Hiroshi Kobayashi - Web page: https://patentgrep.com/patent/US20140152168A1 ## CPC - H01J 43/04: Electron multipliers {(if forming part of electron gun H01J3/023)} - H01J 43/246: {Microchannel plates [MCP] (image amplification tubes using MCP H01J31/507)} - H01J 43/28: Vessels {, e.g. wall of the tube}; Windows; Screens; Suppressing undesired discharges or currents - H01J: ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS (spark-gaps H01T; electric arc lamps H05B31/00; particle accelerators H05H) ## Abstract An electron multiplier includes an insulating substrate which includes an electrical wiring pattern and in which a through-hole is formed, an MCP arranged on one side of the through-hole of the insulating substrate and electrically connected to the electrical wiring pattern, a shield plate arranged in one side of the MCP and electrically connected to the MCP, an anode arranged on the other side of the through-hole and electrically connected to the electrical wiring pattern, and a signal readout terminal fixed to the insulating substrate for reading a signal from the anode. The shield plate is formed to include the MCP when viewed in a thickness direction. A through-hole exposing at least a portion of the MCP is formed in the shield plate. The insulating substrate, the MCP, the shield plate and the anode are fixed to each other to be integral. ## Claims ### Claim 1 An electron multiplier comprising: an insulating substrate which includes an electrical wiring pattern and in which a through-hole extending in a thickness direction is formed; a micro-channel plate arranged on one side of a through-hole of the insulating substrate in the thickness direction and electrically connected to the electrical wiring pattern; a metal plate arranged in one side of the micro-channel plate in the thickness direction and electrically connected to the micro-channel plate; an anode arranged on the other side of a through-hole of the insulating substrate in the thickness direction and electrically connected to the electrical wiring pattern; and a signal readout terminal fixed to the insulating substrate for reading a signal from the anode through the electrical wiring pattern, wherein the metal plate is formed to include the micro-channel plate when viewed in the thickness direction, and a through-hole exposing at least a portion of the micro-channel plate is formed in the metal plate, and the insulating substrate, the micro-channel plate, the metal plate and the anode are fixed to each other to be integral. ### Claim 2 (depends on 1) The electron multiplier according to claim 1, wherein: in the electrical wiring pattern, an output side of the micro-channel plate is connected to a voltage supply terminal which is electrically connected to the other side of the micro-channel plate through a first bleeder circuit unit. ### Claim 3 (depends on 2) The electron multiplier according to claim 2, wherein, in the electrical wiring pattern, a second bleeder circuit unit having a smaller resistance value than resistance value of the micro-channel plate is connected to be in parallel with the micro-channel plate. ### Claim 4 (depends on 1) The electron multiplier according to claim 1, wherein a voltage to be supplied to one side of the micro-channel plate is applied to the metal plate. ### Claim 5 (depends on 1) The electron multiplier according to claim 1, wherein the metal plate is formed to include the insulating substrate when viewed in the thickness direction. ### Claim 6 (depends on 1) The electron multiplier according to claim 1, wherein the micro-channel plate is interposed between the insulating substrate and the metal plate and fixed to the insulating substrate and the metal plate. ### Claim 7 (depends on 1) The electron multiplier according to claim 1, wherein the metal plate is fixed to the insulating substrate by a conductive fastening member and electrically connected to the electrical wiring pattern. ### Claim 8 (depends on 1) The electron multiplier according to claim 1, wherein the anode is fixed to the insulating substrate by a conductive bonding agent and electrically connected to the electrical wiring pattern. ### Claim 9 (depends on 1) The electron multiplier according to claim 1, wherein a fixing hole for fixation to the outside is provided in at least one of the insulating substrate and the metal plate. ### Claim 10 (depends on 1) The electron multiplier according to claim 1, wherein: the insulating substrate is a refractive substrate which at least includes a first parallel portion extending in parallel with the metal plate, a second parallel portion arranged to be stacked on the other side of the first parallel portion in the thickness direction, and an intersecting portion which intersects the first and second parallel portions to connect the first and second parallel portions, the through-hole of the insulating substrate is formed in the first parallel portion, the anode is provided on a surface of the first parallel portion on the second parallel portion side, and a post having an insulating property or conductive property is interposed between the first and second parallel portions. ### Claim 11 (depends on 1) The electron multiplier according to claim 1, wherein: the insulating substrate at least includes a first substrate and a second substrate arranged to be stacked on the other side of the first substrate in the thickness direction, the through-hole of the insulating substrate is formed in the first substrate, the anode is provided on a surface of the first substrate on the second substrate side, and a post having an insulating property or conductive property is interposed between the first and second substrates. ### Claim 12 (depends on 1) The electron multiplier according to claim 1, wherein: the insulating substrate is a multi-substrate which at least includes a first substrate and a second substrate arranged to be stacked on the other side of the first substrate in the thickness direction, the through-hole of the insulating substrate is formed in the first substrate, and the anode is provided on the surface of the second substrate on the first substrate side. ### Claim 13 (depends on 12) The electron multiplier according to claim 12, wherein a noise shield portion is formed on a surface of the second substrate on the side opposite to the first substrate.