# US 2014/0152167 A1 · Heat-conducting and heat-dissipating nano-materials, preparing method thereof and heat-dissipating system > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0152167 A1 - Document ID: US20140152167A1 - Status: Published application - Kind: A1 - Application number: 13/824,454 - Filed: 2011-06-10 - Published: 2014-06-05 - Earliest claimed: 2011-06-10 - Assignees: Green Formula Co., Ltd. - Inventors: King Sun Juy; Man Wah Hui - Web page: https://patentgrep.com/patent/US20140152167A1 ## CPC - F21V 29/70: characterised by passive heat-dissipating elements, e.g. heat-sinks - C09K 5/14: Solid materials, e.g. powdery or granular - F21V: FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR - C09K: MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE ## Abstract The invention provides a heat-conducting and heat-dissipating nano-material, a method for preparation thereof and a heat-dissipating system. The method comprises the following steps: i) mixing a complex formed by a high molecular material and a substance having heat conduction and heat dissipation properties with tert-butyl acetate and 4-Chlorobenzotrifluoride, wherein the complex is of nano scale in particle size; and ii) placing a mixture obtained from step i) into water and stirring the mixture in water for a period of time to afford the heat-conducting and heat-dissipating material. Application of the heat-conducting and heat-dissipating material in a heat-dissipating system of LED light may simplify the manufacturing process, save raw materials used and reduce weight and size of heat sink of the heat-dissipating system. ## Claims ### Claim 1 A method for preparation of a heat-conducting and heat-dissipating nano-material, characterized by comprising the following steps: i) mixing a complex formed by a high molecular material and a substance having heat conduction and heat dissipation properties with tert-butyl acetate and 4-Chlorobenzotrifluoride, wherein the complex is of nano scale in particle size; and ii) placing the mixture obtained from step i) into water and stirring the mixture in water for a period of time to afford the heat-conducting and heat-dissipating material. ### Claim 2 (depends on 1) The method according to claim 1, characterized in that the substance having heat conduction and dissipation properties is selected from the group consisting of ceramic, carbon, paraffin, silica and polymethylsilazane. ### Claim 3 (depends on 1) The method according to claim 1, characterized in that the complex, the tert-butyl acetate and the 4-Chlorobenzotrifluoride are mixed in a ratio by weight of the complex 20-40%: the tert-butyl acetate 35-45%: the 4-Chlorobenzotrifluoride 25-35%. ### Claim 4 (depends on 1) The method according to claim 1, characterized in that based on a total weight of water, the complex, the tert-butyl acetate and the 4-Chlorobenzotrifluoride, the water is used in an amount of about 25-75% weight of the total weight. ### Claim 5 (depends on 1) The method according to claim 1, characterized in that the particle size of the complex is less than 1 nm. ### Claim 6 (depends on 1) The method according to claim 1, characterized in that in step ii), the stirring is performed at an atmospheric pressure and at room temperature for 10-20 minutes. ### Claim 7 (depends on 1) The method according to claim 1, characterized in that the heat conducting and heat dissipating material is formed as an emulsion. ### Claim 8 (depends on 1) A heat-conducting and heat-dissipating nano-material prepared by the method according to claim 1. ### Claim 9 (depends on 8) A heat dissipating system for a lighting device, comprising a heat conduction panel connected with a light source in a thermally conductive manner, and a heat sink connected with the heat conduction panel for heat conduction, characterized in that the heat-conducting and heat-dissipating nano-material according to claim 8 is applied onto a surface of the heat conduction panel in contact with the heat sink, and/or onto an external surface of the heat sink. ### Claim 10 (depends on 9) The heat dissipating system according to claim 9, characterized in that the light source is one or more LEDs. ### Claim 11 (depends on 9) The heat dissipating system according to claim 9, characterized in that the heat-conducting and heat-dissipating nano-material applied onto the surface of the heat conduction panel in contact with the heat sink is 0.3-2 mil in thickness. ### Claim 12 (depends on 9) The heat dissipating system according to claim 9, characterized in that the heat-conducting and heat-dissipating nano-material applied onto the external surface of the heat sink is 0.3-2 mil in thickness. ### Claim 13 (depends on 9) The heat dissipating system according to claim 9, characterized in that the heat sink is free of heat-dissipating fins. ### Claim 14 (depends on 9) The heat dissipating system according to claim 9, characterized in that the heat conduction panel and the heat sink are made from metal. ### Claim 15 (depends on 9) The heat dissipating system according to claim 9, characterized in that the heat conduction panel and the heat sink are pre-treated by sand blast before the application of the heat-conducting and heat-dissipating material. ### Claim 16 (depends on 9) The heat dissipating system according to claim 9, characterized in that the heat-conducting and heat-dissipating nano-material applied onto the surface of the heat conduction panel in contact with the heat sink is a water-soluble high molecular ceramic emulsion, and the heat-conducting and heat-dissipating nano-material applied onto the external surface of the heat sink is a water-soluble high molecular silica emulsion. ### Claim 17 (depends on 2) A heat-conducting and heat-dissipating nano-material prepared by the method according to claim 2. ### Claim 18 (depends on 3) A heat-conducting and heat-dissipating nano-material prepared by the method according to claim 3. ### Claim 19 (depends on 4) A heat-conducting and heat-dissipating nano-material prepared by the method according to claim 4. ### Claim 20 (depends on 5) A heat-conducting and heat-dissipating nano-material prepared by the method according to claim 5.