# US 2014/0152143 A1 · Control circuitry routing configuration for mems devices > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0152143 A1 - Document ID: US20140152143A1 - Status: Published application - Kind: A1 - Application number: 13/689,899 - Filed: 2012-11-30 - Published: 2014-06-05 - Earliest claimed: 2012-11-30 - Assignees: Harris Corporation - Applicants: Harris Corporation - Inventors: John E. Rogers - Web page: https://patentgrep.com/patent/US20140152143A1 ## CPC - B81C 1/00182: {Arrangements of deformable or non-deformable structures, e.g. membrane and cavity for use in a transducer} - B81C 1/00095: {Interconnects} - B81C: PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS (making microcapsules or microballoons B01J13/02; processes or apparatus specially adapted for the manufacture or treatment of piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/01) ## Abstract A method for constructing a MEMS system includes first depositing on a surface of a substrate a first plurality of thin film layers formed of dielectric material. The first plurality of thin-film layers includes at least one conductive trace extending a distance on the substrate, parallel to the surface. A second plurality of layers is then deposited to form at least one MEMS device. The MEMS device is responsive to a control signal applied to a first input terminal and an electrical connection is formed from the conductive trace to the input terminal. ## Claims ### Claim 1 A method for constructing a MEMS system, comprising: first depositing on a surface of a substrate a first plurality of thin film layers formed of dielectric material; including in said first plurality of thin-film layers at least one conductive trace extending a distance on said substrate, parallel to said surface; second depositing over said plurality of thin-film layers a second plurality of layers including at least one layer each of a conductive material and a dielectric material to form at least one MEMS device which is responsive to a control signal applied to a first input terminal; forming an electrical connection from said at least one conductive trace to said input terminal. ### Claim 2 (depends on 1) The method according to claim 1, wherein said second depositing step further comprises forming at least one three-dimensional microstructure on a surface of said substrate in addition to said MEMS device. ### Claim 3 (depends on 2) The method according to claim 2, wherein said three-dimensional microstructure is an RF circuit component. ### Claim 4 (depends on 1) The method according to claim 1, further comprising depositing at least one ground plane layer on said substrate prior to depositing said at least one conductive trace. ### Claim 5 (depends on 4) The method according to claim 4, further comprising forming at least one electrical connection in said thin film layers from said ground plane layer to a second input terminal of said MEMS device. ### Claim 6 (depends on 1) The method according to claim 1, further comprising disposing at least one integrated circuit component on said substrate electrically connected to said at least one conductive trace. ### Claim 7 (depends on 6) The method according to claim 6, wherein said at least one integrated circuit component is a DC to DC converter. ### Claim 8 (depends on 1) The method according to claim 1, wherein said MEMS device includes an electrostatic actuator. ### Claim 9 (depends on 1) The method according to claim 1, wherein said MEMS device is an RF switch with an electrostatic actuator. ### Claim 10 (depends on 1) The method according to claim 1, wherein said first depositing step and said second depositing step comprise depositing one or more of the same materials and one or more of the same processes. ### Claim 11 A MEMS system, comprising: a first plurality of thin film layers formed of dielectric material deposited on a surface of a substrate; at least one conductive trace included in said first plurality of thin-film layers extending a distance on said substrate, parallel to said surface; a second plurality of layers deposited over said first plurality of thin-film layers including at least one layer each of a conductive material and a dielectric material arranged to form at least one MEMS device which is responsive to a control signal applied to a first input terminal; and an electrical connection formed from said at least one conductive trace to said input terminal. ### Claim 12 (depends on 11) The MEMS system according to claim 11, wherein said second plurality of layers further comprises at least one three-dimensional microstructure disposed on a surface of said substrate in addition to said MEMS device. ### Claim 13 (depends on 12) The MEMS system according to claim 12, wherein said three-dimensional microstructure is an RF circuit component. ### Claim 14 (depends on 11) The MEMS system according to claim 11, further comprising at least one ground plane layer deposited on said substrate below said at least one conductive trace. ### Claim 15 (depends on 14) MEMS system according to claim 14, further comprising at least one electrical connection formed in said thin film layers from said ground plane layer to a second input terminal of said MEMS device. ### Claim 16 (depends on 11) The MEMS system according to claim 11, further comprising at least one integrated circuit component disposed on said substrate electrically connected to said at least one conductive trace. ### Claim 17 (depends on 16) The MEMS system according to claim 16, wherein said integrated circuit component is a DC to DC converter. ### Claim 18 (depends on 11) The MEMS system according to claim 11, wherein said MEMS device includes an electrostatic actuator.