# US 2014/0151936 A1 · Pattern transferring apparatus and pattern transferring method > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0151936 A1 - Document ID: US20140151936A1 - Status: Published application - Kind: A1 - Application number: 14/091,773 - Filed: 2013-11-27 - Published: 2014-06-05 - Earliest claimed: 2005-02-28 - Assignees: Canon Kabushiki Kaisha - Applicants: Canon Kabushiki Kaisha - Inventors: Kazuyuki KASUMI; Hirohisa OTA; Eigo KAWAKAMI; Takashi NAKAMURA; Toshinobu TOKITA - Web page: https://patentgrep.com/patent/US20140151936A1 ## CPC - B29C 59/026: {of layered or coated substantially flat surfaces} - B82Y 10/00: Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic - B82Y 40/00: Manufacture or treatment of nanostructures - G03F 7/0002: {Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping} - B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING (making preforms B29B11/00; making laminated products by combining previously unconnected layers which become one product whose layers will remain together B32B37/00 - B32B41/00) - B82Y: SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES - G03F: PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices B41B; photosensitive materials or processes for photographic purposes G03C; electrophotography, sensitive layers or processes therefor G03G) ## Abstract A pattern transferring apparatus is disclosed which can prevent damage to a transferred pattern and realize fast mold release regardless of the type of resist. The pattern transferring apparatus transfers a pattern formed on a mold to an object by bringing the mold into contact with the apparatus has a deformer which causes deformation in the mold for releasing the mold from the object. The apparatus transfers a pattern formed on a mold to a photo-curing resin by bringing the mold into contact with the photo-curing resin and applying light thereto to cure the photo-curing resin. The apparatus has an optical system which applies light at an irradiation light intensity to a non-transfer area other than a transfer area where the pattern is to be transferred in the photo-curing resin, the intensity being different from an irradiation light intensity of light applied to the transfer area. ## Claims ### Claim 1 An imprint apparatus for molding an uncured object on a substrate with a mold that has a pattern area and curing the molded uncured object to form a pattern of the cured object on the substrate, the apparatus comprising: a substrate stage configured to hold the substrate; a mold stage configured to hold the mold and configured to cause a release of the mold from the cured object to start in an area of the mold adjacent to the pattern area; a driving mechanism configured to cause relative movement between the substrate stage and the mold stage in a direction in which the mold is caused to contact with the uncured object and in a direction in which the mold is released from the cured object; and a controller configured to control the mold stage such that after or in parallel with the curing, the mold stage causes the release to start in the area of the mold adjacent to the pattern area, and to control the driving mechanism such that after the start of the release, the driving mechanism causes the relative movement so that a subsequent release of the mold is performed for the pattern area. ### Claim 2 (depends on 1) The imprint apparatus according to claim 1, wherein the mold stage is configured to cause the release to start by irradiating the area of the mold adjacent to the pattern area with infrared light. ### Claim 3 (depends on 2) The imprint apparatus according to claim 2, wherein the mold stage is configured to cause the release to start by heating the area of the mold adjacent to the pattern area. ### Claim 4 (depends on 3) The imprint apparatus according to claim 3, wherein the mold stage is configured to heat the area of the mold adjacent to the pattern area with a heater provided with the mold. ### Claim 5 (depends on 1) The imprint apparatus according to claim 1, wherein the mold stage is configured to cause the release to start by irradiating the area of the mold adjacent to the pattern area with ultraviolet light. ### Claim 6 (depends on 5) The imprint apparatus according to claim 5, wherein the mold stage is configured to irradiate the area of the mold adjacent to the pattern area with ultraviolet light in parallel with the curing. ### Claim 7 (depends on 5) The imprint apparatus according to claim 5, further comprising a ultraviolet light source for curing the molded uncured object. ### Claim 8 (depends on 1) The imprint apparatus according to claim 1, wherein the non-transfer area is on a scribe line. ### Claim 9 (depends on 1) The imprint apparatus according to claim 1, wherein the mold stage is configured to cause the release to start in the area of the mold, above a scribe line area of the substrate, adjacent to the pattern area. ### Claim 10 (depends on 1) The imprint apparatus according to claim 1, wherein the mold stage is configured to cause the release to start with an actuator provided with the mold. ### Claim 11 (depends on 10) The imprint apparatus according to claim 10, wherein the mold stage is configured to cause the release to start by deforming the mold by the actuator. ### Claim 12 An imprint method of molding an uncured object on a substrate with a mold that has a pattern area and curing the molded uncured object to form a pattern of the cured object on the substrate, the method comprising: after or in parallel with the curing, causing a release of the mold from the cured object to start in an area of the mold adjacent to the pattern area; and after the start of the release, causing relative movement between the substrate and the mold so that a subsequent release of the mold is performed for the pattern area.