# US 2014/0151905 A1 · Devices and Methods for Providing an Electrical Connection > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0151905 A1 - Document ID: US20140151905A1 - Status: Published application - Kind: A1 - Application number: 13/693,481 - Filed: 2012-12-04 - Published: 2014-06-05 - Earliest claimed: 2012-12-04 - Assignees: Infineon Technologies AG - Applicants: Infineon Technologies AG - Inventors: Michael Sternad; Rainer Pelzer - Web page: https://patentgrep.com/patent/US20140151905A1 ## CPC - H01R 43/02: for soldered or welded connections - B23K 26/22: Spot welding - G02B 19/0028: {refractive and reflective surfaces, e.g. non-imaging catadioptric systems} - G02B 19/0047: {for use with a light source (G02B19/009, G02B19/0095 take precedence; details of lighting devices in general F21V; non-semiconductor lasers having optical devices external to the laser cavity H01S3/005)} - H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts} - B23K 2101/38: Conductors - H10W 72/01551: {Changing the shapes of bond wires} - H10W 72/07141: {Means for applying energy, e.g. ovens or lasers} - H10W 72/07511: {Treating the bonding area before connecting, e.g. by applying flux or cleaning} - H10W 72/07521: {Aligning} - H10W 72/07533: {Ultrasonic bonding, e.g. thermosonic bonding} - H10W 72/522: {Multilayered bond wires, e.g. having a coating concentric around a core} - H10W 72/536: {the connected ends being ball-shaped} - H10W 72/5363: {the connected ends being wedge-shaped} - H10W 72/5522: {comprising gold [Au]} - H10W 72/5524: {comprising aluminium [Al]} - H10W 72/5525: {comprising copper [Cu]} - H10W 72/59: Bond pads specially adapted therefor - H10W 72/952: {comprising metals or metalloids, e.g. PbSn, Ag or Cu} - H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - H01R: ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS - B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM - G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A device includes a tube extending in a longitudinal direction and a hollow channel arranged in the tube. An end part of the tube is formed such that first electromagnetic radiation paths extending in the tube and outside of the hollow channel in the longitudinal direction are focused in a first focus. ## Claims ### Claim 1 A device, comprising: a tube extending in a longitudinal direction; and a hollow channel arranged in the tube, wherein an end part of the tube is formed such that first electromagnetic radiation paths extending in the tube and outside of the hollow channel in the longitudinal direction are focused in a first focus. ### Claim 2 (depends on 1) The device of claim 1, wherein the hollow channel extends in the longitudinal direction. ### Claim 3 (depends on 1) The device of claim 1, wherein the hollow channel defines an axis extending in the longitudinal direction and the first focus is substantially arranged on the axis. ### Claim 4 (depends on 1) The device of claim 1, wherein the first electromagnetic radiation paths comprise a reflection at the end part of the tube or a refraction at the end part of the tube. ### Claim 5 (depends on 1) The device of claim 1, wherein second electromagnetic radiation paths extending in the tube and outside of the hollow channel in the longitudinal direction are focused in a second focus, the first electromagnetic radiation paths comprise a reflection at the end part of the tube, and the second electromagnetic radiation paths comprise a refraction at the end part of the tube. ### Claim 6 (depends on 1) The device of claim 1, wherein the tube comprises a material selected from the group consisting of a quartz material, ZnS, GaAs and sapphire. ### Claim 7 (depends on 1) The device of claim 1, wherein a thickness of the hollow channel is between 15 and 1000 micrometers. ### Claim 8 (depends on 1) The device of claim 1, further comprising an interface configured to couple the tube to a laser source. ### Claim 9 (depends on 1) The device of claim 1, further comprising a unit configured to provide a forming gas. ### Claim 10 (depends on 1) The device of claim 1, wherein the device comprises a wire bonder tool. ### Claim 11 A method, comprising: providing a tube extending in a longitudinal direction, wherein the tube comprises a hollow channel arranged in the tube, an end part of the tube being formed such that electromagnetic radiation paths extending in the tube and outside of the hollow channel in the longitudinal direction are focused in a focus; and providing electromagnetic radiation such that the electromagnetic radiation is focused in the focus. ### Claim 12 (depends on 11) The method of claim 11, further comprising: inserting a wire into the hollow channel; and melting a part of the wire in the focused electromagnetic radiation. ### Claim 13 (depends on 12) The method of claim 12, further comprising providing a contact between a molten part of the wire and an electrical contact element. ### Claim 14 (depends on 11) The method of claim 11, further comprising providing a forming gas. ### Claim 15 (depends on 14) The method of claim 14, wherein the forming gas is provided through the hollow channel. ### Claim 16 (depends on 14) The method of claim 14, further comprising inserting a wire into the hollow channel, wherein a pressure of the forming gas moves the wire towards the focus. ### Claim 17 A device, comprising: a capillary extending in a longitudinal direction, wherein an end part of the capillary is beveled; and a hollow channel arranged in the capillary and defining an axis, wherein at the beveled end part of the capillary electromagnetic radiation paths extending in the capillary and outside of the hollow channel in the longitudinal direction are directed towards the axis. ### Claim 18 (depends on 17) The device of claim 17, wherein the electromagnetic radiation paths are directed towards a focus by at least one of a reflection and a refraction. ### Claim 19 A device, comprising: a semiconductor material; an electrical contact element comprising a first material and arranged over the semiconductor material; and a bond wire comprising a second material and electrically coupled to the electrical contact element, wherein a transition between the first material and the second material is continuous. ### Claim 20 (depends on 19) The device of claim 19, wherein each of the first material and the second material comprises a metal or a metal alloy. ### Claim 21 (depends on 19) The device of claim 19, wherein the first material and the second material both comprise copper. ### Claim 22 (depends on 19) The device of claim 19, wherein the continuous transition comprises a solidification structure. ### Claim 23 (depends on 19) The device of claim 19, wherein the continuous transition comprises a polycrystalline structure. ### Claim 24 (depends on 19) The device of claim 19, further comprising a further electrical contact element of a printed circuit board or a leadframe and comprising a third material, wherein the bond wire is electrically coupled to the further electrical contact element and a transition between the first material and the third material is continuous. ### Claim 25 A method, comprising: providing electromagnetic radiation; focusing the electromagnetic radiation; melting at least one of a bonding wire and an electrical contact pad on the basis of the focused electromagnetic radiation; and providing an electrical connection between the bonding wire and the electrical contact pad.