# US 2014/0151903 A1 · Repairing method, repairing structure, and repairing system for disconnected defect > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0151903 A1 - Document ID: US20140151903A1 - Status: Published application - Kind: A1 - Application number: 13/810,511 - Filed: 2012-12-04 - Published: 2014-06-05 - Earliest claimed: 2012-12-04 - Assignees: Shenzhen China Star Optoelectronics Technology Co., Ltd. - Applicants: Shenzhen China Star Optoelectronics Technology Co., Ltd - Inventors: Weng-Da Cheng - Web page: https://patentgrep.com/patent/US20140151903A1 ## CPC - H10W 20/20: Interconnections within wafers or substrates, e.g. through-silicon vias [TSV] - H10W 20/067: {by modifying the pattern of conductive parts} - H10W 20/432: {comprising crossing interconnections} - Y02W 30/82: Recycling of waste of electrical or electronic equipment [WEEE] - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - Y02W: CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT ## Abstract The present disclosure provides a repairing method, a repairing structure and a repairing system for a disconnected defect, the repairing method includes: forming a first repairing line connecting two ends of a disconnected portion of a scanning line; forming an insulation layer covering the first repairing line; and forming a second repairing line connecting two ends of a disconnected portion of a data line with the insulation layer located at an intersection of the first repairing line and the second repairing line. By forming the insulation layer between the first repairing line and the second repairing line, the present disclosure avoids the short circuit generated after the scanning line and the data line are repaired, repairs the disconnected defect at the intersection of two metal layers, improves the yield rate of the repairing of the disconnected defect, and reduces manufacturing cost. ## Claims ### Claim 1 A repairing method for a disconnected defect, comprising: forming a first repairing line connecting two ends of a disconnected portion of a scanning line; forming an insulation layer covering the first repairing line; and forming a second repairing line connecting two ends of a disconnected portion of a data line with the insulation layer located at an intersection of the scanning line and the data line. ### Claim 2 (depends on 1) The repairing method as claimed in claim 1, wherein the step of forming an insulation layer covering the first repairing line comprises: forming the insulation layer partly covering the first repairing line. ### Claim 3 (depends on 1) The repairing method as claimed in claim 1, wherein the step of forming an insulation layer covering the first repairing line comprises: presetting a position at which the second repairing line is formed; determining a position of an intersection of the first repairing line and the second repairing line according to the position at which the second repairing line is formed; and forming an insulation layer at the intersection of the first repairing line and the second repairing line with the insulation layer covering the intersection. ### Claim 4 (depends on 1) The repairing method as claimed in claim 1, wherein the step of forming an insulation layer covering the first repairing line comprises: coating an insulation film; performing a photoresist-coating process, an exposing process, a developing process, an etching process, and a photo-stripping process to the insulation film to form the insulation layer. ### Claim 5 (depends on 1) The repairing method as claimed in claim 1 further comprising the following step after the step of forming an insulation layer covering the first repairing line: curing the insulation layer. ### Claim 6 (depends on 5) The repairing method as claimed in claim 5, wherein the step of curing the insulation layer comprises: baking the insulation layer or exposing the insulation layer to ultraviolet light. ### Claim 7 (depends on 1) The repairing method as claimed in claim 1, wherein the step of forming an insulation layer covering the first repairing line comprises: forming the insulation layer covering the whole first repairing line. ### Claim 8 A repairing structure for a disconnected defect located at an intersection of a scanning line and a data line of a TFT array substrate, comprising: a first repairing line connecting two ends of a disconnected portion of a scanning line; a second repairing line connecting two ends of a disconnected portion of a data line; and an insulation layer arranged at an intersection of the first repairing line and the second repairing line. ### Claim 9 (depends on 8) The repairing structure as claimed in claim 8, wherein the insulation layer covers the whole first repairing line. ### Claim 10 (depends on 8) The repairing structure as claimed in claim 8, wherein the insulation layer partly covers the first repairing line. ### Claim 11 A repairing system for a disconnected defect, comprising: a coating device for forming a first repairing line connecting two ends of a disconnected portion of a scanning line and a second repairing line connecting two ends of a disconnected portion of a data line; and an insulation layer forming device for forming an insulation layer for covering the first repairing line. ### Claim 12 (depends on 11) The repairing system as claimed in claim 11, wherein the insulation layer forming device comprises: a coating positioning module for presetting a position at which the second repairing line is formed and determining a position of an intersection of the first repairing line and the second repairing line according to the preset position at which the second repairing line is formed; and a coating module for forming the insulation layer at the position of the intersection of the first repairing line and the second repairing line with the insulation layer covering the intersection. ### Claim 13 (depends on 12) The repairing system as claimed in claim 12, wherein the coating module comprises: a coating unit for coating an insulation film; and a forming unit for performing a photoresist-coating process, an exposing process, a developing process, an etching process, and a photoresist-stripping process to the insulation film to form the insulation layer. ### Claim 14 (depends on 12) The repairing system as claimed in claim 12, wherein the coating module further comprises a curing unit for curing the insulation layer. ### Claim 15 (depends on 14) The repairing system as claimed in claim 14, wherein the curing unit is a baker or an ultraviolet irradiator. ### Claim 16 (depends on 11) The repairing system as claimed in claim 11, wherein the insulation layer forming device is used for forming the insulation layer partly covering the first repairing line. ### Claim 17 (depends on 11) The repairing system as claimed in claim 11, wherein the insulation layer is used for forming the insulation layer covering the whole first repairing line.