# US 2014/0151897 A1 · Printed circuit board and method for manufacturing the same

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- Number: US 2014/0151897 A1
- Document ID: US20140151897A1
- Status: Published application
- Kind: A1
- Application number: 13/842,216
- Filed: 2013-03-15
- Published: 2014-06-05
- Earliest claimed: 2012-12-04
- Assignees: Samsung Electro-Mechanics Co., Ltd.
- Applicants: Samsung Electro-Mechanics Co., Ltd.
- Inventors: Kyung Don Mun
- Web page: https://patentgrep.com/patent/US20140151897A1

## CPC

- H10W 72/019: {of bond pads}
- H05K 3/427: {initial plating of through-holes in metal-clad substrates}
- H05K 3/0026: {by laser ablation}
- H05K 3/0047: {Drilling of holes}
- H05K 2201/09563: Metal filled via
- H05K 2203/025: Abrading, e.g. grinding or sand blasting
- H05K 2203/107: Using laser light
- H05K 2203/1407: Applying catalyst before applying plating resist
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

Disclosed herein are a printed circuit board, including an insulating layer; a circuit wiring formed on one surface or both surfaces of the insulating layer and made of a single metal layer; a via formed in the insulating layer for interconnecting the circuit wirings through the insulating layer; and a pad layer formed on one surface or both surfaces of the insulating layer and adhered to an end portion of the via, the pad layer being formed of a central portion extended from the via and an outside portion made of the same single metal layer as the circuit wiring, and a method for manufacturing the same.

## Claims

### Claim 1

A printed circuit board, comprising:
an insulating layer;
a circuit wiring formed on one surface or both surfaces of the insulating layer and made of a single metal layer;
a via formed in the insulating layer for interconnecting the circuit wirings through the insulating layer; and
a pad layer formed on one surface or both surfaces of the insulating layer and adhered to an end portion of the via,
wherein the pad layer is formed of a central portion extended from the via and an outside portion made of the same single metal layer as the circuit wiring.

### Claim 2 (depends on 1)

The printed circuit board according to claim 1, further comprising a seed layer formed on a sidewall of the via.

### Claim 3 (depends on 1)

The printed circuit board according to claim 1, wherein the circuit wiring has a thickness of 2 μm to 12 μm.

### Claim 4 (depends on 1)

The printed circuit board according to claim 1, wherein a height of the central portion of the pad layer is the same as that of the outside portion of the pad layer.

### Claim 5

A method for manufacturing a printed circuit board, the method comprising:
(a) preparing an insulating layer having a single metal layer adhered to one surface or both surfaces thereof;
(b) processing a via hole in the insulating layer;
(c) forming a plating layer in the via hole as well as on a surface of the single metal layer;
(d) polishing an upper surface of the single metal layer at a predetermined thickness so as to expose the surface of the single metal layer; and
(e) selectively etching the single metal layer to form a circuit wiring and a pad layer.

### Claim 6 (depends on 5)

The method according to claim 5, wherein step (d) is achieved by a chemical mechanical polishing (CMP) method.

### Claim 7 (depends on 5)

The method according to claim 5, wherein step (c) is achieved by forming a seed layer in the via hole as well as on the surface of the single metal layer and then performing an electrolysis plating using the seed layer as a leading wire.

### Claim 8 (depends on 7)

The method according to claim 7, wherein the seed layer beneath the polished plating layer is removed together with the plating layer at the time of performing step (d).

### Claim 9 (depends on 8)

The method according to claim 8, wherein the seed layer is removed by flash etching or soft etching.

### Claim 10 (depends on 5)

The method according to claim 5, wherein step (e) includes:
adhering a dry film on the surface of the single metal layer exposed to the outside;
forming an opening part in a predetermined position of the dry film;
etching a portion exposed through the opening part in the single metal layer; and
delaminating the dry film.