# US 2014/0151892 A1 · Three dimensional through-silicon via construction

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- Number: US 2014/0151892 A1
- Document ID: US20140151892A1
- Status: Published application
- Kind: A1
- Application number: 13/690,364
- Filed: 2012-11-30
- Published: 2014-06-05
- Earliest claimed: 2012-11-30
- Assignees: NVIDIA Corporation
- Applicants: Nvidia Corporation
- Inventors: Teckgyu Kang; Abraham F. Yee
- Web page: https://patentgrep.com/patent/US20140151892A1

## CPC

- H10W 70/635: {Through-vias}
- H10W 74/111: {the semiconductor body being completely enclosed}
- H10W 90/00: Package configurations
- H10W 90/401: {characterised by multiple insulating or insulated package substrates, interposers or RDLs}
- H10W 70/655: Fan-out layouts
- H10W 72/252: {comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu}
- H10W 74/012: {of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills}
- H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

Embodiments of the present invention include devices having multiple dies packaged together in the same package. The multiple dies are disposed on an interposer which is then disposed on a package substrate. The interposer includes a semiconductor substrate, such as silicon, having vias extending from a front surface of the interposer to a back surface of the interposer. The interposer may be a passive interposer or an active poser. An active interposer includes the functionality of one or more dies and thus reduces the number of dies disposed on the active interposer.

## Claims

### Claim 1

An electronic device, comprising:
a package substrate;
an interposer disposed on and electrically coupled to the package substrate, the interposer including a silicon substrate having a silicon dioxide layer disposed thereon; and
a plurality of dies disposed on and electrically coupled to the interposer.

### Claim 2 (depends on 1)

The electronic device of claim 1, wherein the plurality of dies are arranged in a substantially coplanar configuration.

### Claim 3 (depends on 1)

The electronic device claim of claim 1, further comprising a redistribution layer on an upper surface of the interposer.

### Claim 4 (depends on 3)

The electronic device of claim 3, wherein the interposer includes a plurality of vias extending from the upper surface to a lower surface.

### Claim 5

(canceled)

### Claim 6 (depends on 1)

The electronic device of claim 1, wherein the interposer is a passive interposer.

### Claim 7 (depends on 6)

The electronic device of claim 6, wherein the plurality of dies includes five dies disposed on a single surface of the interposer.

### Claim 8 (depends on 7)

The electronic device of claim 7, wherein the plurality of dies comprise an application processor, a base band component, a memory, an I/O controller, and an RF component.

### Claim 9 (depends on 1)

The electronic device of claim 1, wherein the interposer is an active interposer.

### Claim 10 (depends on 9)

The electronic device of claim 9, wherein the active interposer includes the functionality of a baseband component, an RF component, and an I/O controller.

### Claim 11 (depends on 10)

The electronic device of claim 10, wherein the plurality of dies comprise an application processor and a memory component.

### Claim 12 (depends on 9)

The electronic device of claim 9, wherein the active interposer includes the functionality of an RF component and an I/O controller.

### Claim 13 (depends on 12)

The electronic device of claim 12, wherein the plurality of dies comprise an application processor, a memory component, and a baseband component.

### Claim 14 (depends on 9)

The electronic device of claim 9, wherein the active interposer includes the functionality of an I/O controller.

### Claim 15 (depends on 14)

The electronic device of claim 14, wherein the plurality of dies comprise an application processor, a memory component, an RF component, and a baseband component.

### Claim 16 (depends on 1)

The electronic device of claim 1, further comprising a printed circuit board coupled to the package substrate.

### Claim 17 (depends on 1)

The electronic device of claim 1, further comprising underfill material disposed between the interposer and the package substrate.

### Claim 18 (depends on 17)

The electronic device of claim 17, wherein:
the interposer includes a plurality of vias extending from a front surface of the interposer to a back surface of the interposer; and
the package substrate includes a plurality of vias extending from a front surface of the package substrate to a back surface of the package substrate.

### Claim 19 (depends on 1)

The electronic device of claim 1, wherein the silicon substrate includes vertically-disposed vias therethrough, and the silicon dioxide layer includes redistribution layers disposed therein.