# US 2014/0151872 A1 · Semiconductor module

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- Number: US 2014/0151872 A1
- Document ID: US20140151872A1
- Status: Published application
- Kind: A1
- Application number: 14/095,592
- Filed: 2013-12-03
- Published: 2014-06-05
- Earliest claimed: 2012-12-05
- Assignees: Toyota Jidosha Kabushiki Kaisha
- Inventors: Takaoki Ogawa; Makoto Imai; Shizuyasu Matsubayashi
- Web page: https://patentgrep.com/patent/US20140151872A1

## CPC

- H10W 40/611: {Bolts or screws}
- H10W 90/00: Package configurations
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A semiconductor module includes semiconductor device, at least one cooler, at least one fastening member. The semiconductor device has a flat shape. The at least one cooler is arranged adjacent to the semiconductor device. The at least one fastening member has a pressure-contact part that is configured to apply a pressure to the at least one cooler. Furthermore, the at least one fastening member fastens a layered body including the semiconductor device and the at least one cooler in a layer direction of the layered body. A dent configured to accommodate the pressure-contact part is provided in the at least one cooler.

## Claims

### Claim 1

A semiconductor module comprising:
a semiconductor device having a flat shape;
at least one cooler arranged adjacent to the semiconductor device; and
at least one fastening member having a pressure-contact part configured to apply a pressure to the at least one cooler, the at least one fastening member fastening a layered body including the semiconductor device and the at least one cooler in a layer direction of the layered body, wherein
a dent configured to accommodate the pressure-contact part is provided in the at least one cooler.

### Claim 2 (depends on 1)

The semiconductor module according to claim 1, wherein
the at least one cooler is constituted by a first cooler and a second cooler,
the first cooler and the second cooler are arranged on both sides of the semiconductor device in the layer direction, and
at least one of the first cooler and the second cooler is provided with the dent.

### Claim 3 (depends on 1)

The semiconductor module according to claim 1, wherein
the pressure-contact part is in contact with the at least one cooler.

### Claim 4 (depends on 1)

The semiconductor module according to claim 1, wherein
the at least one fastening member is apart from the semiconductor device.

### Claim 5 (depends on 4)

The semiconductor module according to claim 4, wherein
the at least one fastening member is apart from the semiconductor device in a plane perpendicular to the layer direction.

### Claim 6 (depends on 1)

The semiconductor module according to claim 1, wherein
the at least one fastening member includes a bolt and a nut, and
the pressure-contact part is the nut.

### Claim 7 (depends on 6)

The semiconductor module according to claim 6, wherein
a depth of the dent is larger than a height of the nut.

### Claim 8 (depends on 6)

The semiconductor module according to claim 6, further comprising
a compression spring arranged between the nut and the bottom surface of the dent.

### Claim 9 (depends on 8)

The semiconductor module according to claim 8, wherein
a depth of the dent is larger than a sum of heights of the nut and the spring.

### Claim 10 (depends on 1)

The semiconductor module according to claim 1, wherein
the at least one fastening member is constituted by a first fastening member and a second fastening member, and
the first fastening member and the second fastening member are arranged on both sides of the semiconductor device in a direction perpendicular to the layer direction.

### Claim 11 (depends on 1)

The semiconductor module according to claim 1 further comprising:
a electrode plate arranged between the semiconductor device and the at least one cooler in the layer direction and in direct contact with the semiconductor device; and
an insulator plate arranged between the electrode plate and the at least one cooler in the layer direction.

### Claim 12 (depends on 1)

The semiconductor module according to claim 1, wherein
the at least one cooler s a hollow member containing a coolant passage.