# US 2014/0151871 A1 · Heat spreader with flexible tolerance mechanism > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0151871 A1 - Document ID: US20140151871A1 - Status: Published application - Kind: A1 - Application number: 14/093,768 - Filed: 2013-12-02 - Published: 2014-06-05 - Earliest claimed: 2012-12-04 - Assignees: General Electric Company - Applicants: General Electric Company - Inventors: Gamal Refai-Ahmed - Web page: https://patentgrep.com/patent/US20140151871A1 ## CPC - H10W 40/611: {Bolts or screws} - H10W 40/037: {Assembling together parts thereof} - H10W 40/22: characterised by their shape, e.g. having conical or cylindrical projections - H10W 40/70: Fillings or auxiliary members in containers or in encapsulations for thermal protection or control - H10W 40/77: Auxiliary members characterised by their shape - H10W 70/099: {Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers} - H10W 70/65: Shapes or dispositions of interconnections - H10W 40/60: Securing means for detachable heating or cooling arrangements, e.g. clamps - H10W 76/40: Fillings or auxiliary members in containers, e.g. centering rings (fillings or auxiliary members for thermal protection or control in containers or encapsulations H10W40/70) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A semiconductor device packaging system includes a substrate, a heat spreader, a stiffener attached to the substrate, and at least one die electrically coupled to the substrate and thermally coupled to the heat spreader. The semiconductor device packaging system further includes at least one stud coupled to one of the stiffener and the heat spreader and at least one orifice formed through one of the stiffener and the heat spreader. In addition, the at least one orifice is aligned with the at least one stud. ## Claims ### Claim 1 A semiconductor device packaging system comprising: a substrate; a heat spreader; a stiffener attached to the substrate; at least one die electrically coupled to the substrate and thermally coupled to the heat spreader; at least one stud coupled to one of the stiffener and the heat spreader; and at least one orifice formed through one of the stiffener and the heat spreader, the at least one orifice aligned with the at least one stud. ### Claim 2 (depends on 1) The system of claim 1 wherein an air gap is disposed between the stiffener and the heat spreader. ### Claim 3 (depends on 1) The system of claim 1 further comprising an interposer electrically coupled to the substrate, wherein the interposer is displaced between the substrate and the at least one die. ### Claim 4 (depends on 3) The system of claim 3 wherein the interposer provides power connectivity and signal connectivity between the substrate and the at least one die. ### Claim 5 (depends on 3) The system of claim 3 wherein the interposer is one of a passive circuit device and an active circuit device. ### Claim 6 (depends on 1) The system of claim 1 wherein the at least one stud and the at least one orifice enables alignment of the heat spreader, the stiffener, and the least one die; and a thermal interface material is disposed between the at least one die and the heat spreader. ### Claim 7 (depends on 6) The system of claim 6 wherein the thermal interface material is compressed between the at least one die and the heat spreader. ### Claim 8 (depends on 1) The system of claim 1 wherein the at least one stud includes a plated layer, wherein the plated layer establishes a bond between the at least one stud and the heat spreader when subjected to a heating process. ### Claim 9 (depends on 8) The system of claim 8 wherein the plated layer can be one of a two-phase material and a liquid metal material. ### Claim 10 (depends on 1) The system of claim 1 wherein the at least one die is at least one of a high power device and a low power device. ### Claim 11 (depends on 1) The system of claim 1 wherein the at least one die comprises a plurality of dies, wherein at least one of the plurality of dies is a high power device and at least another of the plurality of dies is a low power device. ### Claim 12 A method of assembling a semiconductor device package comprising: electrically coupling at least one die with a substrate; coupling a stiffener to the substrate; coupling at least one stud to one of the stiffener and a heat spreader; forming at least one orifice through one of the stiffener and the heat spreader; aligning the at least one stud with the at least one orifice to align the heat spreader, the stiffener, and the at least one die; and thermally coupling the heat spreader with the at least one die. ### Claim 13 (depends on 12) The method of claim 12 further comprising inserting an interposer between the at least one die and the substrate. ### Claim 14 (depends on 12) The method of claim 12 further comprising disposing a thermal interface material between the at least one die and the heat spreader. ### Claim 15 (depends on 12) The method of claim 12 further comprising applying a plated layer to the at least one stud. ### Claim 16 (depends on 15) The method of claim 15 further comprising heating the at least one stud, the plated layer, and the orifice to establish a bond between the at least one stud and the at least one orifice. ### Claim 17 A flexible tolerance heat spreader for use with a semiconductor device package, the flexible tolerance heat spreader comprising: at least one support path formed therethrough; wherein the at least one support path interacts with at least one stud coupled to a stiffener of the semiconductor device package; wherein the flexible tolerance heat spreader is variably positioned along a direction of the interaction of the at least one support path and the at least one stud to establish guidance of the flexible tolerance heat spreader to provide thermal contact with at least one die of the substrate. ### Claim 18 (depends on 17) The flexible tolerance heat spreader of claim 17 wherein a thermal interface material initiates thermal contact between the flexible tolerance heat spreader and the at least one die of the substrate. ### Claim 19 (depends on 18) The flexible tolerance heat spreader of claim 18 wherein the thermal interface material is deformed when the flexible tolerance heat spreader and the at least one die of the substrate are placed in thermal contact. ### Claim 20 (depends on 17) The flexible tolerance heat spreader of claim 17 wherein the at least one stud has a plated layer. ### Claim 21 (depends on 20) The flexible tolerance heat spreader of claim 20 wherein the plated layer of the at least one stud establishes a bond between the at least one stud and the flexible tolerance heat spreader when heated. ### Claim 22 (depends on 21) The flexible tolerance heat spreader of claim 21 wherein the plated layer can be one of a two-phase material and a liquid metal material.