# US 2014/0151869 A1 · Integrated heater on mems cap for wafer scale packaged mems sensors

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- Number: US 2014/0151869 A1
- Document ID: US20140151869A1
- Status: Published application
- Kind: A1
- Application number: 14/176,964
- Filed: 2014-02-10
- Published: 2014-06-05
- Earliest claimed: 2011-06-29
- Assignees: InvenSense, Inc.
- Applicants: Invensense, Inc.
- Inventors: Goksen G. YARALIOGLU; Martin LIM
- Web page: https://patentgrep.com/patent/US20140151869A1

## CPC

- B81B 7/0087: {On-device systems and sensors for controlling, regulating or monitoring}
- B81C 1/0069: {Thermal properties, e.g. improve thermal insulation}
- H10W 40/10: Arrangements for heating
- B81B 2207/012: the micromechanical device and the control or processing electronics being separate parts in the same package
- B81B: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/00, H10N35/00)
- B81C: PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS (making microcapsules or microballoons B01J13/02; processes or apparatus specially adapted for the manufacture or treatment of piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/01)
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A system and method for controlling temperature of a MEMS sensor are disclosed. In a first aspect, the system comprises a MEMS cap encapsulating the MEMS sensor and a CMOS die vertically arranged to the MEMS cap. The system includes a heater integrated into the MEMS cap. The integrated heater is activated to control the temperature of the MEMS sensor. In a second aspect, the method comprises encapsulating the MEMS sensor with a MEMS cap and coupling a CMOS die to the MEMS cap. The method includes integrating a heater into the MEMS cap. The integrated heater is activated to control the temperature of the MEMS sensor.

## Claims

### Claim 1

A system for controlling temperature of a MEMS sensor, the system comprising:
a MEMS cap encapsulating the MEMS sensor; and
a heater integrated into the MEMS cap, wherein the integrated heater is activated to adjust the temperature of the MEMS sensor.

### Claim 2 (depends on 1)

The system of claim 1, further comprising a CMOS die vertically arranged to the MEMS cap.

### Claim 3 (depends on 2)

The system of claim 2, wherein the MEMS sensor is coupled to the CMOS die.

### Claim 4 (depends on 2)

The system of claim 2, further comprising:
a package fabricated to encapsulate the MEMS sensor, the MEMS cap with the integrated heater, and the CMOS die.

### Claim 5 (depends on 1)

The system of claim 1, further comprising:
a package fabricated to encapsulate the MEMS sensor, and the MEMS cap with the integrated heater.

### Claim 6 (depends on 5)

The system of claim 5, wherein terminals of the integrated heater are connected directly to at least one pad of the package via at least one wire bond.

### Claim 7 (depends on 1)

The system of claim 1, wherein the integrated heater is a resistive element.

### Claim 8 (depends on 1)

The system of claim 1, wherein the integrated heater is a single crystal silicon resistive element.

### Claim 9 (depends on 2)

The system of claim 2, wherein a current applied to activate the integrated heater is controlled by any of an external source and the CMOS die.

### Claim 10 (depends on 1)

The system of claim 1, further comprising a temperature sensor to measure the temperature of the system.

### Claim 11 (depends on 4)

The system of claim 4, further comprising a temperature sensor, wherein the temperature sensor resides in the package.

### Claim 12 (depends on 4)

The system of claim 4, further comprising a temperature sensor, wherein the temperature sensor is external to the package.

### Claim 13 (depends on 2)

The system of claim 2, further comprising a temperature sensor, wherein the temperature sensor resides in the CMOS die.

### Claim 14 (depends on 2)

The system of claim 2, further comprising a temperature sensor and electronic circuits in the CMOS die, connected to the temperature sensor.

### Claim 15 (depends on 1)

The system of claim 1, wherein the MEMS sensor is a temperature sensor.

### Claim 16 (depends on 2)

The system of claim 2, further comprising electronic circuits in the CMOS die to store temperature dependence data of the MEMS sensor.

### Claim 17 (depends on 2)

The system of claim 2, wherein terminals of the integrated heater are connected to the CMOS die.

### Claim 18 (depends on 17)

The system of claim 17, wherein the terminals of the integrated heater are connected to the CMOS die by eutectic bonding.

### Claim 19

A method for controlling temperature of a MEMS sensor, the method comprising:
encapsulating a MEMS sensor with a MEMS cap;
coupling a CMOS die to the MEMS cap;
integrating a heater into the MEMS cap; and
activating the integrated heater to adjust temperature of the MEMS sensor.

### Claim 20 (depends on 19)

The method of claim 19 further comprising:
fabricating a package to encapsulate the MEMS sensor, the MEMS cap with integrated heater, and the CMOS die.

### Claim 21 (depends on 19)

The method of claim 19, further comprising:
connecting terminals of the integrated heater to at least one pad of the package via at least one wire bond.

### Claim 22 (depends on 19)

The method of claim 19, further comprising:
connecting terminals of the integrated heater to the CMOS die.

### Claim 23 (depends on 19)

The method of claim 19, further comprising:
adjusting a current applied to activate the integrated heater by any of an external source and the CMOS die.