# US 2014/0151861 A1 · Managing Method of Building Material and Wireless Chip Applied to the Method

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- Number: US 2014/0151861 A1
- Document ID: US20140151861A1
- Status: Published application
- Kind: A1
- Application number: 14/173,378
- Filed: 2014-02-05
- Published: 2014-06-05
- Earliest claimed: 2005-04-19
- Assignees: Semiconductor Energy Laboratory Co., Ltd.
- Applicants: Semiconductor Energy Laboratory Co., Ltd.
- Inventors: Yoshinobu Asami
- Web page: https://patentgrep.com/patent/US20140151861A1

## CPC

- H10W 44/20: at high-frequency [HF] or radio frequency [RF]
- G06Q 10/06: Resources, workflows, human or project management; Enterprise or organisation planning; Enterprise or organisation modelling
- H10P 95/00: Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- G06Q: INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10

## Abstract

A lot of buildings have been built while it is concerned that a building material is used fraudulently. Therefore, the present invention provides a managing method of the material and a system thereof. The present invention provides a managing method including a step of attaching a sheet including a plurality of memories to each surface of a plurality of materials, a step of dividing the plurality of materials with the sheet in accordance with data in the memory, a step of constructing a building by using the divided material in accordance with the data in the memory, and a step of checking the data on the constructed building, which is stored in the plurality of memories.

## Claims

### Claim at position 1

1-31. (canceled)

### Claim 32

A wireless chip comprising:
an adhesive layer having a first portion and a second portion over a material;
a barrier layer over the adhesive layer;
a sheet including a plurality of wireless chips attached to the material via the adhesive layer and the barrier layer, each of the plurality of wireless chips comprising an integrated circuit portion; and
an antenna configured to supply power to the integrated circuit portion,
wherein the first portion and the wireless chip overlap each other, and
wherein adhesive intensity of the first portion is higher than that of the second portion.

### Claim 33

A wireless chip comprising:
an adhesive layer having a first portion and a second portion over a material;
a barrier layer over the adhesive layer;
a sheet including a plurality of wireless chips attached to the material via the adhesive layer and the barrier layer, each of the plurality of wireless chips comprising an integrated circuit portion; and
an antenna configured to supply power to the integrated circuit portion,
wherein the first portion and the wireless chip overlap each other,
wherein an edge of the second portion and the wireless chip overlap each other, and
wherein adhesive intensity of the first portion is higher than that of the second portion.

### Claim 34 (depends on 32)

The wireless chip according to claim 32, further comprising:
a protective layer over the adhesive layer.

### Claim 35 (depends on 33)

The wireless chip according to claim 33, further comprising:
a protective layer over the adhesive layer.

### Claim 36 (depends on 32)

The wireless chip according to claim 32, wherein the wireless chip includes a plurality of memories.

### Claim 37 (depends on 33)

The wireless chip according to claim 33, wherein the wireless chip includes a plurality of memories.

### Claim 38 (depends on 32)

The wireless chip according to claim 32, wherein the integrated circuit portion is configured to store data on the material.

### Claim 39 (depends on 33)

The wireless chip according to claim 33, wherein the integrated circuit portion is configured to store data on the material.

### Claim 40

A semiconductor device comprising:
an adhesive layer having a first portion and a second portion, the adhesive layer configured to attach to a material; and
a sheet including a wireless chip over and attached to the adhesive layer,
wherein the first portion and the wireless chip overlap each other, and
wherein adhesive intensity of the first portion is higher than adhesive intensity of the second portion.

### Claim 41 (depends on 40)

The semiconductor device according to claim 40, further comprising:
a barrier layer between the adhesive layer and the sheet.

### Claim 42 (depends on 40)

The semiconductor device according to claim 40, further comprising:
a protective layer over the adhesive layer.

### Claim 43 (depends on 40)

The semiconductor device according to claim 40,
wherein the wireless chip comprising a memory and an integrated circuit portion, and
wherein the integrated circuit portion is configured to store data on the material.

### Claim 44 (depends on 40)

The semiconductor device according to claim 40, wherein the second portion is configured to be peeled off by power to feel off the sheet from the material, and the first portion is configured to remain to attach to the material by the power.