# US 2014/0151860 A1 · Wireless module

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- Number: US 2014/0151860 A1
- Document ID: US20140151860A1
- Status: Published application
- Kind: A1
- Application number: 14/131,548
- Filed: 2013-02-01
- Published: 2014-06-05
- Earliest claimed: 2012-02-15
- Assignees: Panasonic Corporation
- Applicants: Panasonic Corporation
- Inventors: Toshiaki Nakamura; Suguru Fujita; Maki Nakamura; Ryosuke Shiozaki; Jun'ichi Kimura; Hirokazu Kitamura
- Web page: https://patentgrep.com/patent/US20140151860A1

## CPC

- H10W 44/20: at high-frequency [HF] or radio frequency [RF]
- H01Q 1/2283: {mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package}
- H01Q 9/0407: {Substantially flat resonant element parallel to ground plane, e.g. patch antenna (dipole H01Q9/285; monopole H01Q9/40)}
- H05K 1/0222: {for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence}
- H05K 1/0231: {Capacitors or dielectric substances}
- H05K 1/0251: {related to vias or transitions between vias and transmission lines}
- H05K 2201/10098: Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
- H05K 2201/10734: Ball grid array [BGA]; Bump grid array
- H05K 2201/2036: Permanent spacer or stand-off in a printed circuit or printed circuit assembly
- H10W 44/248: {for antennas}
- H10W 70/63: Vias, e.g. via plugs
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72)
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

A wireless module includes a first board which has a first component mounted thereon, a second board which faces the first board and has a second component mounted thereon, a connecting member which is provided between the first board and the second board and transmits a signal between the first board and the second board, and a filling material with which a space between the first board and the second board including the connecting member is sealed. A conductive member for connecting a ground between the first board and the second board is arranged in a periphery of the connecting member.

## Claims

### Claim 1

A wireless module, comprising:
a first board which has a first component mounted thereon;
a second board which faces the first board and has a second component mounted thereon;
a connecting member which is provided between the first board and the second board, and transmits a signal between the first board and the second board;
a filling material with which a space between the first board and the second board including the connecting member is sealed; and
a conductive member, arranged in a periphery of the connecting member, for connecting a ground between the first board and the second board.

### Claim 2 (depends on 1)

The wireless module according to claim 1, wherein
the conductive member is a plurality of conductive spheres which are arranged at a plurality of positions surrounding the connecting member.

### Claim 3 (depends on 1)

The wireless module according to claim 1, wherein
the conductive member is a conductive tubular frame member surrounding the connecting member, and
the second board includes:
a first layer board which has the second component mounted thereon; and
a second layer board which has a wiring for transmitting a signal between the second component and the connecting member formed thereon.

### Claim 4 (depends on 1)

The wireless module according to claim 1, wherein
the conductive member is a U-shaped conductive member which surrounds the connecting member, while partly opening the periphery of the connecting member.

### Claim 5 (depends on 1)

The wireless module according to claim 1, wherein
a coaxial member is arranged between the first board and the second board, wherein the coaxial member has an inner conductor as the connecting member and an outer conductor as the conductive member which are coaxially integrated.

### Claim 6 (depends on 2)

The wireless module according to claim 2, wherein the number of conductive spheres is at least three.

### Claim 7 (depends on 1)

The wireless module according to claim 1, wherein
the first component is an antenna.

### Claim 8 (depends on 1)

The wireless module according to claim 1, wherein
the connecting member has a same shape as that of the conductive member.