# US 2014/0151849 A1 · Electronic components on trenched substrates and method of forming same

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- Number: US 2014/0151849 A1
- Document ID: US20140151849A1
- Status: Published application
- Kind: A1
- Application number: 14/157,755
- Filed: 2014-01-17
- Published: 2014-06-05
- Earliest claimed: 2007-02-27
- Assignees: International Business Machines Corporation
- Applicants: International Business Machines Corporation
- Inventors: David Questad; Vijayeshwar D. Khanna; Jennifer V. Muncy; Arun Sharma; Sri M. Sri-Jayantha; Lorenzo Valdevit
- Web page: https://patentgrep.com/patent/US20140151849A1

## CPC

- H10D 1/68: Capacitors having no potential barriers
- H05K 1/0271: {Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion}
- H05K 3/3442: {having edge contacts, e.g. leadless chip capacitors, chip carriers}
- H05K 1/0231: {Capacitors or dielectric substances}
- H05K 1/111: {Pads for surface mounting, e.g. lay-out}
- H05K 3/3436: {having an array of bottom contacts, e.g. pad grid array or ball grid array components}
- H05K 2201/09036: Recesses or grooves in insulating substrate
- H05K 2201/10015: Non-printed capacitor
- H05K 2201/10727: Leadless chip carrier [LCC], e.g. chip-modules for cards
- H10W 70/655: Fan-out layouts
- H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product
- Y10T 29/4913: Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T 428/24479: including variation in thickness
- H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

An electronic module includes a substrate including at least one structure that reduces stress flow through the substrate, wherein the structure includes at least one trench in a surface of the substrate, and a plurality of capacitor legs disposed on an upper surface of the substrate.

## Claims

### Claim 1

An electronic module, comprising:
a substrate including at least one structure that reduces stress flow through the substrate, wherein said structure comprises at least one trench in a surface of the substrate; and
a plurality of capacitor legs disposed on an upper surface of the substrate.

### Claim 2 (depends on 1)

The electronic module in accordance with claim 1, wherein said at least one trench is formed around the plurality of capacitor legs, said capacitor legs mounting an electronic component to the substrate.

### Claim 3 (depends on 1)

The electronic module in accordance with claim 1, wherein said at least one trench comprises:
a first trench formed around a first row of the capacitor legs; and
a second trench formed around a second row of the capacitor legs.

### Claim 4 (depends on 1)

The electronic module in accordance with claim 1, wherein said at least one trench comprises a continuous trench.

### Claim 5 (depends on 1)

The electronic module in accordance with claim 1, wherein a plurality of continuous trenches are formed around the plurality of capacitor legs.

### Claim 6 (depends on 1)

The electronic module in accordance with claim 1, wherein a plurality of individual trenches are formed around the plurality of capacitor legs.

### Claim 7 (depends on 1)

The electronic module in accordance with claim 1, wherein the surface comprises the upper surface of the substrate.

### Claim 8 (depends on 1)

The electronic module in accordance with claim 1, wherein the surface comprises a surface on which an electronic component is mounted.

### Claim 9 (depends on 1)

The electronic module in accordance with claim 1, wherein said at least one trench comprises a plurality of continuous trenches foamed around the plurality of capacitor legs.

### Claim 10 (depends on 1)

The electronic module in accordance with claim 1, wherein said trench is formed in the upper surface of the substrate around each of the plurality of capacitor legs.

### Claim 11

An electronic module, comprising:
a substrate;
an electronic component mounted above the substrate;
a plurality of capacitor legs disposed on an upper surface of the substrate, the plurality of capacitor legs mounting the electronic component above the substrate; and
at least one trench formed around the plurality of capacitor legs.

### Claim 12 (depends on 11)

The electronic module according to claim 11, wherein the plurality of capacitor legs comprises a first row of capacitor legs and a second row of capacitor legs, and
wherein the at least one trench comprises one of a plurality of trenches, the plurality of trenches comprising a first trench formed around the first row of capacitor legs and a second trench formed around a second row of capacitor legs.

### Claim 13 (depends on 11)

The electronic module according to claim 11, wherein the at least one trench comprises:
a first trench formed around a first row of the capacitor legs; and
a second trench formed around a second row of the capacitor legs.

### Claim 14 (depends on 11)

The electronic module according to claim 11, wherein said at least one trench comprises a plurality of individual trenches, said individual trenches being formed around the plurality of capacitor legs.

### Claim 15

An electronic module, comprising:
a substrate; and
at least one trench in a surface of the substrate, said at least one trench being formed around a plurality of capacitor legs disposed on an upper surface of the substrate, said capacitor legs mounting an electronic component to the substrate.

### Claim 16 (depends on 15)

The electronic module in accordance with claim 15, wherein the at least one trench comprises a plurality of trenches.