# US 2014/0151740 A1 · Micro-Structure Phosphor Coating

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 2014/0151740 A1
- Document ID: US20140151740A1
- Status: Published application
- Kind: A1
- Application number: 14/174,891
- Filed: 2014-02-07
- Published: 2014-06-05
- Earliest claimed: 2010-09-20
- Assignees: TSMC Solid State Lighting Ltd.
- Applicants: TSMC Solid State Lighting Ltd.
- Inventors: Chi Xiang Tseng; Hsiao-Wen Lee
- Web page: https://patentgrep.com/patent/US20140151740A1

## CPC

- H10H 20/8514: {characterised by their shape, e.g. plate or foil}
- H10H 20/853: characterised by their shape
- H10H 20/0361: {of wavelength conversion means}
- H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

An optical emitter includes micro-structure phosphor coating on a light-emitting diode die mounted on a package substrate. The micro-structures are transferred onto a micro-structure phosphor coating precursor by patterning and curing the precursor or by curing the precursor through a mold. The micro-structures are half spheroids, three-sided pyramids, or six-sided pyramids.

## Claims

### Claim 1

An optical emitter comprising: a package substrate; a light-emitting diode (LED) die mounted on the package substrate, the LED die comprising an LED; a layer of micro-structure phosphor coating on a surface of the LED die opposite from the package substrate; and a lens over the layer of micro-structure phosphor coating and the LED die, the lens attached to the package substrate.

### Claim 2 (depends on 1)

The optical emitter of claim 1, further comprising a layer of conformal phosphor coating between the layer of micro-structure phosphor coating and the surface of the LED die opposite from the package substrate.

### Claim 3 (depends on 1)

The optical emitter of claim 1, wherein the layer of micro-structure phosphor coating comprises a plurality of micro-structures having a pitch of about 10 to 50 microns.

### Claim 4 (depends on 3)

The optical emitter of claim 3, wherein the micro-structures are half spheroids.

### Claim 5 (depends on 3)

The optical emitter of claim 3, wherein the micro-structures are pyramids.

### Claim 6 (depends on 5)

The optical emitter of claim 5, wherein the pyramids are three-sided or six-sided.

### Claim 7 (depends on 1)

The optical emitter of claim 1, wherein the layer of micro-structure phosphor coating has a thickness of about 10-50 microns.

### Claim 8 (depends on 3)

The optical emitter of claim 3, wherein the layer of micro-structure phosphor coating has non-uniform micro-structure density.

### Claim 9 (depends on 3)

The optical emitter of claim 3, wherein the layer of micro-structure phosphor coating includes micro-structures of different shapes.

### Claim 10 (depends on 3)

The optical emitter of claim 3, wherein the layer of micro-structure phosphor coating includes hardened ultraviolet (UV) gel, thermal gel, or photoresist.

### Claim 11

An optical emitter, comprising:
a package substrate;
a light-emitting diode (LED) disposed over the package substrate;
a plurality of phosphor micro-structures disposed over the LED, wherein each of the phosphor micro-structures have a non-planar shape; and
a lens disposed over the package substrate, wherein the LED and the phosphor micro-structures disposed thereover are housed within the lens.

### Claim 12 (depends on 11)

The optical emitter of claim 11, wherein the LED is flip-chip bonded to the package substrate through a conductive layer disposed between the LED and the package substrate.

### Claim 13 (depends on 11)

The optical emitter of claim 11, wherein the phosphor micro-structures are each shaped as a half spheroid or a multi-sided pyramid.

### Claim 14 (depends on 11)

The optical emitter of claim 11, further comprising: a cured uniform coating precursor layer disposed between the LED and the phosphor micro-structures.

### Claim 15 (depends on 11)

The optical emitter of claim 11, wherein the plurality of phosphor micro-structures have a pitch in a range from about 10 microns to about 50 microns.

### Claim 16 (depends on 11)

The optical emitter of claim 11, wherein the plurality of phosphor micro-structures each have a thickness in a range from about 10 microns to about 50 microns.

### Claim 17

An optical emitter, comprising:
a package substrate;
a conductive layer disposed over the package substrate;
a light-emitting diode (LED) die bonded to the package substrate through the conductive layer;
a phosphor layer disposed over the LED die, wherein the phosphor layer contains a plurality of phosphor elements that are each shaped as a half spheroid or as a multi-sided pyramid; and
a lens disposed over the package substrate, wherein the LED die and the phosphor layer are located underneath the lens.

### Claim 18 (depends on 17)

The optical emitter of claim 17, wherein the LED die is flip-chip bonded to the package substrate through the conductive layer.

### Claim 19 (depends on 17)

The optical emitter of claim 17, further comprising: a cured uniform coating precursor layer disposed between the LED die and the phosphor layer.

### Claim 20 (depends on 17)

The optical emitter of claim 17, wherein:
the plurality of phosphor elements have a pitch in a range from about 10 microns to about 50 microns; and
the phosphor layer has a thickness in a range from about 10 microns to about 50 microns.