# US 2014/0151737 A1 · Light emitting device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0151737 A1 - Document ID: US20140151737A1 - Status: Published application - Kind: A1 - Application number: 14/172,782 - Filed: 2014-02-04 - Published: 2014-06-05 - Earliest claimed: 2010-08-25 - Assignees: Nichia Corporation - Applicants: Nichia Corporation - Inventors: Takayoshi WAKAKI - Web page: https://patentgrep.com/patent/US20140151737A1 ## CPC - H10H 20/84: Coatings, e.g. passivation layers or antireflective coatings - H10H 20/825: containing nitrogen, e.g. GaN - H10H 20/831: characterised by their shape - H10H 20/8506: {Containers} - H10H 20/8512: {Wavelength conversion materials} - H10H 20/856: Reflecting means - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - H10W 72/01515: {Forming coatings} - H10W 72/075: {of bond wires} - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A light emitting device includes an electrically conductive member provided with a reflective film; a light emitting element mounted on the reflective film; and a protective film continuously covering a surface of the light emitting element and a surface of the reflective film. A thickness of the protective film on the reflective film in a vicinity of the light emitting element is substantially equal to a thickness of the protective film on the reflective film in the region except for the vicinity of the light emitting element. ## Claims ### Claim at position 1 -9. (canceled) ### Claim 10 A light emitting device comprising: an electrically conductive member provided with a reflective film; a light emitting element mounted on the reflective film; and a protective film continuously covering a surface of the light emitting element and a surface of the reflective film wherein a thickness of the protective film on the reflective film in a vicinity of the light emitting element is substantially equal to a thickness of the protective film on the reflective film in the region except for the vicinity of the light emitting element. ### Claim 11 (depends on 14) The light emitting device according to claim 14, wherein the light emitting element is connected to the reflective film with a wire, and wherein the protective film is formed so as to fill a gap formed between an edge portion of the wire connected to the reflective film and the reflective film. ### Claim 12 (depends on 15) The light emitting device according to claim 15, wherein the protective film is formed on the reflective film around the edge portion of the wire with a substantially equal thickness. ### Claim 13 (depends on 15) The light emitting device according to claim 15, wherein a thickness of the protective film on the reflective film in a vicinity of the edge portion of the wire is substantially equal to a thickness of the protective film on the reflective film in a region except for the vicinity of the edge portion of the wire. ### Claim 14 (depends on 10) The light emitting device according to claim 10, further comprising a package having a side wall on the electrically conductive member, wherein a thickness of the protective film formed on a vicinity of the side wall is substantially equal to a thickness of the protective film formed on a surface except for the vicinity of the side wall. ### Claim 15 (depends on 10) The light emitting device according to claim 10, wherein the protective film is formed by means of an atomic layer deposition method. ### Claim 16 (depends on 10) The light emitting device according to claim 10, wherein the reflective film contains silver. ### Claim 17 (depends on 10) The light emitting device according to claim 10, wherein the protective film is made of aluminum oxide or silicon dioxide. ### Claim 18 (depends on 10) The light emitting device according to claim 10, wherein a thickness of the protective film is 1 nm or greater and less than 50 nm. ### Claim 19 (depends on 10) The light emitting device according to claim 10, wherein a thickness of the protective film is 2 nm or greater and less than 25 nm. ### Claim 20 (depends on 10) The light emitting device according to claim 10, wherein a thickness of the protective film is 3 nm or greater and less than 10 nm. ### Claim 21 (depends on 14) The light emitting device according to claim 14, further comprising a sealing member formed in a recess defined by the side wall (of the package). ### Claim 22 (depends on 21) The light emitting device according to claim 21, wherein the sealing member is made of a silicone resin or an epoxy resin. ### Claim 23 (depends on 21) The light emitting device according to claim 21, wherein the sealing member contains a fluorescent substance. ### Claim 24 (depends on 23) The light emitting device according to claim 23, wherein the fluorescent substance contains one selected from a group consisting of a YAG-based fluorescent substance, a TAG-based fluorescent substance and a strontium silicate-based fluorescent substance. ### Claim 25 (depends on 11) The light emitting device according to claim 11, wherein the wire contains silver. ### Claim 26 (depends on 11) The light emitting device according to claim 11, wherein the protective film is formed on the entire surface of the wire. ### Claim 27 (depends on 10) The light emitting device according to claim 10, wherein the light emitting element is made of a nitride semiconductor. ### Claim 28 (depends on 14) The light emitting device according to claim 14, wherein the package is made of a resin. ### Claim 29 (depends on 10) The light emitting device according to claim 10, wherein the package is made of a ceramic. ### Claim 30 (depends on 10) The light emitting device according to claim 10, wherein the electrically conductive member comprises a base member and the reflective film on the base member, and wherein the base member containing copper. ### Claim 31 (depends on 10) The light emitting device according to claim 10, wherein the light emitting element is mounted on the reflective film with interposing an adhesive member therebetween, the adhesive member comprising one selected from a group of an Au—Sn alloy, a SnAgCu alloy, a SnPb alloy, an InSn alloy, Ag and Sn. ### Claim 32 A light emitting device comprising: an electrically conductive member provided with a reflective film; a light emitting element mounted on the reflective film; a wire having an edge portion connected to the reflective film, the wire connecting the light emitting element to the reflective film, and a protective film continuously covering a surface of the light emitting element, a surface of the reflective film and a surface of the wire, wherein a thickness of the protective film on the reflective film in a vicinity of the edge portion of the wire is substantially equal to a thickness of the protective film on the reflective film in a region except for the vicinity of the edge portion of the wire. ### Claim 33 (depends on 32) The light emitting device according to claim 32, further comprising a package having a side wall on the electrically conductive member, wherein a thickness of the protective film formed on a vicinity of the side wall is substantially equal to a thickness of the protective film formed on a surface except for the vicinity of the side wall. ### Claim 34 (depends on 32) The light emitting device according to claim 32, wherein the protective film is formed by means of an atomic layer deposition method. ### Claim 35 (depends on 32) The light emitting device according to claim 32, wherein the reflective film contains silver. ### Claim 36 (depends on 32) The light emitting device according to claim 32, wherein the protective film is made of aluminum oxide or silicon dioxide. ### Claim 37 (depends on 32) The light emitting device according to claim 32, wherein a thickness of the protective film is 1 nm or greater and less than 50 nm. ### Claim 38 (depends on 32) The light emitting device according to claim 32, wherein a thickness of the protective film is 2 nm or greater and less than 25 nm. ### Claim 39 (depends on 32) The light emitting device according to claim 32, wherein a thickness of the protective film is 3 nm or greater and less than 10 nm. ### Claim 40 (depends on 33) The light emitting device according to claim 33, further comprising a sealing member formed in a recess defined by the side wall of the package. ### Claim 41 (depends on 40) The light emitting device according to claim 40, wherein the sealing member is made of a silicone resin or an epoxy resin. ### Claim 42 (depends on 40) The light emitting device according to claim 40, wherein the sealing member contains a fluorescent substance. ### Claim 43 (depends on 42) The light emitting device according to claim 42, wherein the fluorescent substance contains one selected from a group consisting of a YAG-based fluorescent substance, a TAG-based fluorescent substance and a strontium silicate-based fluorescent substance. ### Claim 44 (depends on 32) The light emitting device according to claim 32, wherein the wire contains silver. ### Claim 45 (depends on 32) The light emitting device according to claim 32, wherein the light emitting element is made of a nitride semiconductor. ### Claim 46 (depends on 33) The light emitting device according to claim 33, wherein the package is made of a resin. ### Claim 47 (depends on 33) The light emitting device according to claim 33, wherein the package is made of a ceramic. ### Claim 48 (depends on 32) The light emitting device according to claim 32, wherein the electrically conductive member comprises a base member and the reflective film on the base member, and wherein the base member containing copper. ### Claim 49 (depends on 32) The light emitting device according to claim 32, wherein the light emitting element is mounted on the reflective film with interposing an adhesive member therebetween, the adhesive member comprising one selected from a group of an Au—Sn alloy, a SnAgCu alloy, a SnPb alloy, an InSn alloy, Ag and Sn.