# US 2014/0151734 A1 · Light-emitting device and method for manufacturing same

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- Number: US 2014/0151734 A1
- Document ID: US20140151734A1
- Status: Published application
- Kind: A1
- Application number: 14/147,426
- Filed: 2014-01-03
- Published: 2014-06-05
- Earliest claimed: 2011-07-19
- Assignees: Panasonic Corporation
- Applicants: Panasonic Corporation
- Inventors: Kenichi ITO; Yoshiyuki IDE; Hideaki USUKUBO; Koji NAKATSU; Takafumi UCHIDA
- Web page: https://patentgrep.com/patent/US20140151734A1

## CPC

- H10H 20/855: Optical field-shaping means, e.g. lenses
- H10H 20/851: Wavelength conversion means
- H10H 20/856: Reflecting means
- H10W 72/0198: {batch processes}
- H10H 20/0361: {of wavelength conversion means}
- H10H 20/0362: {of encapsulations}
- H10H 20/0363: {of optical field-shaping means}
- H10H 20/854: characterised by their material, e.g. epoxy or silicone resins
- H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A light-emitting device includes: a substrate; a light-emitting element mounted on the substrate, with a surface opposite to a light-emitting surface facing the substrate; a first resin encapsulant which covers the light-emitting element such that at least part of the light-emitting surface is exposed; and a second resin encapsulant provided on and in contact with the first resin encapsulant and the light-emitting surface. The first resin encapsulant contains a light reflective material. The second resin encapsulant has a function of converting first light emitted by the light-emitting element into second light of different wavelength, and a function of mixing the first light and the second light.

## Claims

### Claim 1

A light-emitting device, comprising:
a substrate;
a light-emitting element mounted on the substrate, with a surface opposite to a light-emitting surface facing the substrate;
a first resin encapsulant which covers the light-emitting element such that at least part of the light-emitting surface is exposed; and
a second resin encapsulant provided on and in contact with the first resin encapsulant and the light-emitting surface, wherein
the first resin encapsulant contains a light reflective material, and
the second resin encapsulant includes a first layer containing a light wavelength conversion material which absorbs first light and emits second light, and a transparent resin layer provided under the first layer and in contact with the light-emitting surface.

### Claim 2 (depends on 1)

The light-emitting device of claim 1, wherein
the second resin encapsulant includes a second layer provided on the first layer and containing a light diffusing material which diffuses the first light and the second light.

### Claim 3 (depends on 1)

The light-emitting device of claim 1, further comprising:
a protection element mounted on the substrate, wherein
the first resin encapsulant covers an upper surface of the protection element.

### Claim 4

A light-emitting device, comprising:
a substrate;
a light-emitting element mounted on the substrate, with a surface opposite to a light-emitting surface facing the substrate;
a first resin encapsulant which covers the light-emitting element such that at least part of the light-emitting surface is exposed; and
a second resin encapsulant provided on and in contact with the first resin encapsulant and the light-emitting surface, wherein
the first resin encapsulant contains a light reflective material, and
the second resin encapsulant includes a first layer containing a light wavelength conversion material which absorbs first light and emits second light, and having a groove which surrounds the light-emitting element, and a light reflective layer containing a light reflective material and filling the groove.

### Claim 5 (depends on 4)

The light-emitting device of claim 4, wherein
the second resin encapsulant includes a second layer provided on the first layer and containing a light diffusing material which diffuses the first light and the second light.

### Claim 6 (depends on 4)

The light-emitting device of claim 4, wherein
the first layer contains a light diffusing material which diffuses the first light and the second light.

### Claim 7

A light-emitting device, comprising:
a substrate;
a light-emitting element mounted on the substrate, with a surface opposite to a light-emitting surface facing the substrate;
a first resin encapsulant which covers the light-emitting element such that at least part of the light-emitting surface is exposed; and
a second resin encapsulant provided on and in contact with the first resin encapsulant and the light-emitting surface, wherein
the first resin encapsulant contains a light reflective material, and
the second resin encapsulant includes a third layer containing a light wavelength conversion material which absorbs first light and emits second light, and a light diffusing material which diffuses the first light and the second light.

### Claim 8 (depends on 7)

The light-emitting device of claim 7, wherein
the second resin encapsulant includes a transparent resin layer provided under the third layer and in contact with the light-emitting surface.

### Claim 9 (depends on 7)

The light-emitting device of claim 7, wherein
the second resin encapsulant includes a fourth layer provided on the third layer and containing a light diffusing material.

### Claim 10 (depends on 7)

The light-emitting device of claim 7, further comprising:
a protection element mounted on the substrate, wherein
the first resin encapsulant covers an upper surface of the protection element.