# US 2014/0151730 A1 · LED Packaging Construction and Manufacturing Method Thereof

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- Number: US 2014/0151730 A1
- Document ID: US20140151730A1
- Status: Published application
- Kind: A1
- Application number: 13/835,364
- Filed: 2013-03-15
- Published: 2014-06-05
- Earliest claimed: 2012-11-30
- Assignees: Unistars Corporation
- Applicants: Unistars
- Inventors: Shin-Shien Shie; Tien-hao Huang; Shang-Yi Wu; Yi-chun Wu
- Web page: https://patentgrep.com/patent/US20140151730A1

## CPC

- H10H 20/856: Reflecting means
- H10H 20/036: {of packages}
- H10H 20/0363: {of optical field-shaping means}
- H10H 20/8506: {Containers}
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS

## Abstract

LED packaging construction includes a substrate, a cavernous construction, a LED, and a reflection layer. The substrate is daubed with an insulation layer and a circuit layer on a surface on the substrate, wherein the substrate is made of metal, and the insulation layer is disposed between the circuit layer and the substrate. The cavernous construction is disposed on the substrate and surrounds the LED, and is formed by disposing a photoresist layer and patterning the photoresist layer. The circuit layer electrically connects the LED through a conducting wire. The reflection layer is at least disposed on a first surface of the cavernous construction, wherein the first surface surrounds the LED and faces toward the LED, and a part of light emitted from the LED is reflected by the reflection layer.

## Claims

### Claim 1

A light emitting diode (LED) packaging construction, comprising:
a metal substrate;
an insulation layer, disposed on the metal substrate;
a circuit layer, disposed on the metal substrate;
a cavernous construction, disposed on the substrate;
a reflection, disposed on a first surface of the cavernous construction; and
an LED, disposed in the cavernous construction and electrically connected to the circuit layer.

### Claim 2 (depends on 1)

The LED packaging construction of claim 1, wherein the cavernous construction is a photoresist layer.

### Claim 3 (depends on 1)

The LED packaging construction of claim 1, wherein the metal substrate comprises a plane, and the cavernous construction is disposed on the plane.

### Claim 4 (depends on 3)

The LED packaging construction of claim 3, wherein a cavity is formed on the metal substrate, and a lower part of the cavernous construction is disposed in the cavity.

### Claim 5 (depends on 3)

The LED packaging construction of claim 3, wherein the cavity is formed by etching the metal substrate.

### Claim 6 (depends on 3)

The LED packaging construction of claim 3, wherein the cavity is formed by stamping the metal substrate.

### Claim 7 (depends on 1)

The LED packaging construction of claim 1, wherein a cavity is formed on the metal substrate, the cavernous construction is disposed at a periphery of the cavity, and the reflection layer is disposed on the first surface of the cavity construction and a surface of the cavity.

### Claim 8 (depends on 6)

The LED packaging construction of claim 6, wherein the first surface of the cavernous construction connects a surface of the cavity.

### Claim 9 (depends on 1)

The LED packaging construction of claim 1, further comprising a transparent epoxy or silicone for covering the LED.

### Claim 10 (depends on 1)

The LED packaging construction of claim 1, wherein the metal substrate is made of copper, aluminum, or alloy of copper and aluminum.

### Claim 11

A manufacturing method for an LED packaging construction, comprising:
(a) providing a metal substrate;
(b) forming an insulation layer on the metal substrate;
(c) forming a circuit layer on the insulation layer; and
(d) forming a cavernous construction on the metal substrate;
(e) forming a reflection layer on a first surface of the cavernous construction; and
(f) disposing an LED in the cavernous construction.

### Claim 12 (depends on 11)

The manufacturing method of claim 11, further comprising a process of depositing a photoresist layer and patterning the said photoresist layer to form the cavernous construction.

### Claim 13 (depends on 11)

The manufacturing method of claim 11, further comprising forming a cavity on the metal substrate.

### Claim 14 (depends on 13)

The manufacturing method of claim 13, further comprising forming a cavernous construction on the cavity.

### Claim 15 (depends on 13)

The manufacturing method of claim 13, wherein the cavity is formed by stamping the metal substrate.

### Claim 16 (depends on 13)

The manufacturing method of claim 13, wherein the cavity is formed by etching the metal substrate.

### Claim 17

The manufacturing method of 11, further comprising forming a cavernous construction on a planar substrate.

### Claim 18 (depends on 13)

The manufacturing method of claim 13, further comprising forming a cavernous construction around the cavity.

### Claim 19 (depends on 13)

The manufacturing method of claim 13, further comprising forming a reflection layer on the cavity and on the first surface of the cavernous construction.