# US 2014/0151726 A1 · Light emitting module > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0151726 A1 - Document ID: US20140151726A1 - Status: Published application - Kind: A1 - Application number: 14/232,364 - Filed: 2012-06-21 - Published: 2014-06-05 - Earliest claimed: 2011-07-14 - Assignees: Koito Manufacturing Co., Ltd. - Inventors: Shinpei Maeda; Tsukasa Tokida - Web page: https://patentgrep.com/patent/US20140151726A1 ## CPC - F21S 41/143: the main emission direction of the LED being parallel to the optical axis of the illuminating device - F21S 41/151: arranged in one or more lines - F21S 41/153: arranged in a matrix - F21S 41/176: Light sources where the light is generated by photoluminescent material spaced from a primary light generating element - F21S 41/24: Light guides - F21S 41/285: {Refractors, transparent cover plates, light guides or filters not provided in groups F21S41/24 - F21S41/2805} - F21S 41/321: {the reflector being a surface of revolution or a planar surface, e.g. truncated} - F21S 41/322: {the reflector using total internal reflection} - H10H 20/852: Encapsulations - H10H 20/853: characterised by their shape - H10H 20/855: Optical field-shaping means, e.g. lenses - H10W 90/00: Package configurations - F21S 45/435: circulating the gas within a closed system - H10H 20/0363: {of optical field-shaping means} - H10H 20/84: Coatings, e.g. passivation layers or antireflective coatings - H10H 20/8515: {not being in contact with the bodies} - H10W 72/07251: {characterised by changes in properties of the bump connectors during connecting} - H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps - F21S: NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract There are provided a light emitting module including a luminescent material layer (15) which is disposed so as to cover a light emitting surface (13a) of a semiconductor light emitting element (13) and which changes a wavelength of at least part of light emitted from the semiconductor light emitting element, and a light shielding wall (16) which surrounds the semiconductor light emitting element and the luminescent material layer from the circumference thereof, and the luminescent material layer is bonded to the semiconductor light emitting element and the light shielding wall with a bonding resin (23) having a light transmittivity, a distal end portion of the light shielding wall is caused to project further forwards than the luminescent material layer, and a transparent resin (24) is applied so as to cover an exposed surface (20a) of a distal end portion (21) of the light shielding wall. ## Claims ### Claim 1 A light emitting module comprising: a semiconductor light emitting element which has a light emitting surface from which light is emitted; a circuit board on which the semiconductor light emitting element is mounted; a luminescent material layer which is disposed so as to cover the emitting surface of the semiconductor light emitting element and which changes a wavelength of at least part of light emitted from the semiconductor light emitting element; and a light shielding wall which is provided on the circuit board and which surrounds the semiconductor light emitting element and the luminescent material layer from the circumference thereof, and wherein the luminescent material layer is bonded to the semiconductor light emitting element and the light shielding wall with a bonding resin having a light transmittivity, wherein a distal end portion of the light shielding wall is caused to project further forwards than the luminescent material layer, and wherein a transparent resin having a light transmittivity is applied so as to cover at least an exposed surface of the distal end portion of the light shielding wall. ### Claim 2 (depends on 1) The light emitting module according to claim 1, further comprising: a plurality of semiconductor light emitting elements like the semiconductor light emitting element are mounted side by side at predetermined intervals, in that wherein the same number of luminescent material layers like the luminescent material layer as the plurality of semiconductor light emitting elements are disposed so as to cover individually light emitting surfaces of the semiconductor light emitting elements, and wherein the light shielding wall is provided so as to surround the plurality of semiconductor light emitting elements and the plurality of luminescent material layers from the circumference thereof. ### Claim 3 (depends on 1) The light emitting module according to claim 1, wherein the transparent resin is applied so as to cover the whole of an opening portion which is formed by the distal end portion of the light shielding wall which is caused to project further forwards than the luminescent material layer. ### Claim 4 (depends on 1) The light emitting module according to claim 1, wherein the transparent resin is made of the same material as that of the bonding resin.