# US 2014/0151725 A1 · Method and Apparatus for Fabricating Phosphor-Coated LED Dies > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0151725 A1 - Document ID: US20140151725A1 - Status: Published application - Kind: A1 - Application number: 14/174,929 - Filed: 2014-02-07 - Published: 2014-06-05 - Earliest claimed: 2012-08-24 - Assignees: TSMC Solid State Lighting Ltd. - Applicants: TSMC Solid State Lighting Ltd. - Inventors: Chi-Xiang Tseng; Hsiao-Wen Lee; Min-Sheng Wu; Tien-Min Lin - Web page: https://patentgrep.com/patent/US20140151725A1 ## CPC - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - H10H 20/851: Wavelength conversion means - H10W 90/00: Package configurations - H10H 20/0361: {of wavelength conversion means} - H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract The present disclosure involves a method of packaging a light-emitting diode (LED). According to the method, a group of metal pads and a group of LEDs are provided. The group of LEDs is attached to the group of metal pads, for example through a bonding process. After the LEDs are attached to the metal pads, each LED is spaced apart from adjacent LEDs. Also according to the method, a phosphor film is coated around the group of LEDs collectively. The phosphor film is coated on top and side surfaces of each LED and between adjacent LEDs. A dicing process is then performed to slice through portions of the phosphor film located between adjacent LEDs. The dicing process divides the group of LEDs into a plurality of individual phosphor-coated LEDs. ## Claims ### Claim 1 A light-emitting diode (LED) lighting apparatus, comprising an LED die; and a phosphor film coated conformally around the LED die. ### Claim 2 (depends on 1) The LED lighting apparatus of claim 1, further comprising: a first conductive pad and a second conductive pad each bonded to the LED die. ### Claim 3 (depends on 2) The LED lighting apparatus of claim 2, wherein the LED die, the first and second conductive pads, and the phosphor film are parts of a phosphor-coated LED chip. ### Claim 4 (depends on 3) The LED lighting apparatus of claim 3, wherein a footprint of the phosphor-coated LED chip is in a range from about (1-2 millimeters)×(1-2 millimeters). ### Claim 5 (depends on 3) The LED lighting apparatus of claim 3, further comprising a substrate on which the phosphor-coated LED chip is located. ### Claim 6 (depends on 5) The LED lighting apparatus of claim 5, further comprising: a plurality of additional phosphor-coated LED chips that are located on the substrate and physically separated from one another. ### Claim 7 (depends on 2) The LED lighting apparatus of claim 2, wherein the phosphor film is coated on a top surface and side surfaces of the LED die, but not a bottom surface of the LED die. ### Claim 8 (depends on 7) The LED lighting apparatus of claim 7, wherein the first and second conductive pads are bonded to the bottom surface of the LED die. ### Claim 9 (depends on 2) The LED lighting apparatus of claim 2, wherein the first conductive pad is bonded to an n-terminal of the LED die, and the second conductive pad is bonded to a p-terminal of the LED die. ### Claim 10 (depends on 2) The LED lighting apparatus of claim 2, further comprising: a substrate on which the LED die is disposed. ### Claim 11 (depends on 10) The LED lighting apparatus of claim 10, wherein the substrate is a silicon substrate, a ceramic substrate, or a printed circuit board. ### Claim 12 (depends on 10) The LED lighting apparatus of claim 10, wherein: the first and second conductive pads are disposed on a first surface of the substrate; a third conductive pad and a fourth conductive pad are disposed on a second surface of the substrate opposite the first surface; and the substrate includes a first via and a second via that each extend through the substrate from the first surface to the second surface, the first via electrically coupling together the first and third conductive pads, the second via electrically coupling together the second and fourth conductive pads. ### Claim 13 (depends on 1) The LED lighting apparatus of claim 1, further comprising: a diffuser cap that houses the LED die therein; and an optical gel disposed between the LED die and the diffuser cap. ### Claim 14 A light-emitting diode (LED) lighting apparatus, comprising a substrate; an LED die disposed over the substrate; and a phosphor material coated on a top surface and side surface of the LED die in a conformal manner. ### Claim 15 (depends on 14) The LED lighting apparatus of claim 14, further comprising: a plurality of additional LED dies disposed over the substrate, wherein each of the additional LED dies has a phosphor material coated on its top and side surfaces in the conformal manner, and wherein the LED dies are separated from one another. ### Claim 16 (depends on 15) The LED lighting apparatus of claim 15, further comprising: an encapsulation structure disposed over the substrate, wherein the LED die and the additional LED dies are all housed within the encapsulation structure; and an optical gel filling a space between the substrate and the encapsulation structure. ### Claim 17 (depends on 16) The LED lighting apparatus of claim 16, wherein the encapsulation structure includes a diffuser cap configured to scatter light. ### Claim 18 (depends on 14) The LED lighting apparatus of claim 14, further comprising: a heat sink coupled to the substrate, the heat sink having a plurality of fins. ### Claim 19 A light-emitting diode (LED) lighting apparatus, comprising a substrate; a plurality of additional phosphor-coated LED chips that are located on the substrate, wherein the LED chips are physically separated from adjacent LED chips, and wherein each LED chip includes: an LED die; two conductive pads each bonded to the LED die; and a phosphor film coated conformally around the LED die, such that the LED die has the phosphor film coated on its top and side surfaces. ### Claim 20 (depends on 19) The LED lighting apparatus of claim 19, further comprising: a thermal dissipation structure thermally conductively coupled to the substrate; a diffuser cap located over the substrate and housing the LED chips underneath; and an optical gel disposed between the LED chips and the diffuser cap.