# US 2014/0151655 A1 · Organic light emitting display device and method for manufacturing the same

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- Number: US 2014/0151655 A1
- Document ID: US20140151655A1
- Status: Published application
- Kind: A1
- Application number: 14/063,935
- Filed: 2013-10-25
- Published: 2014-06-05
- Earliest claimed: 2012-12-04
- Assignees: LG Display Co., Ltd.
- Applicants: LG Display Co., Ltd.
- Inventors: Byung Chul AHN; Bong Geum LEE
- Web page: https://patentgrep.com/patent/US20140151655A1

## CPC

- H10K 59/131: Interconnections, e.g. wiring lines or terminals
- H10K 50/8423: {Metallic sealing arrangements}
- H10K 59/805: {Electrodes}
- H10K 59/1201: {Manufacture or treatment}
- H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES

## Abstract

Discussed is an organic light emitting display device which prevents a voltage drop, wherein the light emitting display device includes a substrate; a first electrode on the substrate; an organic light emitting layer on the first electrode; a second electrode on the substrate including the organic light emitting layer; and an encapsulation substrate confronting the substrate, wherein the encapsulation substrate is formed of a metal material, and is electrically connected with the second electrode.

## Claims

### Claim 1

An organic light emitting display device comprising:
a substrate;
a first electrode on the substrate;
an organic light emitting layer on the first electrode;
a second electrode on the substrate including the organic light emitting layer; and
an encapsulation substrate confronting the substrate,
wherein the encapsulation substrate is formed of a metal material, and is electrically connected with the second electrode.

### Claim 2 (depends on 1)

The device of claim 1, wherein the encapsulation substrate includes:
a base film formed of a metal material including magnesium (Mg);
a connection layer formed of a conductive metal material on a first surface of the base film so as to enable an electrical connection with the second electrode; and
a metal oxide layer formed on a second surface of the base film in opposite to the first surface of the base film.

### Claim 3 (depends on 2)

The device of claim 2, wherein the connection layer is formed of an alloy of magnesium (Mg) and at least any one metal material selected from argentum (Ag), titanium (Ti), tungsten (W), and iron (Fe).

### Claim 4 (depends on 2)

The device of claim 2, wherein the metal oxide layer is formed by performing an anodizing or plasma treatment on the second surface of the base film.

### Claim 5 (depends on 1)

The device of claim 1, further comprising an auxiliary electrode in a non light-emission area of the substrate, wherein the second electrode and the encapsulation substrate are electrically connected to each other through the use of auxiliary electrode.

### Claim 6 (depends on 5)

The device of claim 5, wherein the auxiliary electrode includes:
a barrier formed in a closed loop surrounding a light-emission area on the non light-emission area of the substrate; and
a connection electrode provided on the barrier and formed as one body with the second electrode.

### Claim 7

A method for manufacturing an organic light emitting display device comprising:
forming a first electrode on a predetermined region of a substrate;
forming an organic light emitting layer on the first electrode;
forming a second electrode on the substrate including the organic light emitting layer; and
bonding an encapsulation substrate of a metal material to the substrate so as to electrically connect the encapsulation substrate and the second electrode to each other.

### Claim 8 (depends on 7)

The method of claim 7, further comprising:
manufacturing the encapsulation substrate,
wherein the process of manufacturing the encapsulation substrate includes:
forming a connection layer by performing a plasma treatment using a conductive metal material on a first surface of a base film formed of a metal material containing magnesium (Mg); and
forming a metal oxide layer by performing an anodizing or plasma treatment on a second surface of the base film being opposite to the first surface.

### Claim 9 (depends on 8)

The method of claim 8, wherein the conductive metal material includes at least any one selected from argentum (Ag), titanium (Ti), tungsten (W), and iron (Fe).

### Claim 10 (depends on 7)

The method of claim 7, further comprising:
forming a barrier surrounding a light-emission area of the substrate on a non light-emission area of the substrate; and
providing a connection electrode on the barrier, wherein the connection electrode is formed as one body with the second electrode,
wherein the encapsulation substrate is electrically connected with the second electrode through the connection electrode.