# US 2014/0151605 A1 · Thermosetting polymer-based composite materials > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0151605 A1 - Document ID: US20140151605A1 - Status: Published application - Kind: A1 - Application number: 13/861,475 - Filed: 2013-04-12 - Published: 2014-06-05 - Earliest claimed: 2008-01-22 - Assignees: Globe Composite Solutions, Ltd. - Applicants: Globe Composite Solutions, Ltd. - Inventors: Xiujun Wang - Web page: https://patentgrep.com/patent/US20140151605A1 ## CPC - C08K 3/08: Metals - C08K 3/22: of metals - C08K 3/30: Sulfur-, selenium- or tellurium-containing compounds - G21F 1/106: {metallic dispersions} - C08K 2201/014: Additives containing two or more different additives of the same subgroup in C08K - C08K 2201/019: the composition being defined by the absence of a certain additive - C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09) - G21F: PROTECTION AGAINST X-RADIATION, GAMMA RADIATION, CORPUSCULAR RADIATION OR PARTICLE BOMBARDMENT; TREATING RADIOACTIVELY CONTAMINATED MATERIAL; DECONTAMINATION ARRANGEMENTS THEREFOR (radiation protection by pharmaceutical means A61K8/00, A61Q17/04; in cosmonautic vehicles B64G1/54; combined with a reactor G21C11/00; combined with X-ray tubes H01J35/16; combined with X-ray apparatus H05G1/02) ## Abstract A lead-free, non-toxic composite material including a thermosetting polymer and at least one of a heavy particulate filler, a light particulate filler or a combination thereof. The composite material may be utilized in manufacturing articles used in radiation shielding applications. ## Claims ### Claim 1 A method of manufacturing a lead-free, non-toxic radiation shielding device, said method comprising: combining a liquid thermosetting polymer, at least one heavy particulate filler, and at least one light particulate filler to form a lead-free, non-toxic composite material, wherein said at least one heavy particulate filler is selected from a group consisting of tungsten, osmium, iridium, platinum, gold, molybdenum, tantalum, and combinations thereof, said at least one heavy particulate filler having an average particle size between 0.1 micron and 15 microns, and further wherein said at least one light particulate filler is selected from the group consisting of barium sulfate, bismuth, iodine, zirconium, zirconium oxide, nickel, copper, silver, titanium, titanium oxide, zinc oxide, zinc sulfide, antimony oxide, aluminum, and combinations thereof, said at least one light particulate filler having an average particle size between 0.5 micron and 15 microns; and casting said lead-free, non-toxic composite material to form a lead-free, non-toxic radiation shielding device. ### Claim 2 (depends on 1) A method according to claim 1, further comprising combining an additive with said liquid thermosetting polymer and the filler, the additive selected from a group consisting of curatives, processing aids, functional additives, pigments and combinations thereof. ### Claim 3 (depends on 1) A method according to claim 1, wherein said thermosetting polymer is selected from a group of epoxy resins, urethanes, silicones, un-saturated esters and combinations thereof. ### Claim 4 (depends on 3) A method according to claim 3, wherein said thermosetting polymer is an epoxy resin. ### Claim 5 (depends on 1) A method according to claim 1, wherein said heavy particulate filler is tungsten. ### Claim 6 (depends on 1) A method according to claim 1, wherein said light particulate filler is barium sulfate. ### Claim 7 A method of manufacturing a lead-free, non-toxic radiation shielding device, said method comprising: combining a solid thermosetting polymer, at least one heavy particulate filler, and at least one light particulate filler to form a lead-free, non-toxic composite material, wherein said at least one heavy particulate filler is selected from a group consisting of tungsten, osmium, iridium, platinum, gold, molybdenum, tantalum, and combinations thereof, the at least one heavy particular filler having an average particle size between 0.1 micron and 15 microns, and further wherein said at least one light particulate filler is selected from the group consisting of barium sulfate, bismuth, iodine, zirconium oxide, nickel, copper, silver, titanium, titanium oxide, zinc oxide, zinc sulfide, antimony oxide, aluminum, and combinations thereof, the at least one light particulate filler having an average particle size between 0.5 micron and 15 microns; and liquid phase sintering said lead-free, non-toxic composite material to form a lead-free, non-toxic radiation shielding device. ### Claim 8 (depends on 7) A method according to claim 7, further comprising combining an additive with said liquid thermosetting polymer and the filler, the additive selected from a group consisting of curatives, processing aids, functional additives, pigments and combinations thereof. ### Claim 9 (depends on 7) A method according to claim 7, wherein said thermosetting polymer is selected from a group of epoxy resins, urethanes, silicones, un-saturated esters and combinations thereof. ### Claim 10 (depends on 9) A method according to claim 9, wherein said thermosetting polymer is an epoxy resin. ### Claim 11 (depends on 7) A method according to claim 7, wherein said heavy particulate filler is tungsten. ### Claim 12 (depends on 7) A method according to claim 7, wherein said light particulate filler is barium sulfate. ### Claim 13 A lead-free, non-toxic composite material, said composite material comprising: a thermosetting polymer; at least one heavy particulate filler selected from a group consisting of osmium, iridium, platinum, gold, tantalum, and combinations thereof; and at least one light particulate filler selected from the group consisting of barium sulfate, bismuth, iodine, zirconium oxide, nickel, copper, silver, titanium, titanium oxide, zinc oxide, zinc sulfide, antimony oxide, aluminum, and combinations thereof. ### Claim 14 (depends on 13) A lead-free, non-toxic composite material according to claim 13, wherein said thermosetting polymer is selected from a group of epoxy resins, urethanes, silicones, un-saturated esters and combinations thereof. ### Claim 15 (depends on 14) A lead-free, non-toxic composite material according to claim 14, wherein said thermosetting polymer is an epoxy resin. ### Claim 16 (depends on 15) A lead-free, non-toxic composite material according to claim 15, wherein said epoxy resin is in a liquid form. ### Claim 17 (depends on 15) A lead-free, non-toxic composite material according to claim 15, wherein said epoxy resin is in a solid form. ### Claim 18 A lead-free, non-toxic composite material, said composite material comprising: a thermosetting polymer; at least one heavy particulate filler selected from a group consisting of tungsten, osmium, iridium, platinum, gold, tantalum, and combinations thereof; and at least one light particulate filler selected from the group consisting of bismuth, iodine, zirconium oxide, silver, titanium, titanium oxide, zinc oxide, zinc sulfide, antimony oxide, and combinations thereof. ### Claim 19 (depends on 18) A lead-free, non-toxic composite material according to claim 18, wherein said thermosetting polymer is an epoxy resin in a solid form or a liquid form.