# US 2014/0151439 A1 · Method for ultrasonic bonding having at least one first and second ultrasonic transducer generating harmonic oscillating parts > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0151439 A1 - Document ID: US20140151439A1 - Status: Published application - Kind: A1 - Application number: 14/131,930 - Filed: 2012-07-26 - Published: 2014-06-05 - Earliest claimed: 2011-08-05 - Assignees: Hesse GmbH - Inventors: Hans-Juergen Hesse; Michael Broekelmann - Web page: https://patentgrep.com/patent/US20140151439A1 ## CPC - B23K 20/10: making use of vibrations, e.g. ultrasonic welding - B06B 1/0607: {using multiple elements (B06B1/064 and B06B1/0688 take precedence)} - H10W 72/07331: {Connecting techniques} - H10W 72/07333: {Ultrasonic bonding, e.g. thermosonic bonding} - H10W 72/07341: {Controlling the bonding environment, e.g. atmosphere composition or temperature} - B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM - B06B: METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, {e.g.} FOR PERFORMING MECHANICAL WORK IN GENERAL (for particular applications, see the relevant subclasses, e.g. B07B1/40, B23Q17/12, B24B31/06; measurement of mechanical vibrations G01H; in direction finding, locating, distance or velocity measuring G01S; {generating seismic energy G01V1/02}; control of mechanical vibrations in general G05D; sound-producing devices, e.g. bells, sirens, whistles G10K, {e.g. methods or devices for transmitting, conducting, or directing sound in general G10K11/00}; generation of electrical oscillations H03B; electromechanical resonators in general H03H; electromechanical transducers {for communication techniques, e.g. microphones, speakers} H04R) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract In a method for ultrasonic bonding, two longitudinal ultrasonic waves propagating in a common working plane oriented parallel to a substrate are induced in one or more ultrasonic transducers and are passed through ultrasound-conducting arms from different spatial directions onto a common connection point of the arms. At the connection point the ultrasonic waves cause an ultrasonic tool arranged directly or indirectly at said connection point to oscillate in two or three dimensions. At least one of the ultrasonic transducers induces an ultrasonic wave with a first harmonic oscillation component and a second oscillation component. ## Claims ### Claim 1 A method for ultrasonic bonding, wherein two longitudinal ultrasonic waves propagating in a common working plane oriented parallel to a substrate are induced in one or more ultrasonic transducers and are passed through ultrasound-conducting arms from different spatial directions onto a common connection point of the arms, and at the connection point cause an ultrasonic tool arranged directly or indirectly at said connection point to oscillate in two or three dimensions, the improvement wherein at least one of said ultrasonic transducers induces an ultrasonic ways with a first harmonic oscillation component and a second oscillation component. ### Claim 2 (depends on 1) The method as in claim 1, wherein the at least one ultrasonic transducer induces the second oscillation component as a second harmonic oscillation component. ### Claim 3 (depends on 1) The method as in claim 1, wherein the at least one ultrasonic transducer induces the ultrasonic wave with a second oscillation component that has a higher-frequency compared to the first harmonic oscillation component. ### Claim 4 (depends on 1) The method as in claim 1, wherein the at least one ultrasonic transducer induces the first harmonic oscillation component with a first oscillation amplitude and the second oscillation component with a second oscillation amplitude that is smaller compared to the first oscillation amplitude. ### Claim 5 (depends on 1) The method as in claim 1, wherein at least one first ultrasonic transducer induces a first ultrasonic wave with a first harmonic oscillation component and with a second oscillation component and at least a second ultrasonic transducer induces a second ultrasonic wave with at least a first harmonic oscillation component and with a second harmonic oscillation component, wherein arms associated with adjacent ultrasonic transducers are arranged in the working plane at an angle of 30° to 150° to each other. ### Claim 6 (depends on 1) The method as in claim 1, wherein the first ultrasonic transducer and the second ultrasonic transducer each generate an ultrasonic wave, wherein the arm associated with the first ultrasonic transducer and the arm associated with the second ultrasonic transducer are arranged at an angle of 90° to each other and wherein the second oscillation component of the first ultrasonic wave is formed orthogonal to the second oscillation component of the second ultrasonic wave. ### Claim 7 (depends on 1) The method as in claim 1, wherein the at least one ultrasonic transducer induces the ultrasonic wave with a third oscillation component. ### Claim 8 (depends on 7) The method as in claim 7, wherein the at least one ultrasonic transducer induces the third oscillation component as a third harmonic oscillation component. ### Claim 9 (depends on 7) The method as in claim 7, wherein the at least one ultrasonic transducer induces the ultrasonic wave with a third harmonic oscillation component that has a higher frequency compared to the second harmonic oscillation component. ### Claim 10 (depends on 1) The method as in claim 1, wherein the at least one ultrasonic transducer induces the second oscillation component and the third oscillation component with an equal oscillation amplitude. ### Claim 11 (depends on 1) The method as in claim 1, wherein the ultrasonic transducer is arranged to generate the first harmonic oscillation component of the ultrasonic wave to oscillations in a first self-oscillation form and to generate the second oscillation component and/or the third oscillation component of the ultrasonic wave to oscillations in at least one additional self-oscillation form of a higher order. ### Claim 12 (depends on 1) Apparatus for carrying out a method for ultrasonic bonding as defined in claim 1.