# US 2014/0151360 A1 · Heater assembly for disk processing system

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- Number: US 2014/0151360 A1
- Document ID: US20140151360A1
- Status: Published application
- Kind: A1
- Application number: 13/691,736
- Filed: 2012-11-30
- Published: 2014-06-05
- Earliest claimed: 2012-11-30
- Assignees: WD Media, LLC
- Inventors: LANDDELL GREGORY; ZATUL 'ITRI B. ZAINUDDIN; CHI CHOY LIM
- Web page: https://patentgrep.com/patent/US20140151360A1

## CPC

- G11B 25/043: {using rotating discs}
- G11B 5/8404: {manufacturing base layers}
- G11B: INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER (recording measured values in a way that does not require playback through a transducer G01D9/00; recording or playback apparatus using mechanically marked tape, e.g. punched paper tape, or using unit records, e.g. punched or magnetically marked cards G06K; transferring data from one type of record carrier to another G06K1/18; circuits for coupling output of reproducer to radio receiver H04B1/20; gramophone pick-ups or like acoustic electromechanical transducers or circuits therefor H04R)

## Abstract

A heater assembly for a disk processing system including a heater element configured to heat a substrate carried by a holder, and a heater cover having an aperture to expose the heater element to the substrate. The cover may be metal to thermally couple the heater to a cooling plate. The cover may have an outer surface having a thermal barrier surrounding the aperture to thermally insulate the holder.

## Claims

### Claim 1

A heater assembly for a disk processing system, comprising:
a heater element configured to heat a substrate carried by a holder; and
a heater cover having an aperture to expose the heater element to the substrate, wherein the heater cover further comprises an outer surface having a thermal barrier surrounding the aperture to thermally insulate the holder.

### Claim 2 (depends on 1)

The heater assembly of claim 1 wherein the thermal barrier comprises zirconia oxide.

### Claim 3 (depends on 1)

The heater assembly of claim 1 further comprising a cooling plate, wherein the heater cover thermally couples the heater element to the cooling plate.

### Claim 4 (depends on 3)

The heater assembly of claim 3 wherein the heater cover comprises a metal that provides the thermal coupling between the heater element and the cooling plate.

### Claim 5 (depends on 4)

The heater assembly of claim 4 wherein the metal comprises copper.

### Claim 6 (depends on 5)

The heater assembly of claim 5 wherein the copper comprises oxygen free copper.

### Claim 7

A heater assembly for a disk processing system, comprising:
a heater element configured to heat a substrate carried by a holder;
a cooling plate; and
a heater cover having an aperture to expose the heater element to the substrate, wherein the heater cover comprises a metal to thermally couple the heater element to the cooling plate.

### Claim 8 (depends on 7)

The heater assembly of claim 7 wherein the metal comprises copper.

### Claim 9 (depends on 8)

The heater assembly of claim 8 wherein the copper comprises oxygen free copper.

### Claim 10 (depends on 7)

The heater assembly of claim 7 wherein the heater cover comprises an outer surface having a zirconia oxide thermal barrier surrounding the aperture to thermally insulate the holder.

### Claim 11

A method of heating a substrate carried by a holder in a disk processing system, comprising:
heating the substrate with a heater element that radiates through an aperture in a heater cover; and
thermally insulating the holder while heating the substrate via a thermal barrier on an outer surface of the heater cover surrounding the aperture.

### Claim 12 (depends on 11)

The method of claim 11 wherein the thermal barrier comprises zirconia oxide.

### Claim 13 (depends on 11)

The method of claim 11 further comprising thermally coupling the heater element to a cooling plate via the heater cover.

### Claim 14 (depends on 13)

The method of claim 13 wherein the heater cover comprises a metal that thermally couples the heater element to the cooling plate.

### Claim 15 (depends on 14)

The method of claim 14 wherein the metal comprises copper.

### Claim 16 (depends on 15)

The method of claim 15 wherein the copper comprises oxygen free copper.

### Claim 17

A method of heating a substrate carried by a holder in a disk processing system, comprising:
heating the substrate with a heater element that radiates through an aperture in a metal heater cover; and
thermally coupling the heater element to a cooling plate via a metal heater cover.

### Claim 18 (depends on 17)

The method of claim 17 wherein the metal comprises copper.

### Claim 19 (depends on 18)

The method of claim 18 wherein the copper comprises oxygen free copper.

### Claim 20 (depends on 17)

The method of claim 17 further comprising thermally insulating the holder while heating the substrate via a zirconia oxide thermal barrier on an outer surface of the heater cover surrounding the aperture.