# US 2014/0151346 A1 · Method for production of safety/rupture discs

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- Number: US 2014/0151346 A1
- Document ID: US20140151346A1
- Status: Published application
- Kind: A1
- Application number: 14/232,943
- Filed: 2012-07-25
- Published: 2014-06-05
- Earliest claimed: 2011-07-26
- Assignees: Donadon Safety Discs and Devices S.R.L.
- Inventors: Mario Modena; Antonio Ruggero Sante Donadon
- Web page: https://patentgrep.com/patent/US20140151346A1

## CPC

- B23K 26/38: by boring or cutting
- B23K 26/0624: {using ultrashort pulses, i.e. pulses of 1 ns or less}
- B23K 26/0626: {Energy control of the laser beam (B23K26/0622 takes precedence)}
- B23K 26/08: Devices involving relative movement between laser beam and workpiece
- B23K 26/364: for making a groove or trench, e.g. for scribing a break initiation groove
- F16K 17/16: with fracturing diaphragm {; Rupture discs}
- B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- F16K: VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING {(devices for emptying and evacuating the excess liquid in valves or conduits F16L55/07)}

## Abstract

A method for production of safety/rupture discs (1) comprises the steps providing a foil element (1a), selecting a wavelength for a laser beam of a pulse laser within a range of between 800 nanometers and 1800 nanometers, selecting a pulse repetition rate for the laser beam within a range of between 15 KHz and 800 KHz, selecting a pulse duration for the laser beam less than 10 nanosecond and ablating at least one non-through cut (2) in the foil element by directly applying said laser beam to the foil element to remove material from the foil element (1a) thereby obtaining a safety/rupture disc.

## Claims

### Claim 1

A method for production of safety/rupture discs, comprising the steps of: providing a foil element;
selecting a wavelength for a laser beam of a pulse laser within a range of between 800 nanometers and 1800 nanometers; selecting a pulse repetition rate for the laser beam within a range of between 15 KHz and 800 KHz; selecting a pulse duration for the laser beam less than 10 nanosecond and ablating at least one non-through cut in the foil element by directly applying said laser beam to the foil element to remove material from the foil element thereby obtaining a safety/rupture disc.

### Claim 2 (depends on 1)

A method as in claim 1 comprising the step of selecting a speed of relative motion between the laser beam and the foil element.

### Claim 3 (depends on 2)

A method as in claim 2 wherein said speed of relative motion between the laser beam and the foil element is within a range of between 0,07 m/s and 50 m/s.

### Claim 4 (depends on 1)

A method as in claim 1 comprising the step of selecting an energy value of each pulse of the laser beam.

### Claim 5 (depends on 4)

A method as in claim 4 wherein said energy value of each pulse of the laser beam is within a range of between 1 microJoule and 250 microJoule.

### Claim 6 (depends on 1)

A method as in claim 1 wherein the score depth of each laser beam pass is within a range of between 0,005 μm and 5 μm.

### Claim 7 (depends on 1)

A method as in claim 1 wherein the step of providing a foil element is carried out by providing a planar disc.

### Claim 8 (depends on 7)

A method of claim 7 wherein said planar disc has a thickness within the range of between 15 μm and 800 pm.

### Claim 9 (depends on 1)

A method as in claim 1 wherein the step of providing a foil element is carried out by providing a dome-shaped element.

### Claim 10 (depends on 1)

A method as in claim 1 wherein said pulse duration for the laser beam is within a range of between 0,9 picoseconds and 500 picoseconds.

### Claim 11 (depends on 1)

A method as in claim 1 wherein said pulse duration for the laser beam is within a range of between 10 femtoseconds and 900 femtoseconds.

### Claim 12 (depends on 1)

A method as in claim 1 wherein said foil element has a thickness within the range of between 20 μm and 100 μm.