# US 2014/0151328 A1 · Method for forming laminate

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- Number: US 2014/0151328 A1
- Document ID: US20140151328A1
- Status: Published application
- Kind: A1
- Application number: 14/072,158
- Filed: 2013-11-05
- Published: 2014-06-05
- Earliest claimed: 2012-12-05
- Assignees: Tokyo Ohka Kogyo Co., Ltd.
- Applicants: Tokyo Ohka Kogyo Co., Ltd.
- Inventors: Atsushi Miyanari; Akihiko Nakamura
- Web page: https://patentgrep.com/patent/US20140151328A1

## CPC

- H10P 72/7402: {Wafer tapes, e.g. grinding or dicing support tapes}
- H10P 72/74: {using temporarily an auxiliary support}
- H10P 72/7448: {the bond interface between the auxiliary support and the wafer comprising two or more, e.g. multilayer adhesive or adhesive and release layer}
- H10P 72/7412: {the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support}
- H10P 72/7416: {used during dicing or grinding}
- H10P 72/7422: {used to protect an active side of a device or wafer}
- H10P 72/744: {Details of chemical or physical process used for separating the auxiliary support from a device or a wafer}
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10

## Abstract

A release layer is adequately protected by a protective layer when a laminate is subjected to a desired treatment. A method for forming a laminate 10 includes a protective layer forming step of forming a protective layer 15 for covering a face that is a surface of a release layer 14 and which is not adhered to a support plate 12 and not superimposed at least on an adhesive layer 13; and a protective layer removal step of removing a portion of the protective layer 15, which is exposed at the time of forming the laminate 10.

## Claims

### Claim 1

A method for forming a laminate comprising laminating a substrate, an adhesive layer, a release layer which is denatured upon absorption of light, and a support supporting the substrate in this order to form a laminate, the method including:
a protective layer forming step of forming a protective layer for covering a face that is a surface of the release layer and which is not adhered to the support and not superimposed at least on the adhesive layer; and
a protective layer removal step of removing a portion of the protective layer, which is exposed at the time of forming the laminate.

### Claim 2 (depends on 1)

The method according to claim 1, wherein the protective layer removal step is conducted before an adhesion step of sticking the substrate and the support to each other.

### Claim 3 (depends on 2)

The method according to claim 2, wherein in the protective layer removal step, the protective layer is removed by a solvent treatment.

### Claim 4 (depends on 1)

The method according to claim 1, further including an adhesion step of sticking the substrate and the support to each other; and a processing step after the adhesion step, of subjecting the substrate to at least one of a heat treatment and a vacuum treatment,
Wherein the protective layer removal step is conducted after the adhesion step and before the processing step.

### Claim 5 (depends on 4)

The method according to claim 4, wherein in the protective layer removal step, the protective layer is removed by a solvent treatment or a plasma treatment.

### Claim 6 (depends on 5)

The method according to claim 5, wherein a portion of the release layer, which is exposed at the time of forming the laminate, is removed together with the protective layer by the plasma treatment.

### Claim 7

A method for forming a laminate comprising laminating a substrate, an adhesive layer, a release layer which is denatured upon absorption of light, and a support supporting the substrate in this order to form a laminate, the method including:
a release layer removal step of removing a portion of the release layer, which is exposed at the time of forming the laminate, by a plasma treatment.

### Claim 8 (depends on 1)

The method according to claim 1, further including after the protective layer removal step, the substrate stuck to the support is dried.