# US 2014/0151238 A1 · Copper plating solution

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- Number: US 2014/0151238 A1
- Document ID: US20140151238A1
- Status: Published application
- Kind: A1
- Application number: 14/174,754
- Filed: 2014-02-06
- Published: 2014-06-05
- Earliest claimed: 2012-02-08
- Assignees: Hojin Platech Co., Ltd.
- Applicants: Hojin Platech Co.,Ltd.
- Inventors: Pan Soo Kim; Duk Haeng Lee; Woon Suk Jung
- Web page: https://patentgrep.com/patent/US20140151238A1

## CPC

- C25D 3/38: of copper
- C25D: PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR

## Abstract

The present invention relates to a copper plating solution for relieving the deposit stress of an electroplated copper film. In the copper electroplating solution of the present invention, glycerin propoxylate ethoxylate is used as a carrier for relieving the deposit stress, and phenylurea is added as a deposit stress relieving additive. The copper electroplating solution of the present invention includes the phenylurea by from about 0.02 to about 0.08 g/l.

## Claims

### Claim 1

A copper electroplating solution comprising a phenylurea as an additive for relieving deposit stress.

### Claim 2 (depends on 1)

The copper electroplating solution of claim 1, wherein an amount of the phenylurea is from about 0.02 g/l to about 0.08 g/l.

### Claim 3 (depends on 1)

The copper electroplating solution of claim 1, further comprising:
a basic bath including ions of a metal, an electrolyte, a sulfuric acid and chloride ions.

### Claim 4 (depends on 1)

The copper electroplating solution of claim 1, wherein the sulfuric acid includes a copper sulfate.

### Claim 5 (depends on 1)

The copper electroplating solution of claim 1, further comprising a glycerin propoxylate ethoxylate derivative.

### Claim 6

A copper electroplating method comprising:
adding a phenylurea to a copper electroplating solution; and
performing the copper electroplating to obtain a plated film having a less deformation as compared when the copper electroplating solution does not include the phenylurea.

### Claim 7 (depends on 6)

The method of claim 6, wherein an amount of the phenylurea is from about 0.02 g/l to about 0.08 g/l.

### Claim 8 (depends on 6)

The method of claim 6, wherein the plated film is formed in a solar cell.

### Claim 9 (depends on 6)

The method of claim 6, wherein the plated film is formed in a touch panel.