# US 2014/0151216 A1 · Sputtering Apparatus and Method of Manufacturing Display Substrate Using the Same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0151216 A1 - Document ID: US20140151216A1 - Status: Published application - Kind: A1 - Application number: 13/900,231 - Filed: 2013-05-22 - Published: 2014-06-05 - Earliest claimed: 2012-12-03 - Assignees: Samsung Display Co., Ltd. - Applicants: Samsung Display Co., Ltd. - Inventors: Sang-Woo Sohn; Hyung-Jun Kim - Web page: https://patentgrep.com/patent/US20140151216A1 ## CPC - C23C 14/564: {Means for minimising impurities in the coating chamber such as dust, moisture, residual gases} - C23C 14/352: {using more than one target (C23C14/56 takes precedence)} - H01J 37/3417: {Arrangements} - H01J 37/3435: {Target holders (includes backing plates and endblocks)} - H01J 37/347: {Thickness uniformity of coated layers or desired profile of target erosion} - H01J 37/3473: {Composition uniformity or desired gradient} - H10P 14/22: using physical deposition, e.g. vacuum deposition or sputtering - H10P 14/3426: {Oxides} - H10P 14/3434: {being oxide semiconductor materials (Group IIB-VIA semiconductor materials H10P14/3424)} - C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04) - H01J: ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS (spark-gaps H01T; electric arc lamps H05B31/00; particle accelerators H05H) - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 ## Abstract A sputtering apparatus includes a chamber. A substrate supporting part is disposed in the chamber. A plurality of targets face the substrate supporting part. A target supporting part is disposed under each of the targets to hold the target. A first ground part is disposed between two target supporting parts adjacent to each other and includes a cover separable therefrom. A second ground part is disposed between two target supporting parts adjacent to each other, except for where the first ground part is disposed. ## Claims ### Claim 1 A sputtering apparatus comprising: a chamber; a substrate supporting part disposed in the chamber; a plurality of targets disposed within the chamber and facing the substrate supporting part; a plurality of target supporting parts, each of the plurality of target supporting parts disposed under a corresponding target of the plurality of targets, the target supporting part configured to hold the plurality of targets; a first ground part disposed between a first two adjacent target supporting parts of the plurality of target supporting parts, the first ground part comprising a removable cover; and a plurality of second ground parts, each of which is disposed between adjacent target supporting parts of the plurality of target supporting parts, except for between the first two adjacent target supporting parts where the first ground part is disposed. ### Claim 2 (depends on 1) The sputtering apparatus of claim 1, wherein the first ground part comprises a base plate extending along a longitudinal direction of the target; and a wall extending perpendicular to the base plate from the base plate. ### Claim 3 (depends on 2) The sputtering apparatus of claim 2, wherein the cover of the first ground part comprises a cover body disposed on the wall, and a cover protrusion protruding from the cover body, the cover protrusion overlapping a portion of a target of the plurality of targets adjacent to the first ground part. ### Claim 4 (depends on 3) The sputtering apparatus of claim 3, wherein the cover body of the cover has a fixing groove combined with the wall. ### Claim 5 (depends on 4) The sputtering apparatus of claim 4, wherein a first combining portion is formed at the wall of the first ground part, a second combining portion is formed at the cover boy of the cover, and the cover is fixed to the wall by combination of the first combining portion and the second combining portion. ### Claim 6 (depends on 4) The sputtering apparatus of claim 4, wherein the cover body extends between a first two adjacent targets adjacent of the plurality of targets that correspond to the first two adjacent target supporting parts. ### Claim 7 (depends on 2) The sputtering apparatus of claim 2, wherein the second ground part comprises a base plate extending plate extending along a longitudinal direction of the target; and a wall extending perpendicular to the base plate from the base plate, and wherein the base plate and the wall of the second ground part has a shape substantially the same as the base plate and the wall of the first ground part. ### Claim 8 (depends on 7) The sputtering apparatus of claim 7, wherein a first combining portion is formed at the wall, a second combining portion is formed at the cover, the first combining portion and second combining portion are combined together, a third combining portion is formed at the second ground part, the second ground part is substantially the same as a shape of the first ground part excluding the cover. ### Claim 9 (depends on 1) The sputtering apparatus of claim 1, further comprising an insulation element disposed between the first or second ground part and the target supporting part to insulate the first or second ground part from the target supporting part. ### Claim 10 (depends on 1) The sputtering apparatus of claim 1, further comprising a mask disposed between the plurality of targets and the plurality of target supporting parts, the mask defining a sputtering area. ### Claim 11 (depends on 1) The sputtering apparatus of claim 1, wherein the plurality of targets comprise an oxide semiconductor material. ### Claim 12 (depends on 11) The sputtering apparatus of claim 11, wherein the oxide semiconductor material comprises zinc oxide (ZnO), zinc tin oxide (ZTO), zinc indium oxide (ZIO), indium oxide (InO), titanium oxide (TiO), indium gallium zinc oxide (IGZO), or indium zinc tin oxide (IZTO). ### Claim 13 (depends on 1) The sputtering apparatus of claim 1, wherein a substrate is held on the substrate supporting part, a thin film is formed on the substrate by deposition of a deposition material that includes in the target, and a cutting line is formed on the substrate, the cutting line running through a center of the first ground part. ### Claim 14 (depends on 1) The sputtering apparatus of claim 1, wherein the first two target supporting parts are disposed at a center of the sputtering apparatus. ### Claim 15 (depends on 1) The sputtering apparatus of claim 1, further comprising: a third ground part having a shape substantially the same as the first ground part, the third ground part spaced apart form the first ground part by at least two targets of the plurality of targets, and a fourth ground part having a shape substantially the same as the first ground part, the fourth ground part spaced apart form the first ground part by at least two targets of the plurality of targets. ### Claim 16 (depends on 15) The sputtering apparatus of claim 15, wherein a substrate is held on the substrate supporting part, a thin film is formed on the substrate by deposition of a deposition material, and cutting lines are formed on the substrate, the cutting lines correspond to the first, third and fourth ground parts, respectively. ### Claim 17 (depends on 1) The sputtering apparatus of claim 1, wherein the plurality of the targets includes 14 targets, the first the two adjacent targets are centered among the plurality of targets, and there are 12 ground parts within the plurality of second ground parts. ### Claim 18 (depends on 1) The sputtering apparatus of claim 1, wherein the width of the target supporting part is substantially the same as width of each target of the plurality of targets. ### Claim 19 A method of manufacturing a display substrate, comprising: forming a thin film on a substrate using a sputtering apparatus, the sputtering apparatus comprising a chamber, a substrate supporting part disposed in the chamber, a plurality of targets facing the substrate supporting part, a target supporting part disposed under each of the plurality of targets, a first ground part disposed between a first two adjacent target supporting parts of the plurality of target supporting parts, the first ground part comprising a removable cover, and a plurality of second ground parts, each of which is disposed between adjacent target supporting parts of the plurality of target supporting parts, except for between the first two adjacent target supporting parts where the first ground part is disposed; and cutting a cutting line of the substrate, the cutting line running through a center of the first ground part and forming the display substrate. ### Claim 20 (depends on 19) The method of claim 19, wherein the thin film comprises an oxide semiconductor material.