# US 2014/0151107 A1 · Touch member and method of manufacturing the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0151107 A1 - Document ID: US20140151107A1 - Status: Published application - Kind: A1 - Application number: 13/845,325 - Filed: 2013-03-18 - Published: 2014-06-05 - Earliest claimed: 2012-12-05 - Assignees: Unimicron Technology Corp. - Applicants: Unimicron Technology Corp. - Inventors: CHENG-MING WENG; WEI-MING CHENG; HAN-PEI HUANG - Web page: https://patentgrep.com/patent/US20140151107A1 ## CPC - H05K 1/115: {Via connections; Lands around holes or via connections (H05K1/112 takes precedence)} - H05K 3/0032: {of organic insulating material} - H05K 3/42: Plated through-holes {or plated via connections} - H05K 3/426: {initial plating of through-holes in substrates without metal} - H05K 2201/09563: Metal filled via - H05K 2201/09709: Staggered pads, lands or terminals; Parallel conductors in different planes - H05K 2201/09836: Oblique hole, via or bump - H05K 2201/09854: Hole or via having special cross-section, e.g. elliptical - H05K 2203/1476: Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning - H05K 2203/1572: Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides - Y10T 29/49165: by forming conductive walled aperture in base - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract A wiring board includes a substrate, a first conductor layer, a second conductor layer, and a through-via conductor. The substrate has a first surface, a second surface, and at least one through-via. The first conductor layer is formed on the first surface, and the second conductor layer is formed on the second surface. The through-via conductor is formed in the through-via for electrically connecting to the first conductor layer and the second conductor layer. The through-via has a first depressed portion exposed in the first surface, a second depressed portion exposed in the second surface, and a tunnel portion between the first depressed portion and the second depressed portion for connecting the first depressed portion and the second depressed portion. The first depressed portion and the second depressed, portion are non-coaxial. ## Claims ### Claim 1 A wiring board comprising: a substrate having a first surface and a second surface, the substrate having at least one through-via passing through the substrate from the first surface to the second surface; a first conductor layer formed on the first surface; a second conductor layer formed on the second surface; and a through-via conductor formed in the through-via for electrically connecting to the first conductor layer and the second conductor layer; wherein the through-via has a first depressed portion exposed in the first surface, a second depressed portion exposed in the second surface, and a tunnel portion between the first depressed portion and the second depressed portion for connecting the first depressed portion and the second depressed portion, wherein the first depressed portion and the second depressed portion are non-coaxial, and an internal diameter of the tunnel portion is less than a diameter of the first depressed portion in the first surface and a diameter of the second depressed portion in the second surface. ### Claim 2 (depends on 1) The wiring board according to claim 1, wherein in a side wall of the first depressed portion and a side wall of the tunnel portion intersect to define a first neck portion that lies in a first reference plane, a side wall of the second depressed portion and the side wall of the tunnel portion intersect to define a second neck portion that lies in a second reference plane, wherein a first angle, which is greater than 45 degrees, is formed between the first reference plane and the side wall of the first depressed portion, and a second angle, which is greater than 45 degrees, is formed between the second reference plane and the side wall of the second depressed portion. ### Claim 3 (depends on 1) The wiring board according to claim 1, wherein axes of the first depressed portion and the tunnel portion are not parallel to each other, and axes of the second depressed portion and the tunnel portion are not parallel to each other. ### Claim 4 (depends on 1) The wiring board according to claim 1, wherein axes of the first depressed portion and the second depressed portion are parallel to each other, such that a distance there between is in a range of 5 micrometer to 40 micrometers. ### Claim 5 (depends on 4) The wiring board according to claim 4, wherein axes of the first depressed portion and the second depressed portion slant toward each other at an angle, which is in a range of 5 to 70 degrees. ### Claim 6 (depends on 1) The wiring board according to claim 1, wherein the side wall of the first depressed portion decreases in diameter from the first surface toward the second surface, while the side wall of the second depressed portion decreases in diameter from the second surface toward the first surface. ### Claim 7 (depends on 1) The wiring board according to claim 1 wherein the first depressed portion has a first depth from the first surface, the second depressed portion has a second depth from the second surface, wherein the sum of the first depth and the second depth is not greater than a vertical distance, which is measured between the first surface and the second surface. ### Claim 8 (depends on 1) The wiring board according to claim 1, wherein the first depressed portion has a first depth from the first surface, the second depressed portion has a second depth, which is not equal to the first depth, from the second surface wherein the sum of the first depth and the second depth is greater than a vertical distance, which is measured between the first surface and the second surface. ### Claim 9 A method of manufacturing wiring board comprising: forming at least one through-via passing through an initial substrate from a first surface of the substrate to a second surface of the substrate, wherein the through-via has a first depressed portion exposed in the first surface, a second depressed portion exposed in the second surface, and a tunnel portion between the first depressed portion and the second depressed portion for connecting the first depressed portion and the second depressed portion, wherein the first depressed portion and the second depressed portion are non-coaxial, and an internal diameter of the tunnel portion is less than a diameter of the first depressed portion in the first surface and a diameter of the second depressed portion in the second surface; forming a first conductor layer on the first surface; forming a second conductor layer on the second surface; and forming a through-via conductor in the through-via for electrically connecting to the first conductor layer and the second conductor layer. ### Claim 10 (depends on 9) The method of manufacturing wiring board according to claim 9, wherein in the step of forming the through-via passing through an initial substrate further includes: forming the first depressed portion exposed in the first surface; forming the second depressed portion exposed in the second surface; and forming the tunnel portion between the first depressed portion and the second depressed portion for connecting the first depressed portion and the second depressed portion. ### Claim 11 (depends on 10) The method of manufacturing wiring board according to claim 10, wherein in the step of forming the tunnel portion further includes: targeting the first depressed portion or the second depressed portion with a laser beam such that the incident direction of the laser beam slants toward the first surface or the second surface. ### Claim 12 (depends on 9) The method of manufacturing wiring board according to claim 9, wherein a side wall of the first depressed portion and a side wall of the tunnel portion intersect to define a first neck portion that lies in a first reference plane, a side wall of the second depressed portion and the side wall of the tunnel portion intersect to define a second neck portion that lies in a second reference plane, wherein a first angle, which is greater than 45 degrees, is formed between the first reference plane and the side wall of the first depressed portion, and a second angle, which is greater than 45 degrees, is formed between the second reference plane and the side wall of the second depressed portion. ### Claim 13 (depends on 10) The method of manufacturing wiring board according to claim 10, wherein a side wall of the first depressed portion and a side wall of the tunnel portion intersect to define a first neck portion that lies in a first reference plane, a side wall of the second depressed portion and the side wall of the tunnel portion intersect to define a second neck portion that lies in a second reference plane, wherein a first angle, which is greater than 45 degrees, is formed between the first reference plane and the side wall of the first depressed portion, and a second angle, which is greater than 45 degrees, is formed between the second reference plane and the side wall of the second depressed portion. ### Claim 14 (depends on 11) The method of manufacturing wiring board according to claim 11, wherein a side wall of the first depressed portion and a side wall of the tunnel portion intersect to define a first neck portion that lies in a first reference plane, a side wall of the second depressed portion and the side wall of the tunnel portion intersect to define a second neck portion that lies in a second reference plane, wherein a first angle, which is greater than 45 degrees, is formed between the first reference plane and the side wall of the first depressed portion, and a second angle, which is greater than 45 degrees, is formed between the second reference plane and the side wall of the second depressed portion. ### Claim 15 (depends on 9) The method of manufacturing wiring board according to claim 9, wherein axes of the first depressed portion and the tunnel portion are not parallel to each other, and axes of the second depressed portion and the tunnel portion are not parallel to each other. ### Claim 16 (depends on 9) The method of manufacturing wiring board according to claim 9, wherein axes of the first depressed portion and the second depressed portion are parallel to each other, such that a distance there between is in a range of 5 micrometer to 40 micrometers. ### Claim 17 (depends on 9) The method of manufacturing wiring board according to claim 9, wherein axes of the first depressed portion and the second depressed portion slant toward each other at an angle, which is in a range of 5 to 70 degrees. ### Claim 18 (depends on 9) The method of manufacturing wiring board according to claim 9, wherein the side wall of the first depressed portion decreases in diameter from the first surface toward the second surface, while the side wall of the second depressed portion decreases in diameter from the second surface toward the first surface. ### Claim 19 (depends on 9) The method of manufacturing wiring board according to claim 9, wherein the first depressed portion has a first depth from the first surface, the second depressed portion has a second depth from the second surface, wherein the sum of the first depth and the second depth is not greater than a vertical distance, which is measured between the first surface and the second surface. ### Claim 20 (depends on 9) The method of manufacturing wiring board according to claim 9, wherein the first depressed portion has a first depth from the first surface, the second depressed portion has a second depth, which is not equal to the first depth, from the second surface, wherein the sum of the first depth and the second depth is greater than a vertical distance, which is measured between the first surface and the second surface.