# US 2014/0151106 A1 · Wiring board and method for manufacturing wiring board

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- Number: US 2014/0151106 A1
- Document ID: US20140151106A1
- Status: Published application
- Kind: A1
- Application number: 14/118,636
- Filed: 2012-05-23
- Published: 2014-06-05
- Earliest claimed: 2011-05-26
- Assignees: Kabushiki Kaisha Toyota Jidoshokki
- Applicants: Kabushiki Kaisha Toyota Jidoshokki
- Inventors: Kiminori Ozaki; Yasuhiro Koike; Hiroaki Asano; Harumitsu Sato; Hiroki Watanabe; Tadayoshi Kachi; Takahiro Suzuki; Hitoshi Shimadu; Tetsuya Furuta; Masao Miyake; Takahiro Hayakawa; Tomoaki Asai; Ryou Yamauchi
- Web page: https://patentgrep.com/patent/US20140151106A1

## CPC

- H05K 1/11: Printed elements for providing electric connections to or between printed circuits
- H05K 3/0094: {Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement}
- H05K 3/4084: {by deforming at least one of the conductive layers}
- H05K 1/0263: {High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board (H05K1/0293 takes precedence)}
- H05K 1/115: {Via connections; Lands around holes or via connections (H05K1/112 takes precedence)}
- H05K 3/4038: {Through-connections; Vertical interconnect access [VIA] connections (H05K3/403, H05K3/42 take precedence)}
- H05K 3/4046: {using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire}
- H05K 2201/0305: Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
- H05K 2201/09509: Blind vias, i.e. vias having one side closed
- H05K 2201/0969: Apertured conductors
- H05K 2203/033: Punching metal foil, e.g. solder foil
- H05K 2203/1178: Means for venting or for letting gases escape
- Y10T 29/49165: by forming conductive walled aperture in base
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

An electrically conductive path is configured from a first copper plate, a second copper plate, and solder. The first copper plate has a first bent section extended from a first joining section joined to an electrically insulative board and bent toward the rear surface of the electrically insulative board. The second copper plate has a second bent section which is extended from a second joining section joined to the electrically insulative board, is bent toward the front surface of the electrically insulative board, and is disposed so as to cover, together with the first bent section, the inner wall surface of a base-material through-hole. Through-holes are provided in the portions of the second copper plate which face the inside of the base-material through-hole. Solder is filled between the first bent section and the second bent section.

## Claims

### Claim 1

A wiring board comprising:
a base including a front surface, a rear surface, and a side surface;
a first metal plate joined with the front surface;
a second metal plate joined with the rear surface; and
a conductive line configured to electrically connect the first metal plate and the second metal plate, wherein the conductive line is arranged in an inner space defined by an inner wall surface of a base through hole formed in the base or an outer space located at an outer side of the side surface of the base, and the conductive line includes the first metal plate, the second metal plate, and a conductive material electrically connecting the first metal plate and the second metal plate,
wherein at least one of the first metal plate and the second metal plate includes a joined portion, which is joined with the base, and a bent portion, which is bent and extended from the joined portion to cover the inner wall surface or the side surface, and
the conductive material fills an inner side of the bent portion.

### Claim 2 (depends on 1)

The wiring board according to claim 1, wherein
the first metal plate includes a first joined portion, which serves as the joined portion, and a first bent portion, which serves as the bent portion, and the first bent portion is bent toward the rear surface;
the second metal plate includes a second joined portion, which serves as the joined portion, and a second bent portion, which serves as the bent portion, and the second bent portion is bent toward the front surface to cover the inner wall surface or the side surface together with the first bent portion; and
the conductive material is filled between the first bent portion and the second bent portion.

### Claim 3 (depends on 1)

The wiring board according to claim 1, wherein the second metal board includes a through hole in a portion facing toward the inner space or the outer space.

### Claim 4 (depends on 2)

The wiring board according to claim 2, wherein
the conductive line is arranged in the inner space;
the first bent portion is bent toward the inner space from an open end of the base through hole that opens in the front surface, and the first bent portion includes a through hole in a portion corresponding to a central portion of the base through hole; and
the second bent portion is bent toward the inner space from an open end of the base through hole that opens in the rear surface, and the second bent portion is inserted into the through hole of the first bent portion.

### Claim 5 (depends on 3)

The wiring board according to claim 3, wherein the through hole formed in the second metal plate is one of a plurality of through holes arranged on a circumference extending about a center axis of the base through hole, which has a circular cross-section.

### Claim 6 (depends on 5)

The wiring board according to claim 5, wherein the through holes formed in the second metal plate are arranged at equal angular intervals.

### Claim 7

A wiring board comprising:
a base including a front surface, a rear surface, and a base through hole;
a first metal plate joined with the front surface;
a second metal plate joined with the rear surface; and
a conductive line arranged in an inner space of the base through hole to electrically connect the first metal plate and the second metal plate, wherein the conductive line includes the first metal plate, the second metal plate, and a conductive material that electrically connects the first metal plate and the second metal plate,
wherein the second metal plate includes a joined portion, which is joined with the base, and an extended portion, which extends from the joined portion to an opening of the base through hole,
a plate material, which includes a through hole that is in communication with the base through hole, is arranged in the inner space, and
the conductive material fills the through hole of the base material.

### Claim 8 (depends on 7)

The wiring board according to claim 7, wherein the extended portion includes a through hole that is in communication with the through hole of the plate material.

### Claim 9 (depends on 7)

The wiring board according to claim 7, wherein
the first metal plate includes a joined portion, which is joined with the base, and an extended portion, which extends from the joined portion to the opening of the base through hole, wherein the extended portion includes a through hole that is smaller than the base through hole; and
the through hole of the plate material is in communication with the through hole of the first metal plate, and the conductive material is filled in the through hole of the first metal plate and the through hole of the plate material.

### Claim 10

A method for manufacturing a wiring board including
a base including a front surface, a rear surface, and a side surface;
a first metal plate joined with the front surface;
a second metal plate joined with the rear surface; and
a conductive line configured to electrically connect the first metal plate and the second metal plate, wherein the conductive line is arranged in an inner space defined by an inner wall surface of a base through hole formed in the base, and the conductive line includes the first metal plate, the second metal plate, and a conductive material electrically connecting the first metal plate and the second metal plate,
wherein at least one of the first metal plate and the second metal plate includes a joined portion, which is joined with the base, and a bent portion, which is bent and extended from the joined portion to cover the inner wall surface,
the method comprising the steps of:
joining the first metal plate with the front surface;
joining the second metal plate with the rear surface to close one open end of the base through hole;
applying solder paste to a front surface of the first metal plate at a portion corresponding to the other open end of the base through hole;
forming a through hole in the second metal plate at a portion facing the inner space; and
performing a reflow process on the solder paste to fill solder, which serves as the conductive material, into a space formed by the through hole and an inner side of the bent portion while removing gas from the through hole of the second metal plate.

### Claim 11

A method for manufacturing a wiring board including
a base including a front surface, a rear surface, and a side surface;
a first metal plate joined with the front surface;
a second metal plate joined with the rear surface; and
a conductive line configured to electrically connect the first metal plate and the second metal plate, wherein the conductive line is arranged in an inner space defined by an inner wall surface of a base through hole formed in the base, and the conductive line includes the first metal plate, the second metal plate, and a conductive material electrically connecting the first metal plate and the second metal plate,
the method comprising the steps of:
arranging the second metal plate that includes a through hole on the rear surface, wherein the through hole of the second metal plate is in communication with the base through hole and has a smaller opening area than the base through hole;
arranging a plate material that includes a through hole in the base through hole, wherein the through hole of the plate material is in communication with the through hole of the second metal plate and has a larger opening area than the through hole of the second metal plate;
arranging the first metal plate that includes a through hole on the front surface, wherein the through hole of the first metal plate is in communication with the through hole of the plate material; and
filling a space formed by the through hole of the second metal plate, the through hole of the first metal plate, and the through hole of the plate material with solder, which serves as the conductive material.