# US 2014/0151101 A1 · Embedded multilayer ceramic electronic component and method of manufacturing the same, and printed circuit board having embedded multilayer ceramic electronic component therein

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- Number: US 2014/0151101 A1
- Document ID: US20140151101A1
- Status: Published application
- Kind: A1
- Application number: 13/770,971
- Filed: 2013-02-19
- Published: 2014-06-05
- Earliest claimed: 2012-12-04
- Assignees: Samsung Electro-Mechanics Co., Ltd.
- Applicants: Samsung Electro-Mechanics Co., Ltd.
- Inventors: Hai Joon LEE; Byoung Hwa LEE; Jin Man JUNG
- Web page: https://patentgrep.com/patent/US20140151101A1

## CPC

- H01G 4/12: Ceramic dielectrics {(H01G4/085 takes precedence)}
- H05K 1/185: associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
- H05K 2201/10636: Leadless chip, e.g. chip capacitor or resistor
- Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product
- H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10)
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS

## Abstract

There is provided an embedded multilayer ceramic electronic component, including: a ceramic body including dielectric layers; first and second internal electrodes facing each other with the dielectric layers interposed therebetween; a first external electrode and a second external electrode formed on external surfaces of the ceramic body, the first external electrode being electrically connected to the first internal electrodes and the second external electrode being electrically connected to the second internal electrodes; and a plating layer formed on the first external electrode and the second external electrode, wherein a surface roughness of the ceramic body is 500 nm or greater and not greater than a thickness of a ceramic cover sheet and a surface roughness of the plating layer is 300 nm or greater and not greater than a thickness of the plating layer.

## Claims

### Claim 1

An embedded multilayer ceramic electronic component, comprising:
a ceramic body including dielectric layers;
first and second internal electrodes facing each other with the dielectric layers interposed therebetween;
a first external electrode and a second external electrode formed on external surfaces of the ceramic body, the first external electrode being electrically connected to the first internal electrodes and the second external electrode being electrically connected to the second internal electrodes; and
a plating layer formed on the first external electrode and the second external electrode,
wherein a surface roughness of the ceramic body is 500 nm or greater and not greater than a thickness of a ceramic cover sheet and a surface roughness of the plating layer is 300 nm or greater and not greater than a thickness of the plating layer.

### Claim 2 (depends on 1)

The embedded multilayer ceramic electronic component of claim 1, wherein the surface roughness of the ceramic body is 700 nm or greater and not greater than the thickness of the ceramic cover sheet.

### Claim 3 (depends on 1)

The embedded multilayer ceramic electronic component of claim 1, wherein the surface roughness of the plating layer is 500 nm or greater and not greater than the thickness of the plating layer.

### Claim 4 (depends on 1)

The embedded multilayer ceramic electronic component of claim 1, wherein the thickness of the ceramic cover sheet is 1 μm or greater and not greater than 30 μm.

### Claim 5 (depends on 1)

The embedded multilayer ceramic electronic component of claim 1, wherein the thickness of the plating layer is greater than 4 μm and smaller than 15 μm.

### Claim 6

A method of manufacturing an embedded multilayer ceramic electronic component, the method comprising:
preparing ceramic green sheets including dielectric layers;
forming internal electrode patterns on the ceramic green sheets by using a conductive paste for internal electrodes containing a conductive metal powder and a ceramic powder;
laminating the ceramic green sheets having the internal electrode patterns formed thereon, to thereby form a ceramic body including first internal electrodes and second internal electrodes facing each other therein;
placing sandpaper on each of an upper surface and a lower surface of the ceramic body and performing compressing thereon;
removing the sandpaper from the ceramic body and firing the ceramic body;
forming a first external electrode and a second external electrode on the upper and lower surfaces and end surfaces of the ceramic body;
forming a plating layer on the first external electrode and the second external electrode; and
applying a sand blasting method to the ceramic body and the plating layer formed on the first external electrode and the second external electrode to control surface roughnesses thereof,
wherein the surface roughness of the ceramic body is 500 nm or greater and not greater than a thickness of a ceramic cover sheet and the surface roughness of the plating layer is 300 nm or greater and not greater than a thickness of the plating layer.

### Claim 7 (depends on 6)

The method of claim 6, wherein the surface roughness of the ceramic body is 700 nm or greater and not greater than the thickness of the ceramic cover sheet.

### Claim 8 (depends on 6)

The method of claim 6, wherein the surface roughness of the plating layer is 500 nm or greater and not greater than the thickness of the plating layer.

### Claim 9 (depends on 6)

The method of claim 6, wherein the thickness of the ceramic cover sheet is 1 μm or greater and not greater than 30 μm.

### Claim 10 (depends on 6)

The method of claim 6, wherein the thickness of the plating layer is greater than 4 μm and smaller than 15 μm.

### Claim 11

A printed circuit board having an embedded multilayer ceramic electronic component therein, the printed circuit board comprising:
an insulating substrate; and
an embedded multilayer ceramic electronic component, including: a ceramic body including dielectric layers; first and second internal electrodes facing each other with the dielectric layers interposed therebetween; a first external electrode and a second external electrode formed on external surfaces of the ceramic body, the first external electrode being electrically connected to the first internal electrodes and the second external electrode being electrically connected to the second internal electrodes; and a plating layer formed on the first external electrode and the second external electrode, a surface roughness of the ceramic body being 500 nm or greater and not greater than a thickness of a ceramic cover sheet and a surface roughness of the plating layer being 300 nm or greater and not greater than a thickness of the plating layer.

### Claim 12 (depends on 11)

The printed circuit board of claim 11, wherein the surface roughness of the ceramic body is 700 nm or greater and not greater than the thickness of the ceramic cover sheet.

### Claim 13 (depends on 11)

The printed circuit board of claim 11, wherein the surface roughness of the plating layer is 500 nm or greater and not greater than the thickness of the plating layer.

### Claim 14 (depends on 11)

The printed circuit board of claim 11, wherein the thickness of the ceramic cover sheet is 1 μm or greater and not greater than 30 μm.

### Claim 15 (depends on 11)

The printed circuit board of claim 11, wherein the thickness of the plating layer is greater than 4 μm and smaller than 15 μm.