# US 2014/0151100 A1 · Electronic component embedded printed circuit board

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- Number: US 2014/0151100 A1
- Document ID: US20140151100A1
- Status: Published application
- Kind: A1
- Application number: 14/092,188
- Filed: 2013-11-27
- Published: 2014-06-05
- Earliest claimed: 2012-11-30
- Assignees: Samsung Electro-Mechanics Co., Ltd.
- Applicants: Samsung Electro-Mechanics Co., Ltd.
- Inventors: Yeon Seop YU; Moon II Kim; Jun Young Kim
- Web page: https://patentgrep.com/patent/US20140151100A1

## CPC

- H05K 1/185: associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
- H05K 1/0373: {containing additives, e.g. fillers (H05K1/036 takes precedence)}
- H05K 2201/0239: Coupling agent for particles
- H05K 2201/10636: Leadless chip, e.g. chip capacitor or resistor
- H10W 72/9413: {on encapsulations}
- H10W 74/019: {using temporary auxiliary substrates (H10W74/017 takes precedence)}
- Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS

## Abstract

An electronic component embedded printed circuit board includes a core having a cavity; an electronic component inserted in the cavity; insulating layers laminated on top and bottom of the core and mixed with a coupling agent, which has functional groups respectively acting on an organic material and an inorganic material, to be bonded to an outer peripheral surface of the electronic component; and circuit patterns provided on the insulating layers.

## Claims

### Claim 1

An electronic component embedded printed circuit board comprising:
a core having a cavity;
an electronic component inserted in the cavity;
insulating layers laminated on top and bottom of the core and mixed with a coupling agent, which has functional groups respectively acting on an organic material and an inorganic material, to be bonded to an outer peripheral surface of the electronic component; and
circuit patterns provided on the insulating layers.

### Claim 2 (depends on 1)

The electronic component embedded printed circuit board according to claim 1, wherein the electronic component is an MLCC comprising external electrodes provided on both sides and a main body provided between the external electrodes.

### Claim 3 (depends on 1)

The electronic component embedded printed circuit board according to claim 1, wherein the coupling agent mixed in the insulating layer is organotitanates that consists of at least two functional groups and is represented by the following Chemical Formula:
(XO)n—Ti—(OY)4-n Chemical Formula
where X is an alkyl group, Y is an organo-functional group, and n is a natural number including 1, 2, 3.

### Claim 4 (depends on 3)

The electronic component embedded printed circuit board according to claim 3, wherein the organotitanates is mixed in an amount of 0.1 to 3.0 wt % based on the weight of an inorganic filler included in the insulating layer.

### Claim 5 (depends on 3)

The electronic component embedded printed circuit board according to claim 3, wherein the alkyl group is one of n-propyl, iso-propyl, n-butyl, and iso-octylethyl.

### Claim 6 (depends on 3)

The electronic component embedded printed circuit board according to claim 3, wherein the organo-functional group is one of carboxyl, ester, phosphato, pyrophosphato, and sulfonato.

### Claim 7 (depends on 3)

The electronic component embedded printed circuit board according to claim 3, wherein the organotitanates is one of monoalkoxy, chelate, coordinate, quat salt, neoalkoxy, and cyclo heteroatom.

### Claim 8 (depends on 1)

The electronic component embedded printed circuit board according to claim 1, wherein the insulating layer is made of a thermosetting resin composition containing an inorganic filler and is made of a prepreg (PPG) containing 0.1 to 3.0 wt % of organotitanates based on the weight of the inorganic filler mixed in the thermosetting resin composition.

### Claim 9 (depends on 1)

The electronic component embedded printed circuit board according to claim 1, further comprising:
a via formed inside the insulating layer to electrically connect the circuit pattern and the external electrode.

### Claim 10 (depends on 1)

The electronic component embedded printed circuit board according to claim 1, wherein the insulating layer is filled in a space between the cavity and the electronic component to surround the entire outer peripheral surface of the electronic component.

### Claim 11 (depends on 2)

The electronic component embedded printed circuit board according to claim 2, wherein circuit layers of a predetermined pattern are formed on upper and lower surfaces of the core to be electrically connected through a through hole.