# US 2014/0151099 A1 · Wiring board and laser drilling method thereof

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- Number: US 2014/0151099 A1
- Document ID: US20140151099A1
- Status: Published application
- Kind: A1
- Application number: 13/845,339
- Filed: 2013-03-18
- Published: 2014-06-05
- Earliest claimed: 2012-12-03
- Assignees: Unimicron Technology Corp.
- Applicants: Unimicron Technology Corp.
- Inventors: CHENG MING WENG; WEI-MING CHENG; HAN-PEI HUANG
- Web page: https://patentgrep.com/patent/US20140151099A1

## CPC

- H05K 1/115: {Via connections; Lands around holes or via connections (H05K1/112 takes precedence)}
- H05K 3/0035: {of blind holes, i.e. having a metal layer at the bottom}
- H05K 1/0366: {reinforced, e.g. by fibres, fabrics (H05K1/036 takes precedence)}
- H05K 2201/09827: Tapered, e.g. tapered hole, via or groove
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

A laser drilling method of a wiring board is provided. In the method, a laser beam shines on a wiring substrate including an insulating layer to remove a portion of the insulating layer. The wiring substrate is placed in a focus section of the laser beam. The focus section contains a central region, an optical axis located in the central region, and a peripheral region surrounding the central region. The maximum light intensity of the focus section is located in the peripheral region.

## Claims

### Claim 1

A laser drilling method of a wiring board, comprising:
shining a laser beam on a wiring substrate comprising an insulating layer to remove a portion of the insulation layer, wherein the wiring substrate is placed in a focus section of the laser beam, the focus section having a central region, an optical axis located in the central region, and a peripheral region surrounding the central region, a maximum light intensity of the focus section appeared in the peripheral region.

### Claim 2 (depends on 1)

The laser drilling method according to claim 1, wherein the light intensity of the focus section is gradually increasing from the central region toward the peripheral region.

### Claim 3 (depends on 1)

The laser drilling method according to claim 1, wherein the ratio of a minimum light intensity of the focus section to the maximum light intensity thereof in the central region lies between 0.8 to 0.95.

### Claim 4 (depends on 1)

The laser drilling method according to claim 1, wherein when the laser beam shines on the wiring substrate, a beam waist of the laser beam is located above the wiring substrate.

### Claim 5 (depends on 1)

The laser drilling method according to claim 1, wherein the laser beam is a pulsed laser beam.

### Claim 6 (depends on 1)

The laser drilling method according to claim 1, wherein the wavelength of the laser beam ranges from 256 nm to 10200 nm.

### Claim 7 (depends on 1)

The laser drilling method according to claim 1, wherein the wiring substrate further comprises a metal layer, the metal layer is disposed on the insulation layer, removing a portion of the metal layer before shining the laser beam on the wiring substrate to form an opening exposing the insulation layer, wherein the laser beam shines on the portion of the insulation layer exposed by the opening.

### Claim 8

A wiring board, comprising:
an insulation layer:
two wiring layers, the insulation layer disposed between the wiring layers; and
at least a conductor, disposed in the insulation layer, and electrically connected to the wiring layer, wherein the conductor has a first end and a second end opposite to the first end, the width of the first end being larger than the width of the second end, and the ratio of the width of the second end to the width of the first end being larger than or equal to 0.75.

### Claim 9 (depends on 8)

The wiring board according to claim 8, wherein the ratio of the width of the second end to the width of the first end is smaller than 1.

### Claim 10 (depends on 8)

The wiring board according to claim 8, wherein the aspect ratio of at least one conductor lies between 0.8 to 5.

### Claim 11 (depends on 8)

The wiring board according to claim 8, wherein the insulation layer is in contact with the wiring layer.

### Claim 12 (depends on 8)

The wiring board according to claim 8, wherein the insulation layer comprises a polymeric material, the polymeric material being selected from the group consisting of epoxy, modified epoxy, polyester, acrylic ester, fluoro-polymer, polyphenylene oxide, polymide, phenolicresin, polysulfone, silicone polymer, bismaleimide triazine modified epoxy, cyanate ester, polyethylene, polycarbonate, acrylonitrile-butadiene-styrene copolymer, polyethylene terephthalate, polybutylene terephthalate, liquid crystal polymers, polyamide 6, nylon, polyoxmethylene, polyphenlene sulfide, cyclic olefin copolymer, and combination of selected element thereof.

### Claim 13 (depends on 12)

The wiring board according to claim 12, wherein the insulation layer further comprises a fiberglass, and the fiberglass is impregnated with polymeric material.

### Claim 14 (depends on 8)

The wiring board according to claim 8, wherein the insulation layer is a ceramic layer.