# US 2014/0151098 A1 · Conductive substrate comprising conductive pattern and touch panel comprising same

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 2014/0151098 A1
- Document ID: US20140151098A1
- Status: Published application
- Kind: A1
- Application number: 14/234,337
- Filed: 2012-09-27
- Published: 2014-06-05
- Earliest claimed: 2011-09-27
- Assignees: LG Chem, Ltd.
- Applicants: LG Chem, Ltd.
- Inventors: Ji Young Hwang; In-Seok Hwang; Seung Heon Lee; Sang Ki Chun; Beom Mo Koo
- Web page: https://patentgrep.com/patent/US20140151098A1

## CPC

- H05K 1/0274: {Optical details, e.g. printed circuits comprising integral optical means (H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42)}
- G06F 3/047: using sets of wires, e.g. crossed wires
- H05K 1/03: Use of materials for the substrate
- H05K 1/092: {Dispersed materials, e.g. conductive pastes or inks}
- H05K 3/10: in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K 3/1275: {by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing}
- G06F 3/0412: {Digitisers structurally integrated in a display}
- G06F 2203/04103: Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
- G06F 2203/04112: Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N)

## Abstract

The present invention relates to a conductive substrate comprising a conductive pattern having an improved concealment property and a touch panel comprising the same, and the conductive substrate according to the present invention comprises: a transparent substrate, and a conductive pattern comprising a conductive line provided on the transparent substrate, wherein the conductive pattern comprises two or more conductive lines spaced from each other in a longitudinal direction of the conductive line, and a distance between nearest-adjacent ends of two or more conductive lines spaced from each other is 15 μm or less. The conductive substrate according to the present invention can more efficiently conceal a metal line comprised in the conductive pattern.

## Claims

### Claim 1

A conductive substrate comprising:
a transparent substrate, and
a conductive pattern comprising a conductive line provided on the transparent substrate,
wherein the conductive pattern comprises two or more conductive lines spaced from each other in a longitudinal direction of the conductive line, and a distance between nearest-adjacent ends of two or more conductive lines spaced from each other is 15 μm or less.

### Claim 2 (depends on 1)

The conductive substrate of claim 1, wherein the distance between the nearest-adjacent ends of two or more conductive lines spaced from each other is 10 μm or less.

### Claim 3 (depends on 1)

The conductive substrate of claim 1, wherein the distance between the nearest-adjacent ends of two or more conductive lines spaced from each other is 5 μm or less.

### Claim 4 (depends on 1)

The conductive substrate of claim 1, comprising:
a line breakage portion performing breakage at an angle of 80 to 110° in the longitudinal direction of at least one conductive line constituting the conductive pattern.

### Claim 5 (depends on 1)

The conductive substrate of claim 1, wherein the conductive pattern comprises one or more selected from the group consisting of metal, metal oxides, metal nitrides, metal oxynitrides, and a metal alloy.

### Claim 6 (depends on 1)

The conductive substrate of claim 1, wherein the conductive pattern comprises one or more selected from the group consisting of Ag, Cu, Cr, Al, Mo, Ni, oxides thereof, nitrides thereof, oxynitride thereof, and an alloy thereof.

### Claim 7 (depends on 1)

The conductive substrate of claim 1, wherein the conductive pattern comprises a regular pattern.

### Claim 8 (depends on 1)

The conductive substrate of claim 1, wherein the conductive pattern comprises an irregular pattern.

### Claim 9 (depends on 1)

The conductive substrate of claim 1, wherein the conductive pattern comprises an edge structure of continuously connected closed figures, the closed figures having the same shape are not present in a predetermined unit area (1 cm×1 cm) in the conductive pattern, and the number of vertexes of the closed figures is different from the number of vertexes of quadrangles having the same number as the closed figures.

### Claim 10 (depends on 1)

The conductive substrate of claim 1, wherein the conductive pattern comprises the edge structure of continuously connected closed figures, the closed figures having the same shape are not present in the predetermined unit area (1 cm×1 cm) in the conductive pattern, and the number of vertexes of the closed figures is different from the number of vertexes of a polygon formed by connecting shortest distances between centers of gravity of the closed figures.

### Claim 11 (depends on 1)

The conductive substrate of claim 1, wherein the conductive pattern comprises an edge structure of continuously connected closed figures, the closed figures having the same shape are not present in the predetermined unit area (1 cm×1 cm) in the conductive pattern, and a value of the following Equation 1 is 50 or more in the closed figures:
(Standard deviation of distances between the vertexes/Average of the distances between the vertexes)×100 [Equation 1]

### Claim 12

A conductive substrate comprising:
a transparent substrate, and
a conductive pattern comprising a conductive line provided on the transparent substrate,
wherein the conductive pattern comprises two or more conductive lines spaced from each other in a longitudinal direction of the conductive line, and the conductive pattern further comprises a conductive line provided in spaced regions to be electrically isolated,
the conductive lines provided in the spaced regions to be electrically isolated have an area of 80% to 120% to a product of a length of the spaced region and a line width of the conductive line, and
a distance between ends of the conductive lines provided in the spaced regions to be electrically isolated and ends of the conductive lines spaced from each other, which are adjacent thereto, is 15 μm or less.

### Claim 13 (depends on 12)

The conductive substrate of claim 12, wherein the distance between the ends of the conductive lines provided in the spaced regions to be electrically isolated and the ends of the conductive lines spaced from each other, which are adjacent thereto, is 10 μm or less.

### Claim 14 (depends on 12)

The conductive substrate of claim 12, wherein the distance between the ends of the conductive lines provided in the spaced regions to be electrically isolated and the ends of the conductive lines spaced from each other, which are adjacent thereto, is 5 μm or less.

### Claim 15 (depends on 1)

A method of manufacturing the conductive substrate of claim 1, comprising:
forming a conductive pattern provided on a transparent substrate so that the conductive pattern comprises a line breakage portion performing breakage at an angle of 80 to 110° in a longitudinal direction of at least one conductive line constituting the conductive pattern.

### Claim 16 (depends on 15)

The method of manufacturing the conductive substrate of claim 15, wherein the forming of the conductive pattern provided on the transparent substrate is performed by a printing process.

### Claim 17 (depends on 15)

The method of manufacturing the conductive substrate of claim 15, wherein the printing process is a reverse offset printing process.

### Claim 18 (depends on 1)

A touch panel comprising:
the conductive substrate according to claim 1.

### Claim 19 (depends on 18)

The touch panel of claim 18, wherein a haze value of the touch panel is 10% or less and transmittance is 75% or more.

### Claim 20 (depends on 18)

The touch panel of claim 18, wherein the haze value of the touch panel is 5% or less and the transmittance is 85% or more.

### Claim 21 (depends on 18)

The touch panel of claim 18, wherein the haze value of the touch panel is 2% or less and the transmittance is 90% or more.
