# US 2014/0151095 A1 · Printed circuit board and method for manufacturing the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0151095 A1 - Document ID: US20140151095A1 - Status: Published application - Kind: A1 - Application number: 14/097,036 - Filed: 2013-12-04 - Published: 2014-06-05 - Earliest claimed: 2012-12-05 - Assignees: Samsung Electro-Mechanics Co., Ltd. - Applicants: Samsung Electro-Mechanics Co., Ltd. - Inventors: Suk Hyeon Cho; Tae Hong Min; Seung Yeop Kook; Jung Han Lee; Hye Jin Kim - Web page: https://patentgrep.com/patent/US20140151095A1 ## CPC - H05K 1/0306: {Inorganic insulating substrates, e.g. ceramic, glass} - H05K 1/03: Use of materials for the substrate - H05K 3/108: {by semi-additive methods; masks therefor (characterised by metallic etch mask H05K3/062; electroplating methods or apparatus H05K3/241)} - H05K 3/426: {initial plating of through-holes in substrates without metal} - H05K 2201/0141: Liquid crystal polymer [LCP] - H05K 2201/0145: Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN] - H05K 2201/0154: Polyimide - H05K 2201/0158: Polyalkene or polyolefin, e.g. polyethylene [PE], polypropylene [PP] - H05K 2201/0195: Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure - H05K 2201/0323: Carbon - H05K 2201/09563: Metal filled via - Y10T 29/49155: Manufacturing circuit on or in base - Y10T 29/49165: by forming conductive walled aperture in base - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract Disclosed herein is a printed circuit board, including: a composite sheet including an insulating material and a glass plate bonded to the insulating material; and a circuit layer formed on the composite sheet. ## Claims ### Claim 1 A printed circuit board, comprising: a composite sheet including an insulating material and a glass plate bonded to the insulating material; and a circuit layer formed on the composite sheet. ### Claim 2 (depends on 1) The printed circuit board as set forth in claim 1, wherein the composite sheet has a structure in which the glass plate is bonded to one surface or both surfaces of the insulating material. ### Claim 3 (depends on 1) The printed circuit board as set forth in claim 1, wherein the composite sheet has a structure in which the insulating material is bonded to one surface or both surfaces of the glass plate. ### Claim 4 (depends on 1) The printed circuit board as set forth in claim 1, wherein the circuit layer includes: a circuit pattern formed on the composite sheet; and a via formed to penetrate through the composite sheet. ### Claim 5 (depends on 1) The printed circuit board as set forth in claim 1, wherein the circuit layer includes: a seed layer formed on a surface of the composite sheet; and a plating layer formed on the seed layer. ### Claim 6 (depends on 5) The printed circuit board as set forth in claim 5, wherein the seed layer is made of any one selected from a group consisting of titanium (Ti), aluminum (Al), copper (Cu), molybdenum (Mo), nickel (Ni), silver (Ag), zinc (Zn), carbon (C) or an alloy thereof. ### Claim 7 (depends on 5) The printed circuit board as set forth in claim 5, wherein the seed layer includes: a first seed layer formed on the surface of the composite sheet; and a second seed layer formed on the first seed layer. ### Claim 8 (depends on 1) The printed circuit board as set forth in claim 1, wherein the insulating material is made of polymer having heat resistance. ### Claim 9 (depends on 1) The printed circuit board as set forth in claim 1, wherein the insulating material includes any one selected from a group consisting of liquid crystal polymer (LCP), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyurethane (PU), epoxy in which glass fabric is impregnated, and polyimide. ### Claim 10 A method for manufacturing a printed circuit board, comprising: preparing a composite sheet in which a glass plate is bonded to an insulating material; forming a seed layer on the composite sheet; forming a plating resist having an opening for circuit formation on the seed layer; forming a plating layer in the opening by a plating process; and removing the plating resist. ### Claim 11 (depends on 10) The method for a printed circuit board as set forth in claim 10, wherein the preparing of the composite sheet includes: disposing the glass plate on one surface or both surfaces of the insulating material; and bonding the insulating material to the glass plate by a heating process and a pressing process. ### Claim 12 (depends on 10) The method for a printed circuit board as set forth in claim 10, wherein the preparing of the composite sheet includes: disposing the insulating material on one surface or both surfaces of the glass plate; and bonding the insulating material to the glass plate by a heating process and a pressing process. ### Claim 13 (depends on 10) The method for a printed circuit board as set forth in claim 10, wherein the forming of the seed layer is performed by a sputtering method. ### Claim 14 (depends on 10) The method for a printed circuit board as set forth in claim 10, wherein the forming of the seed layer includes: forming a first seed layer on a surface of the composite sheet; and forming a second seed layer on the first seed layer. ### Claim 15 (depends on 10) The method for a printed circuit board as set forth in claim 10, further comprising: prior to the forming of the seed layer, machining a via hole penetrating through the composite sheet. ### Claim 16 (depends on 15) The method for a printed circuit board as set forth in claim 15, wherein the machining of the via hole is performed using a laser drill. ### Claim 17 (depends on 15) The method for a printed circuit board as set forth in claim 15, further comprising: after the machining of the via hole, cleaning the surface of the composite sheet and an inside of the via hole. ### Claim 18 (depends on 17) The method for a printed circuit board as set forth in claim 17, wherein the cleaning is performed by dry etching or wet etching.