# US 2014/0151093 A1 · Carrier tape for tab-package and manufacturing method thereof > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0151093 A1 - Document ID: US20140151093A1 - Status: Published application - Kind: A1 - Application number: 14/175,137 - Filed: 2014-02-07 - Published: 2014-06-05 - Earliest claimed: 2010-10-01 - Assignees: LG Innotek Co., Ltd. - Applicants: LG Innotek Co., Ltd. - Inventors: Tae Ki HONG; Jun Young LIM; Ki Tae PARK; Sang Ki CHO; Dae Sung YOO; Han Mo KOO - Web page: https://patentgrep.com/patent/US20140151093A1 ## CPC - H05K 1/028: {Bending or folding regions of flexible printed circuits (H05K1/0283 takes precedence)} - H10W 70/688: {Flexible insulating substrates} - H10W 72/077: {Connecting of TAB connectors} - H10W 72/701: {Tape-automated bond [TAB] connectors} - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract The present invention relates to a method for manufacturing a TAB tap. The method includes forming a circuit pattern region having input/output terminal pattern on a base film, and forming an exposing region at a convey region having a sprocket hole for exposing the base film. Accordingly, the present invention provides a TAB tape that improves reliability of a product by fundamentally preventing the generation of metal particles by forming exposing regions that expose a base film through selectively etching and removing a metal layer of a convey region formed at both side of a TAB tape and having a sprocket hole, and that prevents short-circuit by partially removing a base film at a predetermined region not having a circuit pattern formed thereon through etching. ## Claims ### Claim 1 A tape comprising: a base film; a circuit region including a circuit pattern on the base film; and a convey region including sprocket holes of an outer side of the circuit region; and wherein the convey region further comprises a metal pattern separated from the sprocket holes. ### Claim 2 (depends on 1) The tape of claim 1, wherein the metal pattern is disposed in the convey region which is further than the sprocket holes from the circuit region. ### Claim 3 (depends on 1) The tape of claim 1, wherein the metal pattern is disposed in the convey region which is closer than the sprocket holes from the circuit region. ### Claim 4 (depends on 1) The tape of claim 1, wherein the metal pattern has a line-like shape. ### Claim 5 (depends on 1) The tape of claim 1, wherein the metal pattern is formed to extend in the convey region. ### Claim 6 (depends on 1) The tape of claim 1, wherein the metal pattern forms an opening. ### Claim 7 (depends on 6) The tape of claim 6, wherein the opening of the metal pattern is larger than an opening of the sprocket holes. ### Claim 8 (depends on 1) The tape of claim 1, wherein the metal pattern surrounds a part of the sprocket holes. ### Claim 9 A tape comprising; a base film; a circuit region including a circuit pattern on the base film; and a convey region including sprocket holes of an outer side of the circuit region and a metal pattern in a line type. ### Claim 10 (depends on 9) The tape of claim 9, wherein the number of the metal pattern in the line type is at least two. ### Claim 11 (depends on 9) The tape of claim 9, wherein the metal pattern is formed to extend along a length direction of the tape. ### Claim 12 A tape comprising: a base film; a circuit region including a circuit pattern on the base film; and a convey region including sprocket holes of an outer side of the circuit region and a metal pattern surrounding a part of the sprocket holes. ### Claim 13 A tape comprising: a base film; a circuit region including a circuit pattern on the base film; and a convey region including a plurality of sprocket holes of an outer side of the circuit region and a metal pattern for connecting adjacent sprocket holes to each other. ### Claim 14 A tape comprising: a base film; a circuit region including a circuit pattern on the base film; and a convey region including a plurality of sprocket holes of an outer side of the circuit region and an exposing part to which the base film is exposed, wherein a thickness of the base film on which the circuit pattern is formed is different from that of the base film on which the exposing part is formed. ### Claim 15 (depends on 14) The tape of claim 14, wherein a thickness of the base film on which the circuit pattern is formed is thicker than that of the base film on which the exposing part is formed. ### Claim 16 (depends on 14) The tape of claim 14, wherein the convey region has a structure in which an entire surface of the base film is exposed to remaining regions except for a region in which the sprocket holes are formed. ### Claim 17 (depends on 14) The tape of claim 14, further comprising a metal pattern in the convey region. ### Claim 18 (depends on 14) The tape of claim 14, wherein the convey region is configured such that a thickness of the base film on which the metal pattern is present is different from that of a part to which a surface of the base film is exposed. ### Claim 19 (depends on 18) The tape of claim 18, wherein a thickness of the base film on which the metal pattern is present is thicker than that of a part to which a surface of the base film is exposed. ### Claim 20 (depends on 17) The tape of claim 17, wherein a thickness of the base film on which the metal pattern of the convey region is present is different from that of a part to which a surface of the base film is exposed. ### Claim 21 (depends on 20) The tape of claim 20, wherein a thickness of the base film on which the metal pattern of the convey region is present is thicker than that of a part to which a surface of the base film is exposed. ### Claim 22 (depends on 1) The tape of claim 1, wherein the circuit pattern includes any one of Cu, Ni, Pd, Au, Sn, Ag, and Co, or a binary alloy and a ternary alloy thereof. ### Claim 23 (depends on 1) The tape of claim 1, wherein the circuit pattern and the metal pattern are made of the same material. ### Claim 24 (depends on 1) The tape of claim 1, wherein the circuit pattern and the metal pattern are made of different materials from each other. ### Claim 25 (depends on 1) The tape of claim 1, further comprising a seed layer between the base film and the circuit pattern. ### Claim 26 (depends on 1) The tape of claim 1, further comprising a seed layer between the base film and the metal pattern. ### Claim 27 (depends on 1) The tape of claim 1, further comprising a seed layer between the base film and the circuit pattern or between the base film and the metal pattern, wherein the seed layer includes one element selected from among Cu, Ni, Cr, Mo, W, Si, Pd, Ti, V, Fe, Co, Mn, Zn, Sn, and Ta, a mixture of at least two elements selected from among them, or an alloy thereof.