# US 2014/0151092 A1 · Pcb with visible circuit and method for making and using pcb with visible circuit > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0151092 A1 - Document ID: US20140151092A1 - Status: Published application - Kind: A1 - Application number: 14/085,654 - Filed: 2013-11-20 - Published: 2014-06-05 - Earliest claimed: 2012-11-30 - Assignees: Zhen Ding Technology Co., Ltd.; Fukui Precision Component (Shenzhen) Co., Ltd. - Applicants: Zhen Ding Technology Co., Ltd.; FuKui Precision Component (Shenzhen) Co., Ltd. - Inventors: MING-JAAN HO; XIAN-QIN HU - Web page: https://patentgrep.com/patent/US20140151092A1 ## CPC - H05K 1/0274: {Optical details, e.g. printed circuits comprising integral optical means (H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42)} - H05K 3/0058: {Laminating printed circuit boards onto other substrates, e.g. metallic substrates (H05K1/0281 takes precedence)} - H05K 2201/0108: Transparent - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A printed circuit board (PCB) with visible circuit includes a circuited substrate, a first and second release films, and a first and second optical clear adhesive (OCA) layers. The first and second release films are pressed onto and are adhered to two opposite surfaces of the circuited substrate via the first and second OCA layers respectively, and the first and second OCA layers are made of polymethyl methacrylate (PMMA). ## Claims ### Claim 1 A printed circuit board (PCB) with visible circuit, comprising: a circuited substrate; and a first and second optical clear adhesive (OCA) layers deposited on two opposite surface of the circuited substrate wherein the first and second OCA layers are made of polymethyl methacrylate (PMMA). ### Claim 2 (depends on 1) The PCB with visible circuit of claim 1, wherein the circuited substrate comprises a clear substrate, a first adhesive layer, a circuit layer, and a cover film, the circuit layer is adhered to the clear substrate using the first adhesive layer, and the cover film is pressed onto and adhered onto the circuit layer and is opposite to the first adhesive layer. ### Claim 3 (depends on 2) The PCB with visible circuit of claim 2, wherein the clear substrate is made of polyethylene terephthalate (PET). ### Claim 4 (depends on 2) The PCB with visible circuit of claim 2, wherein the first adhesive layer is made of OCA. ### Claim 5 (depends on 2) The PCB with visible circuit of claim 2, wherein the circuit layer comprises a conductive main layer, a first black oxide layer, and a second black oxide layer, and the first black oxide layer and the second black oxide layer are formed on two opposite surfaces of the conductive main layer. ### Claim 6 (depends on 2) The PCB with visible circuit of claim 2, wherein the cover film comprises a second adhesive layer and a dielectric layer, the dielectric layer is adhered to the circuit layer using the second adhesive layer. ### Claim 7 (depends on 6) The PCB with visible circuit of claim 6, wherein the second adhesive layer is made of OCA. ### Claim 8 (depends on 6) The PCB with visible circuit of claim 6, wherein the dielectric layer is made of PET. ### Claim 9 (depends on 1) The PCB with visible circuit of claim 1, wherein a thickness of the first OCA layer and the second OCA layer falls in a range from about 60 um to 90 um. ### Claim 10 (depends on 1) The PCB with visible circuit of claim 1, wherein light transmittance of the first OCA layer and the second OCA layer is greater than about 90%. ### Claim 11 (depends on 1) The PCB with visible circuit of claim 1, wherein a turbidity of the first OCA layer and the second OCA layer is less than about 1%. ### Claim 12 (depends on 1) The PCB with visible circuit of claim 1, further comprising a first release film and a second release film adhered to the opposite surface of the circuited substrate via the first OCA layer and second OCA layer respectively. ### Claim 13 (depends on 12) The PCB with visible circuit of claim 12, wherein the first release film and the second release are made of PET. ### Claim 14 (depends on 12) The PCB with visible circuit of claim 12, wherein a thickness of the first release film and the second release film falls in a range from about 30 um to about 50 um. ### Claim 15 (depends on 12) The PCB with visible circuit of claim 12, wherein the first OCA layer and the first adhesive film are integrated into an adhesive tape, the second OCA layer and the second adhesive film are integrated into an adhesive tape, and the OCA layer and the second OCA layer are made of optical pressure sensitive adhesive. ### Claim 16 A method for making and using a PCB with visible circuit, the method comprising: providing a circuited substrate; providing two adhesive tapes, each of which comprises a release film and a layer of optical pressure sensitive adhesive applying on the release film; pasting the two adhesive tapes onto two opposite surfaces of the circuited substrate using the layer of optical pressure sensitive adhesive which is mainly comprised of PMMA; pressing the adhesive tapes and tearing off the release films to cause the layers of optical pressure sensitive adhesive entirely remaining on the circuited substrate; providing two electronic modules; and adhering the electronic modules to the circuited substrate via the layers of optical pressure sensitive adhesive.